CA948705A - Method for making an integrated circuit apparatus - Google Patents

Method for making an integrated circuit apparatus

Info

Publication number
CA948705A
CA948705A CA148,232A CA148232A CA948705A CA 948705 A CA948705 A CA 948705A CA 148232 A CA148232 A CA 148232A CA 948705 A CA948705 A CA 948705A
Authority
CA
Canada
Prior art keywords
making
integrated circuit
circuit apparatus
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA148,232A
Other languages
English (en)
Inventor
Robert C. Cook
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centre de Recherche Industrielle du Quebec CRIQ
Original Assignee
Centre de Recherche Industrielle du Quebec CRIQ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre de Recherche Industrielle du Quebec CRIQ filed Critical Centre de Recherche Industrielle du Quebec CRIQ
Priority to CA148,232A priority Critical patent/CA948705A/en
Priority to US00285496A priority patent/US3810301A/en
Priority to IN1660/CAL/1973A priority patent/IN137750B/en
Priority to AU58112/73A priority patent/AU5811273A/en
Priority to NL7310280A priority patent/NL7310280A/
Priority to BE133891A priority patent/BE802822A/xx
Priority to DD172543A priority patent/DD105688A5/xx
Priority to IT83407/73A priority patent/IT997484B/it
Priority to FR7327679A priority patent/FR2195070A1/fr
Priority to GB3599973A priority patent/GB1436004A/en
Priority to ES417338A priority patent/ES417338A1/es
Priority to JP48084219A priority patent/JPS506294A/ja
Priority to BR5732/73A priority patent/BR7305732D0/pt
Priority to DE19732338251 priority patent/DE2338251A1/de
Priority to IL42844A priority patent/IL42844A/en
Application granted granted Critical
Publication of CA948705A publication Critical patent/CA948705A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/006Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation at wafer scale level, i.e. wafer scale integration [WSI]
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/18Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
    • G11C29/26Accessing multiple arrays
    • G11C29/28Dependent multiple arrays, e.g. multi-bit arrays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49004Electrical device making including measuring or testing of device or component part

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
CA148,232A 1972-07-28 1972-07-28 Method for making an integrated circuit apparatus Expired CA948705A (en)

Priority Applications (15)

Application Number Priority Date Filing Date Title
CA148,232A CA948705A (en) 1972-07-28 1972-07-28 Method for making an integrated circuit apparatus
US00285496A US3810301A (en) 1972-07-28 1972-08-31 Method for making an integrated circuit apparatus
IN1660/CAL/1973A IN137750B (it) 1972-07-28 1973-07-16
AU58112/73A AU5811273A (en) 1972-07-28 1973-07-16 Making an integrated circuit apparatus
NL7310280A NL7310280A (it) 1972-07-28 1973-07-24
DD172543A DD105688A5 (it) 1972-07-28 1973-07-26
BE133891A BE802822A (fr) 1972-07-28 1973-07-26 Methode de production d'un dispositif a circuits integres
IT83407/73A IT997484B (it) 1972-07-28 1973-07-26 Metodo per costruire apparati a circuiti integrati
FR7327679A FR2195070A1 (it) 1972-07-28 1973-07-27
GB3599973A GB1436004A (en) 1972-07-28 1973-07-27 Method for making an integrated circuit apparatus
ES417338A ES417338A1 (es) 1972-07-28 1973-07-27 Metodo para fabricar aparatos a base de circuitos integra- dos.
JP48084219A JPS506294A (it) 1972-07-28 1973-07-27
BR5732/73A BR7305732D0 (pt) 1972-07-28 1973-07-27 Processo para a fabricacao de aparelho de circuitos integrados
DE19732338251 DE2338251A1 (de) 1972-07-28 1973-07-27 Verfahren zur herstellung von schaltkreisanordnungen aus integrierten schaltkreisen
IL42844A IL42844A (en) 1972-07-28 1973-07-29 Method for making an integrated circuit apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA148,232A CA948705A (en) 1972-07-28 1972-07-28 Method for making an integrated circuit apparatus

Publications (1)

Publication Number Publication Date
CA948705A true CA948705A (en) 1974-06-04

Family

ID=4093989

Family Applications (1)

Application Number Title Priority Date Filing Date
CA148,232A Expired CA948705A (en) 1972-07-28 1972-07-28 Method for making an integrated circuit apparatus

Country Status (15)

