CA2873691C - Electro plating device - Google Patents

Electro plating device Download PDF

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Publication number
CA2873691C
CA2873691C CA2873691A CA2873691A CA2873691C CA 2873691 C CA2873691 C CA 2873691C CA 2873691 A CA2873691 A CA 2873691A CA 2873691 A CA2873691 A CA 2873691A CA 2873691 C CA2873691 C CA 2873691C
Authority
CA
Canada
Prior art keywords
pipe
plating solution
nozzles
pipe end
steel pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CA2873691A
Other languages
English (en)
French (fr)
Other versions
CA2873691A1 (en
Inventor
Masanari Kimoto
Kazuya Ishii
Tatsuya Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vallourec Oil and Gas France SAS
Nippon Steel Corp
Original Assignee
Vallourec Oil and Gas France SAS
Nippon Steel and Sumitomo Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vallourec Oil and Gas France SAS, Nippon Steel and Sumitomo Metal Corp filed Critical Vallourec Oil and Gas France SAS
Publication of CA2873691A1 publication Critical patent/CA2873691A1/en
Application granted granted Critical
Publication of CA2873691C publication Critical patent/CA2873691C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/04Tubes; Rings; Hollow bodies
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • C25D17/12Shape or form
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • C25D5/022Electroplating of selected surface areas using masking means
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08Electroplating with moving electrolyte e.g. jet electroplating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/605Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611Smooth layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coating Apparatus (AREA)
CA2873691A 2012-07-02 2013-06-24 Electro plating device Active CA2873691C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-148476 2012-07-02
JP2012148476 2012-07-02
PCT/JP2013/067194 WO2014007090A1 (ja) 2012-07-02 2013-06-24 電気めっき装置

Publications (2)

Publication Number Publication Date
CA2873691A1 CA2873691A1 (en) 2014-01-09
CA2873691C true CA2873691C (en) 2016-10-11

Family

ID=49881848

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2873691A Active CA2873691C (en) 2012-07-02 2013-06-24 Electro plating device

Country Status (15)

