AU2017281280B2 - Electrical contact arrangement for microfabricated ultrasonic transducer - Google Patents

Electrical contact arrangement for microfabricated ultrasonic transducer Download PDF

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Publication number
AU2017281280B2
AU2017281280B2 AU2017281280A AU2017281280A AU2017281280B2 AU 2017281280 B2 AU2017281280 B2 AU 2017281280B2 AU 2017281280 A AU2017281280 A AU 2017281280A AU 2017281280 A AU2017281280 A AU 2017281280A AU 2017281280 B2 AU2017281280 B2 AU 2017281280B2
Authority
AU
Australia
Prior art keywords
substrate
ultrasonic transducer
connections
conductive bond
ultrasound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU2017281280A
Other languages
English (en)
Other versions
AU2017281280A1 (en
Inventor
Susan A. Alie
Paul Francis Cristman
Keith G. Fife
Jonathan M. Rothberg
Jaime Scott Zahorian
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Butterfly Network Inc
Original Assignee
Butterfly Network Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Butterfly Network Inc filed Critical Butterfly Network Inc
Publication of AU2017281280A1 publication Critical patent/AU2017281280A1/en
Application granted granted Critical
Publication of AU2017281280B2 publication Critical patent/AU2017281280B2/en
Ceased legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/20—Application to multi-element transducer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
AU2017281280A 2016-06-20 2017-06-19 Electrical contact arrangement for microfabricated ultrasonic transducer Ceased AU2017281280B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662352394P 2016-06-20 2016-06-20
US62/352,394 2016-06-20
PCT/US2017/038105 WO2017222969A1 (en) 2016-06-20 2017-06-19 Electrical contact arrangement for microfabricated ultrasonic transducer

Publications (2)

Publication Number Publication Date
AU2017281280A1 AU2017281280A1 (en) 2018-12-06
AU2017281280B2 true AU2017281280B2 (en) 2022-01-06

Family

ID=60659817

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2017281280A Ceased AU2017281280B2 (en) 2016-06-20 2017-06-19 Electrical contact arrangement for microfabricated ultrasonic transducer

Country Status (9)

Country Link
US (3) US10497856B2 (enExample)
EP (1) EP3471897B1 (enExample)
JP (1) JP7026111B2 (enExample)
KR (1) KR20190022644A (enExample)
CN (2) CN109414727B (enExample)
AU (1) AU2017281280B2 (enExample)
CA (1) CA3026157A1 (enExample)
TW (1) TWI721183B (enExample)
WO (1) WO2017222969A1 (enExample)

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KR102637666B1 (ko) * 2018-05-14 2024-02-16 엑소 이미징, 인크. 열압착 본딩, 공융 본딩, 및 솔더 본딩을 사용하는 마이크로머신 pMUT 어레이들 및 전자기기들을 위한 통합 기법들
JP2021529459A (ja) * 2018-07-06 2021-10-28 バタフライ ネットワーク，インコーポレイテッド 超音波オンチップをパッケージングする方法及び装置
US11087582B2 (en) * 2018-10-19 2021-08-10 Igt Electronic gaming machine providing enhanced physical player interaction
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US11289377B2 (en) * 2019-10-01 2022-03-29 Qorvo Us, Inc. Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same
US20210138506A1 (en) * 2019-11-12 2021-05-13 Siemens Medical Solutions Usa, Inc. Interposer for an Ultrasound Transducer Array
US11440051B2 (en) 2020-02-26 2022-09-13 General Electric Company Capacitive micromachined ultrasonic transducer (CMUT) devices and methods of manufacturing
IT202000004777A1 (it) * 2020-03-06 2021-09-06 St Microelectronics Srl Trasduttore ultrasonico microlavorato piezoelettrico
EP3909692A1 (en) * 2020-05-14 2021-11-17 Koninklijke Philips N.V. An ultrasound transducer and a tiled array of ultrasound transducers
EP3909691A1 (en) * 2020-05-14 2021-11-17 Koninklijke Philips N.V. An ultrasound transducer and a tiled array of ultrasound transducers
FR3110834B1 (fr) * 2020-05-28 2022-04-22 Moduleus Dispositif d'imagerie ultrasonore à adressage ligne-colonne
CN111884647B (zh) * 2020-08-13 2023-09-29 中国工程物理研究院电子工程研究所 一种压电微机械声波换能器阵列耦合隔离方法
US12156762B2 (en) 2021-04-01 2024-12-03 Bfly Operations, Inc. Apparatuses and methods for configuring ultrasound devices
US12465948B2 (en) * 2023-02-09 2025-11-11 Stmicroelectronics International N.V. PMUT array with presence of separate sensing small PZT on membranes edge
TWI835661B (zh) * 2023-05-29 2024-03-11 友達光電股份有限公司 換能器及其製造方法

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Also Published As

Publication number Publication date
AU2017281280A1 (en) 2018-12-06
US10497856B2 (en) 2019-12-03
US11672179B2 (en) 2023-06-06
US20170365774A1 (en) 2017-12-21
EP3471897A4 (en) 2020-01-15
CN113857023A (zh) 2021-12-31
JP7026111B2 (ja) 2022-02-25
CN109414727A (zh) 2019-03-01
US20200066966A1 (en) 2020-02-27
WO2017222969A1 (en) 2017-12-28
CA3026157A1 (en) 2017-12-28
EP3471897C0 (en) 2023-08-02
US20240122073A1 (en) 2024-04-11
KR20190022644A (ko) 2019-03-06
TWI721183B (zh) 2021-03-11
CN109414727B (zh) 2021-09-28
JP2019522449A (ja) 2019-08-08
CN113857023B (zh) 2022-08-02
EP3471897B1 (en) 2023-08-02
TW201808786A (zh) 2018-03-16
EP3471897A1 (en) 2019-04-24

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FGA Letters patent sealed or granted (standard patent)
MK14 Patent ceased section 143(a) (annual fees not paid) or expired