Country Link
US (1) US3810301A (it)
JP (1) JPS506294A (it)
AU (1) AU5811273A (it)
BE (1) BE802822A (it)
BR (1) BR7305732D0 (it)
CA (1) CA948705A (it)
DD (1) DD105688A5 (it)
DE (1) DE2338251A1 (it)
ES (1) ES417338A1 (it)
FR (1) FR2195070A1 (it)
GB (1) GB1436004A (it)
IL (1) IL42844A (it)
IN (1) IN137750B (it)
IT (1) IT997484B (it)
NL (1) NL7310280A (it)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038648A (en) * 1974-06-03 1977-07-26 Chesley Gilman D Self-configurable circuit structure for achieving wafer scale integration
JPS5528160B2 (it) * 1974-12-16 1980-07-25
US3969670A (en) * 1975-06-30 1976-07-13 International Business Machines Corporation Electron beam testing of integrated circuits
US4007452A (en) * 1975-07-28 1977-02-08 Intel Corporation Wafer scale integration system
US4081898A (en) * 1976-04-19 1978-04-04 Texas Instruments Incorporated Method of manufacturing an electronic calculator utilizing a flexible carrier
US4118858A (en) * 1976-04-19 1978-10-10 Texas Instruments Incorporated Method of making an electronic calculator
JPS5735342A (en) * 1980-08-13 1982-02-25 Hitachi Ltd Manufacturing method of large scale integrated circuit
DE3122984A1 (de) * 1981-06-10 1983-01-27 Siemens AG, 1000 Berlin und 8000 München Verfahren zur kennzeichnung von halbleiterchips und kennzeichenbarer helbleiterchip
US4601019B1 (en) * 1983-08-31 1997-09-30 Texas Instruments Inc Memory with redundancy
US4703436A (en) * 1984-02-01 1987-10-27 Inova Microelectronics Corporation Wafer level integration technique
JPH084110B2 (ja) * 1985-03-30 1996-01-17 株式会社日立製作所 半導体装置及びその製造方法
US4719411A (en) * 1985-05-13 1988-01-12 California Institute Of Technology Addressable test matrix for measuring analog transfer characteristics of test elements used for integrated process control and device evaluation
EP0240864A3 (en) * 1986-04-03 1989-05-24 Hewlett-Packard Company High-yield semiconductor memory devices
US4816422A (en) * 1986-12-29 1989-03-28 General Electric Company Fabrication of large power semiconductor composite by wafer interconnection of individual devices
US4855253A (en) * 1988-01-29 1989-08-08 Hewlett-Packard Test method for random defects in electronic microstructures
EP0541288B1 (en) * 1991-11-05 1998-07-08 Fu-Chieh Hsu Circuit module redundacy architecture
US5498990A (en) * 1991-11-05 1996-03-12 Monolithic System Technology, Inc. Reduced CMOS-swing clamping circuit for bus lines
US5831467A (en) * 1991-11-05 1998-11-03 Monolithic System Technology, Inc. Termination circuit with power-down mode for use in circuit module architecture
AU4798793A (en) 1992-08-10 1994-03-03 Monolithic System Technology, Inc. Fault-tolerant, high-speed bus system and bus interface for wafer-scale integration
US6246247B1 (en) 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6624648B2 (en) * 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US6483328B1 (en) * 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
US6428641B1 (en) * 1998-08-31 2002-08-06 Amkor Technology, Inc. Method for laminating circuit pattern tape on semiconductor wafer
US6479887B1 (en) 1998-08-31 2002-11-12 Amkor Technology, Inc. Circuit pattern tape for wafer-scale production of chip size semiconductor packages
JP3055104B2 (ja) * 1998-08-31 2000-06-26 亜南半導体株式会社 半導体パッケ―ジの製造方法
US6738307B2 (en) * 2002-05-13 2004-05-18 Hewlett-Packard Development Company, L.P. Address structure and methods for multiple arrays of data storage memory
KR100761755B1 (ko) * 2005-02-28 2007-09-28 삼성전자주식회사 입출력 비트구조를 조절할 수 있는 반도체 메모리 장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3423822A (en) * 1967-02-27 1969-01-28 Northern Electric Co Method of making large scale integrated circuit
US3715735A (en) * 1970-12-14 1973-02-06 Monolithic Memories Inc Segmentized memory module and method of making same

Also Published As

Publication number Publication date
DE2338251A1 (de) 1974-02-07
US3810301A (en) 1974-05-14
JPS506294A (it) 1975-01-22
AU5811273A (en) 1975-01-16
GB1436004A (en) 1976-05-19
DD105688A5 (it) 1974-05-05
FR2195070A1 (it) 1974-03-01
BE802822A (fr) 1973-11-16
IT997484B (it) 1975-12-30
NL7310280A (it) 1974-01-30
IL42844A (en) 1976-09-30
BR7305732D0 (pt) 1974-08-29
IN137750B (it) 1975-09-13
ES417338A1 (es) 1976-03-01
IL42844A0 (en) 1973-10-25

Similar Documents

Publication Publication Date Title
CA948705A (en) Method for making an integrated circuit apparatus
CA1013492A (en) Method for making polyetherimides
CA982886A (en) Development apparatus
CA990483A (en) Electrical lead making apparatus
CA999638A (en) Electronic flash apparatus
CA1003052A (en) Method and apparatus for electrical discharge machining
CA989316A (en) Circuit arrangement for sound-reproducing apparatus
CA972433A (en) Electrical inductive apparatus
CA984684A (en) Soldering method and apparatus
CA980653A (en) Method and apparatus for making cigarettes
YU36315B (en) Apparatus for practising resucitation
CA913470A (en) Apparatus for desoldering components of an integrated circuit
CA892845A (en) Method and apparatus for manufacturing integrated circuits
CA908752A (en) Soldering apparatus
CA901157A (en) Electronic apparatus
CA890894A (en) Method for etching copper
AU483956B2 (en) Method of making an integrated circuit device
CA909302A (en) Circuit interrupting apparatus
AU5317373A (en) Practice apparatus for ballgames
CA908508A (en) Soldering apparatus
CA906104A (en) Method for making semiconductor devices
CA895010A (en) Monitor circuit apparatus
AU7192274A (en) Method of making an integrated circuit device
CA895011A (en) Apparatus for checking operation of power-producing components
CA902804A (en) Method of making semiconductor device components