CH376188A - Halbleiteranordnung - Google Patents
HalbleiteranordnungInfo
- Publication number
- CH376188A CH376188A CH36160A CH36160A CH376188A CH 376188 A CH376188 A CH 376188A CH 36160 A CH36160 A CH 36160A CH 36160 A CH36160 A CH 36160A CH 376188 A CH376188 A CH 376188A
- Authority
- CH
- Switzerland
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07336—Soldering or alloying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEB51886A DE1205626B (de) | 1959-01-28 | 1959-01-28 | Halbleiteranordnung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH376188A true CH376188A (de) | 1964-03-31 |
Family
ID=6969700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH36160A CH376188A (de) | 1959-01-28 | 1960-01-14 | Halbleiteranordnung |
Country Status (4)
| Country | Link |
|---|---|
| CH (1) | CH376188A (de) |
| DE (1) | DE1205626B (de) |
| FR (1) | FR1244077A (de) |
| GB (1) | GB886451A (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1242758B (de) * | 1961-04-07 | 1967-06-22 | Siemens Ag | Halbleiteranordnung, insbesondere fuer grosse Leistungen, bei der ein duenner, scheibenfoermiger Halbleiterkoerper auf einer Traegerplatte befestigt ist |
| CN104485297B (zh) * | 2014-12-18 | 2017-04-05 | 中国空间技术研究院 | Pill封装光敏器件测试转换夹具 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1094755A (de) * | 1955-01-20 | 1955-05-24 | ||
| BE558969A (de) * | 1956-07-04 |
-
1959
- 1959-01-28 DE DEB51886A patent/DE1205626B/de active Pending
- 1959-12-29 FR FR814370A patent/FR1244077A/fr not_active Expired
-
1960
- 1960-01-14 CH CH36160A patent/CH376188A/de unknown
- 1960-01-25 GB GB2564/60A patent/GB886451A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB886451A (en) | 1962-01-10 |
| DE1205626B (de) | 1965-11-25 |
| FR1244077A (fr) | 1960-10-21 |
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