CH408221A - In ein Gehäuse eingebaute Halbleiteranordnung - Google Patents

In ein Gehäuse eingebaute Halbleiteranordnung

Info

Publication number
CH408221A
CH408221A CH10264A CH10264A CH408221A CH 408221 A CH408221 A CH 408221A CH 10264 A CH10264 A CH 10264A CH 10264 A CH10264 A CH 10264A CH 408221 A CH408221 A CH 408221A
Authority
CH
Switzerland
Prior art keywords
housing
semiconductor device
device built
built
semiconductor
Prior art date
Application number
CH10264A
Other languages
English (en)
Inventor
Faskerty Gabor
Haussmann Peter
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH408221A publication Critical patent/CH408221A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
CH10264A 1963-04-08 1964-01-07 In ein Gehäuse eingebaute Halbleiteranordnung CH408221A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0084603 1963-04-08

Publications (1)

Publication Number Publication Date
CH408221A true CH408221A (de) 1966-02-28

Family

ID=7511810

Family Applications (1)

Application Number Title Priority Date Filing Date
CH10264A CH408221A (de) 1963-04-08 1964-01-07 In ein Gehäuse eingebaute Halbleiteranordnung

Country Status (4)

Country Link
CH (1) CH408221A (de)
DE (1) DE1439230A1 (de)
GB (1) GB1037335A (de)
NL (1) NL6403410A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2246013A (en) * 1990-07-04 1992-01-15 Savawatt "cooling solid state switches"

Also Published As

Publication number Publication date
NL6403410A (de) 1964-10-09
DE1439230A1 (de) 1969-02-13
GB1037335A (en) 1966-07-27

Similar Documents

Publication Publication Date Title
CH470085A (de) Halbleitervorrichtung
AT263084B (de) Halbleitervorrichtung
CH393548A (de) In ein Gehäuse eingeschlossene Halbleiteranordnung
AT264589B (de) Halbleiteranordnung
AT269217B (de) Halbleitervorrichtung
CH409149A (de) In ein Gehäuse eingeschlossene Halbleiteranordnung
CH416842A (de) In ein Gehäuse eingeschlossenes Halbleiter-Bauelement
CH408635A (fr) Boîtier
CH437539A (de) Halbleiteranordnung
CH437425A (de) Speichervorrichtung
AT260960B (de) Schaltschritteinrichtung
CH438497A (de) Halbleiteranordnung
CH399602A (de) In ein Gehäuse eingeschlossenes Halbleiter-Bauelement
ES339180A0 (es) Un dispositivo semiconductor.
AT273227B (de) Halbleitervorrichtung
AT254987B (de) Halbleiteranordnung
CH443492A (de) Halbleiteranordnung
AT244299B (de) Karteigerät
CH427043A (de) Halbleitervorrichtung
CH404546A (it) Dispositivo meccanico di immagazzinamento
CH419261A (de) Akkumulatorgehäuse
CH399601A (de) Halbleiteranordnung
CH444913A (de) Elektronisches Speicherelement
FR1435777A (fr) élément semiconducteur enfermé dans un boîtier
CH449779A (de) Leistungs-Halbleiteranordnung