CH484515A - Steuerbares Halbleiterbauelement - Google Patents

Steuerbares Halbleiterbauelement

Info

Publication number
CH484515A
CH484515A CH53869A CH53869A CH484515A CH 484515 A CH484515 A CH 484515A CH 53869 A CH53869 A CH 53869A CH 53869 A CH53869 A CH 53869A CH 484515 A CH484515 A CH 484515A
Authority
CH
Switzerland
Prior art keywords
semiconductor component
controllable semiconductor
controllable
component
semiconductor
Prior art date
Application number
CH53869A
Other languages
German (de)
English (en)
Inventor
Rambeau Harry
Fritz Dipl Ing Kirschner
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19681639402 external-priority patent/DE1639402C3/de
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH484515A publication Critical patent/CH484515A/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301Thyristor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/926Elongated lead extending axially through another elongated lead

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thyristors (AREA)
  • Die Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
CH53869A 1968-02-08 1969-01-16 Steuerbares Halbleiterbauelement CH484515A (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19681639402 DE1639402C3 (da) 1968-02-08 1968-02-08
DE1968S0114041 DE1639402B2 (de) 1968-02-08 1968-02-08 Steuerbares halbleiterbauelement

Publications (1)

Publication Number Publication Date
CH484515A true CH484515A (de) 1970-01-15

Family

ID=25754003

Family Applications (1)

Application Number Title Priority Date Filing Date
CH53869A CH484515A (de) 1968-02-08 1969-01-16 Steuerbares Halbleiterbauelement

Country Status (5)

Country Link
US (1) US3559004A (da)
BE (1) BE727717A (da)
CH (1) CH484515A (da)
DE (1) DE1639402B2 (da)
FR (1) FR2001524A1 (da)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3869703A (en) * 1970-03-16 1975-03-04 Philips Corp Semiconductor device having an improved supply lead support
US3708722A (en) * 1970-12-18 1973-01-02 Erie Technological Prod Inc Semiconductor device with soldered terminals and plastic housing and method of making the same
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber
JPS62269322A (ja) * 1986-05-17 1987-11-21 Toshiba Corp 電力用半導体装置
US6040625A (en) * 1997-09-25 2000-03-21 I/O Sensors, Inc. Sensor package arrangement

Also Published As

Publication number Publication date
BE727717A (da) 1969-07-01
FR2001524A1 (da) 1969-09-26
DE1639402A1 (de) 1970-02-26
DE1639402B2 (de) 1976-12-16
US3559004A (en) 1971-01-26

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Legal Events

Date Code Title Description
PL Patent ceased