CA951024A - Packaging structure having cooling means for a multiplicity of hermetic modules for integrated circuit chips - Google Patents

Packaging structure having cooling means for a multiplicity of hermetic modules for integrated circuit chips

Info

Publication number
CA951024A
CA951024A CA143,898,A CA143898A CA951024A CA 951024 A CA951024 A CA 951024A CA 143898 A CA143898 A CA 143898A CA 951024 A CA951024 A CA 951024A
Authority
CA
Canada
Prior art keywords
multiplicity
integrated circuit
cooling means
packaging structure
circuit chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA143,898,A
Other languages
English (en)
Other versions
CA143898S (en
Inventor
Lothar Laermer
Robert J. Schenk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Singer Co
Original Assignee
Singer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singer Co filed Critical Singer Co
Application granted granted Critical
Publication of CA951024A publication Critical patent/CA951024A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/18—Construction of rack or frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CA143,898,A 1971-08-20 1972-06-05 Packaging structure having cooling means for a multiplicity of hermetic modules for integrated circuit chips Expired CA951024A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17336771A 1971-08-20 1971-08-20

Publications (1)

Publication Number Publication Date
CA951024A true CA951024A (en) 1974-07-09

Family

ID=22631689

Family Applications (1)

Application Number Title Priority Date Filing Date
CA143,898,A Expired CA951024A (en) 1971-08-20 1972-06-05 Packaging structure having cooling means for a multiplicity of hermetic modules for integrated circuit chips

Country Status (9)

Country Link
US (1) US3706010A (ja)
JP (2) JPS4831456A (ja)
CA (1) CA951024A (ja)
DE (1) DE2240822A1 (ja)
FR (1) FR2150303B1 (ja)
GB (1) GB1366000A (ja)
IL (1) IL39630A (ja)
IT (1) IT963694B (ja)
SE (1) SE384427B (ja)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2337694C2 (de) 1973-07-25 1984-10-25 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichteranordnung hoher Strombelastbarkeit
US3999105A (en) * 1974-04-19 1976-12-21 International Business Machines Corporation Liquid encapsulated integrated circuit package
US4006388A (en) * 1975-03-03 1977-02-01 Hughes Aircraft Company Thermally controlled electronic system package
JPS5276946U (ja) * 1975-12-05 1977-06-08
JPS5271625A (en) * 1975-12-10 1977-06-15 Semikron Gleichrichterbau Semiconductor rectifier device
US4326214A (en) * 1976-11-01 1982-04-20 National Semiconductor Corporation Thermal shock resistant package having an ultraviolet light transmitting window for a semiconductor chip
JPS5591145A (en) * 1978-12-28 1980-07-10 Narumi China Corp Production of ceramic package
US4254446A (en) * 1979-08-30 1981-03-03 Peoples Ric L Modular, hybrid integrated circuit assembly
US4484215A (en) * 1981-05-18 1984-11-20 Burroughs Corporation Flexible mounting support for wafer scale integrated circuits
US4503483A (en) * 1982-05-03 1985-03-05 Hughes Aircraft Company Heat pipe cooling module for high power circuit boards
JPS58158705U (ja) * 1983-03-12 1983-10-22 株式会社神崎高級工機製作所 農用トラクタにおける前輪位置変更装置
US4499523A (en) * 1983-03-30 1985-02-12 International Business Machines Corporation Electronic component assembly with a printed circuit board unit and cover
US4549407A (en) * 1984-04-06 1985-10-29 International Business Machines Corporation Evaporative cooling
EP0172485B1 (de) * 1984-08-08 1989-01-11 Siemens Aktiengesellschaft Gemeinsames Gehäuse für zwei Halbleiterkörper
US4682268A (en) * 1985-02-07 1987-07-21 Nec Corporation Mounting structure for electronic circuit modules
FR2579060B1 (fr) * 1985-03-18 1987-04-17 Socapex Carte de circuit imprime a echangeur thermique et procede de fabrication d'une telle carte
US4774630A (en) * 1985-09-30 1988-09-27 Microelectronics Center Of North Carolina Apparatus for mounting a semiconductor chip and making electrical connections thereto
DE3536963A1 (de) * 1985-10-17 1987-04-23 Diehl Gmbh & Co Baugruppenanordnung
US4805420A (en) * 1987-06-22 1989-02-21 Ncr Corporation Cryogenic vessel for cooling electronic components
DE3818428C2 (de) * 1987-11-27 1993-11-04 Asea Brown Boveri Kuehldose zum abfuehren der verlustwaerme von halbleiterelementen
US5099254A (en) * 1990-03-22 1992-03-24 Raytheon Company Modular transmitter and antenna array system
US5210440A (en) * 1991-06-03 1993-05-11 Vlsi Technology, Inc. Semiconductor chip cooling apparatus
DE4244721A1 (de) * 1992-05-25 1994-04-21 Mannesmann Ag Elektrische Maschine mit fluidgekühlten Halbleiterelementen
DE4327895A1 (de) * 1993-08-19 1995-02-23 Abb Management Ag Stromrichtermodul
US6188575B1 (en) 1998-06-30 2001-02-13 Intersil Corporation Heat exchanging chassis and method
US8289039B2 (en) * 2009-03-11 2012-10-16 Teradyne, Inc. Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3495132A (en) * 1967-08-03 1970-02-10 Itt Packaging and actuating system for printed circuit boards and electrical connector assemblies

Also Published As

Publication number Publication date
GB1366000A (en) 1974-09-04
FR2150303B1 (ja) 1976-08-13
US3706010A (en) 1972-12-12
JPS544361U (ja) 1979-01-12
SE384427B (sv) 1976-05-03
IT963694B (it) 1974-01-21
DE2240822A1 (de) 1973-03-15
JPS4831456A (ja) 1973-04-25
FR2150303A1 (ja) 1973-04-06
IL39630A (en) 1975-08-31
IL39630A0 (en) 1972-08-30

Similar Documents

Publication Publication Date Title
CA951024A (en) Packaging structure having cooling means for a multiplicity of hermetic modules for integrated circuit chips
CA961812A (en) Package for fragile articles
CA1017071A (en) Plastic power semiconductor flip chip package
CA994921A (en) Integrated circuit package
CA981806A (en) Power semiconductor device package
CA966576A (en) Modular circuit package
CA961352A (en) Integrated circuit chip repair tool
AU472546B2 (en) Integrated circuit package connectors
ZA728262B (en) Cooling component for a stack of semiconductor components
CA1026873A (en) Method of mounting semiconductor chips
CA961173A (en) Semiconductor device package
CA1021066A (en) Semiconductor chip interconnect package
CA999384A (en) Beam lead semiconductor package
CA994818A (en) Mullite package for integrated circuit devices
CA971677A (en) Carrier for integrated circuit packages
CA974356A (en) Machine for continuous manufacturing of chip boards
CA970079A (en) Method of soldering a semiconductor plate
AU502556B2 (en) Heat-recoverable replaceable watch-glass for encapsulating semiconductor chips
CA1032276A (en) Package for semiconductor beam lead devices
AU459637B2 (en) Semiconductor circuit
CA911615A (en) Semiconductor hybrid power module package
CA898420A (en) Diaphragm-connected leadless package for semiconductor devices
CA908868A (en) Mounting device for semi-conductor chips
CA941075A (en) Cooling scheme for a high-current semiconductor device
CA905019A (en) Production of semiconductor chips