CA3026157A1 - Electrical contact arrangement for microfabricated ultrasonic transducer - Google Patents

Electrical contact arrangement for microfabricated ultrasonic transducer Download PDF

Info

Publication number
CA3026157A1
CA3026157A1 CA3026157A CA3026157A CA3026157A1 CA 3026157 A1 CA3026157 A1 CA 3026157A1 CA 3026157 A CA3026157 A CA 3026157A CA 3026157 A CA3026157 A CA 3026157A CA 3026157 A1 CA3026157 A1 CA 3026157A1
Authority
CA
Canada
Prior art keywords
substrate
transducer
connections
ultrasonic transducer
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA3026157A
Other languages
English (en)
French (fr)
Inventor
Jonathan M. Rothberg
Susan A. Alie
Jaime Scott Zahorian
Paul Francis Cristman
Keith G. Fife
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Butterfly Network Inc
Original Assignee
Butterfly Network Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Butterfly Network Inc filed Critical Butterfly Network Inc
Publication of CA3026157A1 publication Critical patent/CA3026157A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/20—Application to multi-element transducer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
CA3026157A 2016-06-20 2017-06-19 Electrical contact arrangement for microfabricated ultrasonic transducer Abandoned CA3026157A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662352394P 2016-06-20 2016-06-20
US62/352,394 2016-06-20
PCT/US2017/038105 WO2017222969A1 (en) 2016-06-20 2017-06-19 Electrical contact arrangement for microfabricated ultrasonic transducer

Publications (1)

Publication Number Publication Date
CA3026157A1 true CA3026157A1 (en) 2017-12-28

Family

ID=60659817

Family Applications (1)

Application Number Title Priority Date Filing Date
CA3026157A Abandoned CA3026157A1 (en) 2016-06-20 2017-06-19 Electrical contact arrangement for microfabricated ultrasonic transducer

Country Status (9)

