KR20190022644A - 미세제작된 초음파 트랜스듀서를 위한 전기 접촉부 배열 - Google Patents

미세제작된 초음파 트랜스듀서를 위한 전기 접촉부 배열 Download PDF

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Publication number
KR20190022644A
KR20190022644A KR1020197001497A KR20197001497A KR20190022644A KR 20190022644 A KR20190022644 A KR 20190022644A KR 1020197001497 A KR1020197001497 A KR 1020197001497A KR 20197001497 A KR20197001497 A KR 20197001497A KR 20190022644 A KR20190022644 A KR 20190022644A
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KR
South Korea
Prior art keywords
substrate
transducer
ultrasonic
ultrasonic transducer
connections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020197001497A
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English (en)
Korean (ko)
Inventor
조나단 엠. 로스버그
수잔 에이. 에일리
제이미 스콧 자호리안
폴 프란시스 크리스트맨
키스 지. 파이프
Original Assignee
버터플라이 네트워크, 인크.
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Publication of KR20190022644A publication Critical patent/KR20190022644A/ko
Ceased legal-status Critical Current

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    • H01L41/047—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • H01L41/09—
    • H01L41/27—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/20—Application to multi-element transducer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
KR1020197001497A 2016-06-20 2017-06-19 미세제작된 초음파 트랜스듀서를 위한 전기 접촉부 배열 Ceased KR20190022644A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662352394P 2016-06-20 2016-06-20
US62/352,394 2016-06-20
PCT/US2017/038105 WO2017222969A1 (en) 2016-06-20 2017-06-19 Electrical contact arrangement for microfabricated ultrasonic transducer

Publications (1)

Publication Number Publication Date
KR20190022644A true KR20190022644A (ko) 2019-03-06

Family

ID=60659817

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197001497A Ceased KR20190022644A (ko) 2016-06-20 2017-06-19 미세제작된 초음파 트랜스듀서를 위한 전기 접촉부 배열

Country Status (9)

Country Link
US (3) US10497856B2 (enExample)
EP (1) EP3471897B1 (enExample)
JP (1) JP7026111B2 (enExample)
KR (1) KR20190022644A (enExample)
CN (2) CN109414727B (enExample)
AU (1) AU2017281280B2 (enExample)
CA (1) CA3026157A1 (enExample)
TW (1) TWI721183B (enExample)
WO (1) WO2017222969A1 (enExample)

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KR102637666B1 (ko) * 2018-05-14 2024-02-16 엑소 이미징, 인크. 열압착 본딩, 공융 본딩, 및 솔더 본딩을 사용하는 마이크로머신 pMUT 어레이들 및 전자기기들을 위한 통합 기법들
JP2021529459A (ja) * 2018-07-06 2021-10-28 バタフライ ネットワーク，インコーポレイテッド 超音波オンチップをパッケージングする方法及び装置
US11087582B2 (en) * 2018-10-19 2021-08-10 Igt Electronic gaming machine providing enhanced physical player interaction
US11498096B2 (en) * 2018-11-06 2022-11-15 Siemens Medical Solutions Usa, Inc. Chip-on-array with interposer for a multidimensional transducer array
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WO2020251915A1 (en) 2019-06-10 2020-12-17 Butterfly Network, Inc. Curved micromachined ultrasonic transducer membranes
US11292715B2 (en) 2019-06-27 2022-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive bond structure to increase membrane sensitivity in MEMS device
US11684951B2 (en) * 2019-08-08 2023-06-27 Bfly Operations, Inc. Micromachined ultrasonic transducer devices having truncated circle shaped cavities
US11289377B2 (en) * 2019-10-01 2022-03-29 Qorvo Us, Inc. Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same
US20210138506A1 (en) * 2019-11-12 2021-05-13 Siemens Medical Solutions Usa, Inc. Interposer for an Ultrasound Transducer Array
US11440051B2 (en) 2020-02-26 2022-09-13 General Electric Company Capacitive micromachined ultrasonic transducer (CMUT) devices and methods of manufacturing
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EP3909692A1 (en) * 2020-05-14 2021-11-17 Koninklijke Philips N.V. An ultrasound transducer and a tiled array of ultrasound transducers
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FR3110834B1 (fr) * 2020-05-28 2022-04-22 Moduleus Dispositif d'imagerie ultrasonore à adressage ligne-colonne
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TWI835661B (zh) * 2023-05-29 2024-03-11 友達光電股份有限公司 換能器及其製造方法

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Also Published As

Publication number Publication date
AU2017281280A1 (en) 2018-12-06
US10497856B2 (en) 2019-12-03
US11672179B2 (en) 2023-06-06
US20170365774A1 (en) 2017-12-21
EP3471897A4 (en) 2020-01-15
CN113857023A (zh) 2021-12-31
JP7026111B2 (ja) 2022-02-25
AU2017281280B2 (en) 2022-01-06
CN109414727A (zh) 2019-03-01
US20200066966A1 (en) 2020-02-27
WO2017222969A1 (en) 2017-12-28
CA3026157A1 (en) 2017-12-28
EP3471897C0 (en) 2023-08-02
US20240122073A1 (en) 2024-04-11
TWI721183B (zh) 2021-03-11
CN109414727B (zh) 2021-09-28
JP2019522449A (ja) 2019-08-08
CN113857023B (zh) 2022-08-02
EP3471897B1 (en) 2023-08-02
TW201808786A (zh) 2018-03-16
EP3471897A1 (en) 2019-04-24

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