CH409149A - In ein Gehäuse eingeschlossene Halbleiteranordnung - Google Patents

In ein Gehäuse eingeschlossene Halbleiteranordnung

Info

Publication number
CH409149A
CH409149A CH491062A CH491062A CH409149A CH 409149 A CH409149 A CH 409149A CH 491062 A CH491062 A CH 491062A CH 491062 A CH491062 A CH 491062A CH 409149 A CH409149 A CH 409149A
Authority
CH
Switzerland
Prior art keywords
housing
semiconductor device
device enclosed
enclosed
semiconductor
Prior art date
Application number
CH491062A
Other languages
English (en)
Inventor
Emeis Reimer Dr Dipl-Phys
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH409149A publication Critical patent/CH409149A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
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    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01015—Phosphorus [P]
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    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
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    • H01L2924/01024—Chromium [Cr]
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    • H01L2924/01027—Cobalt [Co]
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    • H01L2924/01039—Yttrium [Y]
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    • H01L2924/01042—Molybdenum [Mo]
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    • H01L2924/01052—Tellurium [Te]
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    • H01L2924/01068—Erbium [Er]
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    • H01L2924/01074—Tungsten [W]
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    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
CH491062A 1961-07-12 1962-04-24 In ein Gehäuse eingeschlossene Halbleiteranordnung CH409149A (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES74774A DE1263190B (de) 1961-07-12 1961-07-12 Halbleiteranordnung mit einem in ein Gehaeuse eingeschlossenen Halbleiterkoerper
DES0076864 1961-11-28

Publications (1)

Publication Number Publication Date
CH409149A true CH409149A (de) 1966-03-15

Family

ID=25996516

Family Applications (1)

Application Number Title Priority Date Filing Date
CH491062A CH409149A (de) 1961-07-12 1962-04-24 In ein Gehäuse eingeschlossene Halbleiteranordnung

Country Status (6)

Country Link
US (2) US3280384A (de)
BE (2) BE625268A (de)
CH (1) CH409149A (de)
DE (1) DE1263190B (de)
GB (2) GB970895A (de)
NL (2) NL278357A (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3378735A (en) * 1963-06-12 1968-04-16 Siemens Ag Semiconductor device housing with spring contact means and improved thermal characteristics
DE1270184B (de) * 1964-08-26 1968-06-12 Siemens Ag Halbleiterbauelement
DE1279240B (de) * 1964-10-17 1968-10-03 Siemens Ag Folienzwischenlage fuer elektrische Druckkontakt-Verbindungen
DE1279200B (de) * 1964-10-31 1968-10-03 Siemens Ag Halbleiterbauelement
US3377525A (en) * 1965-12-03 1968-04-09 Gen Electric Electrically insulated mounting bracket for encased semicon-ductor device
US3414775A (en) * 1967-03-03 1968-12-03 Ibm Heat dissipating module assembly and method
US3673478A (en) * 1969-10-31 1972-06-27 Hitachi Ltd A semiconductor pellet fitted on a metal body
GB1337283A (en) * 1969-12-26 1973-11-14 Hitachi Ltd Method of manufacturing a semiconductor device
US4686499A (en) * 1984-09-28 1987-08-11 Cincinnati Microwave, Inc. Police radar warning receiver with cantilevered PC board structure
DE102005047566C5 (de) * 2005-10-05 2011-06-09 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Leistungshalbleiterbauelement und mit einem Gehäuse sowie Herstellungsverfahren hierzu
CN100410007C (zh) * 2006-01-26 2008-08-13 宜兴市科兴合金材料有限公司 钼坯压延法制钼圆片工艺
CN106734490A (zh) * 2017-01-17 2017-05-31 宜兴市科兴合金材料有限公司 一种用于钼圆片的压延机

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL193055A (de) * 1954-01-14 1900-01-01
BE536185A (de) * 1954-03-05 1900-01-01
DE1039648B (de) * 1955-04-30 1958-09-25 Siemens Ag Flaechengleichrichter bzw. -transistor
US2863105A (en) * 1955-11-10 1958-12-02 Hoffman Electronics Corp Rectifying device
US2956214A (en) * 1955-11-30 1960-10-11 Bogue Elec Mfg Co Diode
AT203550B (de) * 1957-03-01 1959-05-25 Western Electric Co Halbleitereinrichtung und Verfahren zu deren Herstellung
NL241492A (de) * 1958-07-21
US3059157A (en) * 1958-11-14 1962-10-16 Texas Instruments Inc Semiconductor rectifier
US3125709A (en) * 1960-10-17 1964-03-17 Housing assembly
US3188536A (en) * 1960-11-14 1965-06-08 Gen Motors Corp Silicon rectifier encapsulation
DE1248811B (de) * 1961-03-28
BE637603A (de) * 1962-09-21

Also Published As

Publication number Publication date
GB970895A (en) 1964-09-23
DE1263190B (de) 1968-03-14
NL135880C (de) 1900-01-01
US3280384A (en) 1966-10-18
US3280387A (en) 1966-10-18
NL278357A (de) 1900-01-01
BE625268A (de) 1900-01-01
BE620067A (de) 1900-01-01
GB970896A (en) 1964-09-23

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