Country Link
US (3) US10497856B2 (enExample)
EP (1) EP3471897B1 (enExample)
JP (1) JP7026111B2 (enExample)
KR (1) KR20190022644A (enExample)
CN (2) CN109414727B (enExample)
AU (1) AU2017281280B2 (enExample)
CA (1) CA3026157A1 (enExample)
TW (1) TWI721183B (enExample)
WO (1) WO2017222969A1 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2017281280B2 (en) 2016-06-20 2022-01-06 Butterfly Network, Inc. Electrical contact arrangement for microfabricated ultrasonic transducer
US10676349B1 (en) 2016-08-12 2020-06-09 Sitime Corporation MEMS resonator
US11515465B2 (en) * 2018-02-26 2022-11-29 Invensense, Inc. EMI reduction in piezoelectric micromachined ultrasound transducer array
TW202000137A (zh) 2018-05-03 2020-01-01 美商蝴蝶網路公司 互補式金屬氧化物半導體感測器上超音波換能器的壓力口
KR102637666B1 (ko) * 2018-05-14 2024-02-16 엑소 이미징, 인크. 열압착 본딩, 공융 본딩, 및 솔더 본딩을 사용하는 마이크로머신 pMUT 어레이들 및 전자기기들을 위한 통합 기법들
TW202011897A (zh) * 2018-07-06 2020-04-01 美商蝴蝶網路公司 用於封裝超音波晶片的方法和設備
US11087582B2 (en) * 2018-10-19 2021-08-10 Igt Electronic gaming machine providing enhanced physical player interaction
US11498096B2 (en) 2018-11-06 2022-11-15 Siemens Medical Solutions Usa, Inc. Chip-on-array with interposer for a multidimensional transducer array
KR20210125476A (ko) 2018-12-07 2021-10-18 옥탄트, 인크. 단백질-단백질 상호작용 스크리닝을 위한 시스템
TW202045099A (zh) 2019-02-07 2020-12-16 美商蝴蝶網路公司 用於微加工超音波傳感器裝置的雙層金屬電極
WO2020251915A1 (en) 2019-06-10 2020-12-17 Butterfly Network, Inc. Curved micromachined ultrasonic transducer membranes
US11292715B2 (en) * 2019-06-27 2022-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive bond structure to increase membrane sensitivity in MEMS device
US11684951B2 (en) * 2019-08-08 2023-06-27 Bfly Operations, Inc. Micromachined ultrasonic transducer devices having truncated circle shaped cavities
US11145547B2 (en) * 2019-10-01 2021-10-12 Qorvo Us, Inc. Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same
US12673346B2 (en) * 2019-11-12 2026-07-07 Siemens Medical Solutions Usa, Inc. Interposer for an ultrasound transducer array
US11440051B2 (en) 2020-02-26 2022-09-13 General Electric Company Capacitive micromachined ultrasonic transducer (CMUT) devices and methods of manufacturing
IT202000004777A1 (it) 2020-03-06 2021-09-06 St Microelectronics Srl Trasduttore ultrasonico microlavorato piezoelettrico
EP3909692A1 (en) * 2020-05-14 2021-11-17 Koninklijke Philips N.V. An ultrasound transducer and a tiled array of ultrasound transducers
EP3909691A1 (en) * 2020-05-14 2021-11-17 Koninklijke Philips N.V. An ultrasound transducer and a tiled array of ultrasound transducers
FR3110834B1 (fr) * 2020-05-28 2022-04-22 Moduleus Dispositif d'imagerie ultrasonore à adressage ligne-colonne
CN111884647B (zh) * 2020-08-13 2023-09-29 中国工程物理研究院电子工程研究所 一种压电微机械声波换能器阵列耦合隔离方法
US12156762B2 (en) 2021-04-01 2024-12-03 Bfly Operations, Inc. Apparatuses and methods for configuring ultrasound devices
GB2614239A (en) * 2021-12-17 2023-07-05 Darkvision Tech Inc Ultrasound interconnect stack and method of manufacturing same
US12465948B2 (en) * 2023-02-09 2025-11-11 Stmicroelectronics International N.V. PMUT array with presence of separate sensing small PZT on membranes edge
TWI835661B (zh) * 2023-05-29 2024-03-11 友達光電股份有限公司 換能器及其製造方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6262946B1 (en) 1999-09-29 2001-07-17 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer arrays with reduced cross-coupling
US6430109B1 (en) 1999-09-30 2002-08-06 The Board Of Trustees Of The Leland Stanford Junior University Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections
US6551248B2 (en) * 2001-07-31 2003-04-22 Koninklijke Philips Electronics N.V. System for attaching an acoustic element to an integrated circuit
US6958255B2 (en) 2002-08-08 2005-10-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducers and method of fabrication
US7321181B2 (en) 2004-04-07 2008-01-22 The Board Of Trustees Of The Leland Stanford Junior University Capacitive membrane ultrasonic transducers with reduced bulk wave generation and method
TW200704283A (en) * 2005-05-27 2007-01-16 Lamina Ceramics Inc Solid state LED bridge rectifier light engine
US7615834B2 (en) 2006-02-28 2009-11-10 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane
US7910385B2 (en) 2006-05-12 2011-03-22 Micron Technology, Inc. Method of fabricating microelectronic devices
US20080315331A1 (en) * 2007-06-25 2008-12-25 Robert Gideon Wodnicki Ultrasound system with through via interconnect structure
JP5511260B2 (ja) * 2009-08-19 2014-06-04 キヤノン株式会社 容量型電気機械変換装置、及びその感度調整方法
KR101593994B1 (ko) * 2009-09-04 2016-02-16 삼성전자주식회사 고출력 초음파 트랜스듀서
US8345508B2 (en) 2009-09-20 2013-01-01 General Electric Company Large area modular sensor array assembly and method for making the same
JP5404335B2 (ja) * 2009-11-17 2014-01-29 キヤノン株式会社 電気機械変換装置及びその作製方法
US8922021B2 (en) * 2011-12-30 2014-12-30 Deca Technologies Inc. Die up fully molded fan-out wafer level packaging
JP5603739B2 (ja) 2010-11-02 2014-10-08 キヤノン株式会社 静電容量型電気機械変換装置
US8659148B2 (en) * 2010-11-30 2014-02-25 General Electric Company Tileable sensor array
JP5961246B2 (ja) 2011-03-22 2016-08-02 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 基板に対して抑制された音響結合を持つ超音波ｃｍｕｔ
CN103635264B (zh) * 2011-06-27 2016-06-01 皇家飞利浦有限公司 超声换能组件及其制造方法
KR101894393B1 (ko) 2011-12-28 2018-09-04 삼성전자주식회사 초음파 변환기 구조물, 초음파 변환기 및 초음파 변환기의 제조 방법
KR101851568B1 (ko) * 2012-08-29 2018-04-24 삼성전자주식회사 초음파 변환기 및 그 제조방법
KR20140033992A (ko) * 2012-09-11 2014-03-19 삼성전자주식회사 초음파 변환기
US9368438B2 (en) 2012-12-28 2016-06-14 Taiwan Semiconductor Manufacturing Company, Ltd. Package on package (PoP) bonding structures
WO2014123922A1 (en) 2013-02-05 2014-08-14 Butterfly Network, Inc. Cmos ultrasonic transducers and related apparatus and methods
EP2969914B1 (en) 2013-03-15 2020-01-01 Butterfly Network Inc. Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same
KR102176584B1 (ko) * 2013-11-20 2020-11-09 삼성전자주식회사 정전용량 미세가공 초음파 변환기 및 그 제조방법
KR20150065067A (ko) 2013-12-04 2015-06-12 삼성전자주식회사 정전용량 미세가공 초음파 변환기 및 그 제조방법
US9630832B2 (en) 2013-12-19 2017-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method of manufacturing
TWI661534B (zh) * 2014-04-18 2019-06-01 美商蝴蝶網路公司 在互補式金屬氧化物半導體晶圓中的超音波轉換器及相關設備和方法
US9067779B1 (en) * 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US20160009544A1 (en) 2015-03-02 2016-01-14 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US11213855B2 (en) * 2015-08-11 2022-01-04 Koninklijke Philips N.V. Capacitive micromachined ultrasonic transducers with increased patient safety
AU2017281280B2 (en) 2016-06-20 2022-01-06 Butterfly Network, Inc. Electrical contact arrangement for microfabricated ultrasonic transducer
US20180180724A1 (en) * 2016-12-26 2018-06-28 Nxp Usa, Inc. Ultrasonic transducer integrated with supporting electronics
US10242967B2 (en) * 2017-05-16 2019-03-26 Raytheon Company Die encapsulation in oxide bonded wafer stack
EP3642611B1 (en) * 2017-06-21 2024-02-14 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
KR20210125476A (ko) * 2018-12-07 2021-10-18 옥탄트, 인크. 단백질-단백질 상호작용 스크리닝을 위한 시스템