Country Link
US (1) US9790610B2 (ja)
EP (1) EP2868777B1 (ja)
JP (1) JP5699253B2 (ja)
CN (1) CN104379819B (ja)
AR (1) AR091612A1 (ja)
AU (1) AU2013284698B2 (ja)
BR (1) BR112014032167B8 (ja)
CA (1) CA2873691C (ja)
EA (1) EA027461B1 (ja)
IN (1) IN2014DN09788A (ja)
MX (1) MX353819B (ja)
MY (1) MY186849A (ja)
PL (1) PL2868777T3 (ja)
UA (1) UA110181C2 (ja)
WO (1) WO2014007090A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6177350B2 (ja) * 2013-12-13 2017-08-09 新日鐵住金株式会社 鋼管の電気めっき装置
US9610611B2 (en) 2014-02-12 2017-04-04 Baker Hughes Incorporated Method of lining an inner surface of a tubular and system for doing same
CN105256364A (zh) * 2015-11-30 2016-01-20 成都市天目电子设备有限公司 一种高效电镀设备
EP3425089B1 (en) * 2016-03-03 2022-05-25 Nippon Steel Corporation Electroplating apparatus
US11148327B2 (en) 2018-03-29 2021-10-19 Baker Hughes, A Ge Company, Llc Method for forming a mud motor stator
CN118326484B (zh) * 2024-06-17 2024-08-09 山东新申昊智能装备有限公司 一种大跨度无缝钢管耐腐蚀层电镀装置和电镀方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673073A (en) * 1970-10-07 1972-06-27 Automation Ind Inc Apparatus for electroplating the interior of an elongated pipe
US3956096A (en) * 1973-03-23 1976-05-11 Electro-Coatings, Inc. Apparatus for plating aircraft cylinders
CH581200A5 (ja) * 1974-04-27 1976-10-29 Bes Sa
JPS5948500U (ja) * 1982-09-17 1984-03-30 アジアオプチカル株式会社 スコ−プラチカル
JPS59166694A (ja) * 1983-03-10 1984-09-20 C Uyemura & Co Ltd 筒状ワ−クのめつき処理装置
JPS609893A (ja) 1983-06-29 1985-01-18 Sumitomo Metal Ind Ltd 長尺管の局部的自動めっき装置
JPS61133387A (ja) * 1984-11-30 1986-06-20 Tokuda Seisakusho Ltd エツチング装置
JPS61133397A (ja) * 1984-11-30 1986-06-20 Nippon Kokan Kk <Nkk> 管端のめつき装置
US5002649A (en) 1988-03-28 1991-03-26 Sifco Industries, Inc. Selective stripping apparatus
US5620575A (en) * 1993-12-27 1997-04-15 Honda Giken Kogyo Kabushiki Kaisha Composite plating apparatus and apparatus for dispersing air bubbles within a composite plating solution
JP4434948B2 (ja) * 2002-07-18 2010-03-17 株式会社荏原製作所 めっき装置及びめっき方法
US7875158B2 (en) * 2003-03-11 2011-01-25 Ebara Corporation Plating apparatus
KR101083491B1 (ko) * 2003-10-21 2011-11-16 이디이케이 리서치 에이쥐 금속의 표면 처리를 위한 일체식 전해질 공급부를 갖는전극 디바이스
US7867368B2 (en) * 2004-06-16 2011-01-11 Honda Motor Co., Ltd. Plating apparatus
JP4391894B2 (ja) 2004-06-16 2009-12-24 本田技研工業株式会社 メッキ装置
US20070221495A1 (en) * 2006-03-23 2007-09-27 Applied Materials, Inc. Electropolish assisted electrochemical mechanical polishing apparatus
WO2007142747A2 (en) * 2006-04-21 2007-12-13 Sifco Selective Plating Selective plating system
CN201309972Y (zh) * 2008-12-07 2009-09-16 曹新忠 电镀液加注器
US9205441B2 (en) * 2010-08-31 2015-12-08 Nippon Steel & Sumitomo Metal Corporation Coating apparatus for applying a UV curable resin to a threaded end of a steel pipe
JP2012082450A (ja) * 2010-10-07 2012-04-26 Teramikros Inc めっき装置およびめっき方法
CN102453934B (zh) * 2012-01-16 2017-09-19 广东保迪环保电镀设备有限公司 内孔局部电镀设备
JP6177350B2 (ja) * 2013-12-13 2017-08-09 新日鐵住金株式会社 鋼管の電気めっき装置

Also Published As

Publication number Publication date
US9790610B2 (en) 2017-10-17
AU2013284698A1 (en) 2014-12-04
UA110181C2 (uk) 2015-11-25
CN104379819A (zh) 2015-02-25
AU2013284698B2 (en) 2016-07-21
BR112014032167B8 (pt) 2021-12-07
MX353819B (es) 2018-01-31
EP2868777A4 (en) 2016-02-24
CN104379819B (zh) 2016-10-26
MY186849A (en) 2021-08-26
JP5699253B2 (ja) 2015-04-08
EP2868777A1 (en) 2015-05-06
WO2014007090A1 (ja) 2014-01-09
JPWO2014007090A1 (ja) 2016-06-02
CA2873691A1 (en) 2014-01-09
EP2868777B1 (en) 2016-10-05
AR091612A1 (es) 2015-02-18
EA027461B1 (ru) 2017-07-31
MX2014015994A (es) 2015-03-20
IN2014DN09788A (ja) 2015-07-31
EA201492225A1 (ru) 2015-05-29
BR112014032167B1 (pt) 2021-10-19
BR112014032167A2 (pt) 2017-06-27
US20150136590A1 (en) 2015-05-21
PL2868777T3 (pl) 2017-05-31

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Effective date: 20141113