CH393548A - In ein Gehäuse eingeschlossene Halbleiteranordnung - Google Patents

In ein Gehäuse eingeschlossene Halbleiteranordnung

Info

Publication number
CH393548A
CH393548A CH717262A CH717262A CH393548A CH 393548 A CH393548 A CH 393548A CH 717262 A CH717262 A CH 717262A CH 717262 A CH717262 A CH 717262A CH 393548 A CH393548 A CH 393548A
Authority
CH
Switzerland
Prior art keywords
housing
semiconductor device
device enclosed
enclosed
semiconductor
Prior art date
Application number
CH717262A
Other languages
German (de)
English (en)
Inventor
Rosenheinrich Rene
Kursawe Helga
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH393548A publication Critical patent/CH393548A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01084—Polonium [Po]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/926—Elongated lead extending axially through another elongated lead

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Fuses (AREA)
CH717262A 1961-10-24 1962-06-14 In ein Gehäuse eingeschlossene Halbleiteranordnung CH393548A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES76393A DE1241536B (de) 1961-10-24 1961-10-24 In ein Gehaeuse eingeschlossene Halbleiteranordnung

Publications (1)

Publication Number Publication Date
CH393548A true CH393548A (de) 1965-06-15

Family

ID=7506095

Family Applications (1)

Application Number Title Priority Date Filing Date
CH717262A CH393548A (de) 1961-10-24 1962-06-14 In ein Gehäuse eingeschlossene Halbleiteranordnung

Country Status (5)

Country Link
US (1) US3192454A (en, 2012)
BE (1) BE623873A (en, 2012)
CH (1) CH393548A (en, 2012)
DE (1) DE1241536B (en, 2012)
GB (1) GB1009544A (en, 2012)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE629939A (en, 2012) * 1962-03-24
GB1054422A (en, 2012) * 1963-03-16 1900-01-01
US3378735A (en) * 1963-06-12 1968-04-16 Siemens Ag Semiconductor device housing with spring contact means and improved thermal characteristics
US3320496A (en) * 1963-11-26 1967-05-16 Int Rectifier Corp High voltage semiconductor device
US3293508A (en) * 1964-04-21 1966-12-20 Int Rectifier Corp Compression connected semiconductor device
BE672186A (en, 2012) * 1964-11-12
DE1489791A1 (de) * 1964-12-22 1969-06-12 Ckd Praha Narodni Podnik Halbleiterbauelement mit einer Flaechenhalbleiteranordnung zwischen durch Federdruck angepressten Elektrodenkontaktplatten
US3354330A (en) * 1965-10-29 1967-11-21 Oerlikon Engineering Company Dynamo-electric machine carrying radially mounted rectifiers
US3450962A (en) * 1966-02-01 1969-06-17 Westinghouse Electric Corp Pressure electrical contact assembly for a semiconductor device
US3458776A (en) * 1966-02-28 1969-07-29 Westinghouse Electric Corp Cushioning thrust washer for application of uniform pressure to semiconductor irregular structures
US3463976A (en) * 1966-03-21 1969-08-26 Westinghouse Electric Corp Electrical contact assembly for compression bonded electrical devices
GB1191887A (en) * 1966-09-02 1970-05-13 Gen Electric Semiconductor Rectifier Assemblies
US3441814A (en) * 1967-03-30 1969-04-29 Westinghouse Electric Corp Interlocking multiple electrical contact structure for compression bonded power semiconductor devices
US3513361A (en) * 1968-05-09 1970-05-19 Westinghouse Electric Corp Flat package electrical device
US3599057A (en) * 1969-02-03 1971-08-10 Gen Electric Semiconductor device with a resilient lead construction
DE2029135C3 (de) * 1969-06-12 1983-02-24 CKD Praha O.P., Praha Anordnung zur elektrischen Isolation in einem Halbleiterbauelement
US4063348A (en) * 1975-02-27 1977-12-20 The Bendix Corporation Unique packaging method for use on large semiconductor devices
US4068368A (en) * 1975-10-14 1978-01-17 The Bendix Corporation Closure for semiconductor device and method of construction
JPS5921062A (ja) * 1982-07-26 1984-02-02 Mitsubishi Electric Corp サイリスタ
EP2071621A1 (en) * 2007-12-11 2009-06-17 ABB Research Ltd. Semiconductor switching device with gate connection
CN103890941B (zh) * 2011-10-21 2016-10-26 Abb技术有限公司 功率半导体模块和具有多个功率半导体模块的功率半导体模块组件

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL93941C (en, 2012) * 1955-03-24 1959-11-16
US2956214A (en) * 1955-11-30 1960-10-11 Bogue Elec Mfg Co Diode
US2930948A (en) * 1956-03-09 1960-03-29 Sarkes Tarzian Semiconductor device
NL215646A (en, 2012) * 1956-03-22
GB853876A (en) * 1956-08-15 1960-11-09 Sarkes Tarzian Semiconductor diode
DE1067132B (en, 2012) * 1958-08-23 1959-10-15

Also Published As

Publication number Publication date
US3192454A (en) 1965-06-29
GB1009544A (en) 1965-11-10
DE1241536B (de) 1967-06-01
BE623873A (en, 2012) 1900-01-01

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