Also Published As

Publication number Publication date
WO2017222969A1 (en) 2017-12-28
EP3471897B1 (en) 2023-08-02
US12701918B2 (en) 2026-08-04
EP3471897C0 (en) 2023-08-02
TWI721183B (zh) 2021-03-11
CN109414727B (zh) 2021-09-28
TW201808786A (zh) 2018-03-16
JP7026111B2 (ja) 2022-02-25
CN113857023A (zh) 2021-12-31
US11672179B2 (en) 2023-06-06
EP3471897A4 (en) 2020-01-15
US20240122073A1 (en) 2024-04-11
US20200066966A1 (en) 2020-02-27
KR20190022644A (ko) 2019-03-06
CN109414727A (zh) 2019-03-01
US10497856B2 (en) 2019-12-03
AU2017281280B2 (en) 2022-01-06
US20170365774A1 (en) 2017-12-21
AU2017281280A1 (en) 2018-12-06
JP2019522449A (ja) 2019-08-08
EP3471897A1 (en) 2019-04-24
CN113857023B (zh) 2022-08-02

Similar Documents

Publication Publication Date Title
US20240122073A1 (en) Electrical contact arrangement for microfabricated ultrasonic transducer
US11559827B2 (en) Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
US11426143B2 (en) Vertical packaging for ultrasound-on-a-chip and related methods
JP5734878B2 (ja) 低温ウエハ接合によって作製されるモノリシック集積型ｃｍｕｔの作製方法
US7880565B2 (en) Micro-electro-mechanical transducer having a surface plate
US10093534B2 (en) Capacitive micromachined ultrasonic transducer and method of fabricating the same
US9596528B2 (en) Capacitive micromachined ultrasonic transducer and method of fabricating the same
Zhang et al. Fabrication of capacitive micromachined ultrasonic transducers with through-glass-via interconnects

Legal Events

Date Code Title Description
FZDE Discontinued

Effective date: 20230920