IN2014DN09788A - - Google Patents

Info

Publication number
IN2014DN09788A
IN2014DN09788A IN9788DEN2014A IN2014DN09788A IN 2014DN09788 A IN2014DN09788 A IN 2014DN09788A IN 9788DEN2014 A IN9788DEN2014 A IN 9788DEN2014A IN 2014DN09788 A IN2014DN09788 A IN 2014DN09788A
Authority
IN
India
Prior art keywords
pipe
interior
nozzle
female screw
plating solution
Prior art date
Application number
Inventor
Masanari Kimoto
Kazuya Ishii
Tatsuya Yamamoto
Original Assignee
Nippon Steel & Sumitomo Metal Corp
Vallourec Oil & Gas France
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel & Sumitomo Metal Corp, Vallourec Oil & Gas France filed Critical Nippon Steel & Sumitomo Metal Corp
Publication of IN2014DN09788A publication Critical patent/IN2014DN09788A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coating Apparatus (AREA)

Abstract

This electroplating device is equipped with: a pipe interior sealing mechanism that closes off an internal flow path on the inside of a steel pipe in the axial direction of the pipe; a cylindrical insoluble anode arranged so as to face a female screw in the interior at an end of the pipe; a plating solution supply mechanism having multiple nozzles extending radially and centered on the axis of the steel pipe; and a pipe end sealing mechanism which is mounted at the end of the pipe and in the interior of which the multiple nozzles are housed. When viewed from the pipe axial direction the tip of each nozzle is located between the female screw and the insoluble anode. Each nozzle sprays the plating solution in a direction that intersects the direction of extension of the nozzle and that rotates to the right or the left around the center of the pipe axis.
IN9788DEN2014 2012-07-02 2014-11-19 IN2014DN09788A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012148476 2012-07-02
PCT/JP2013/067194 WO2014007090A1 (en) 2012-07-02 2013-06-24 Electroplating device

Publications (1)

Publication Number Publication Date
IN2014DN09788A true IN2014DN09788A (en) 2015-07-31

Family

ID=49881848

Family Applications (1)

Application Number Title Priority Date Filing Date
IN9788DEN2014 IN2014DN09788A (en) 2012-07-02 2014-11-19

Country Status (15)

Country Link
US (1) US9790610B2 (en)
EP (1) EP2868777B1 (en)
JP (1) JP5699253B2 (en)
CN (1) CN104379819B (en)
AR (1) AR091612A1 (en)
AU (1) AU2013284698B2 (en)
BR (1) BR112014032167B8 (en)
CA (1) CA2873691C (en)
EA (1) EA027461B1 (en)
IN (1) IN2014DN09788A (en)
MX (1) MX353819B (en)
MY (1) MY186849A (en)
PL (1) PL2868777T3 (en)
UA (1) UA110181C2 (en)
WO (1) WO2014007090A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3081674B1 (en) * 2013-12-13 2018-03-28 Nippon Steel & Sumitomo Metal Corporation Device for electroplating steel pipe
US9610611B2 (en) 2014-02-12 2017-04-04 Baker Hughes Incorporated Method of lining an inner surface of a tubular and system for doing same
CN105256364A (en) * 2015-11-30 2016-01-20 成都市天目电子设备有限公司 Efficient plating device
WO2017150666A1 (en) * 2016-03-03 2017-09-08 新日鐵住金株式会社 Electroplating apparatus
US11148327B2 (en) 2018-03-29 2021-10-19 Baker Hughes, A Ge Company, Llc Method for forming a mud motor stator

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673073A (en) * 1970-10-07 1972-06-27 Automation Ind Inc Apparatus for electroplating the interior of an elongated pipe
US3956096A (en) * 1973-03-23 1976-05-11 Electro-Coatings, Inc. Apparatus for plating aircraft cylinders
CH581200A5 (en) * 1974-04-27 1976-10-29 Bes Sa
JPS5948500U (en) * 1982-09-17 1984-03-30 アジアオプチカル株式会社 sco-practical
JPS59166694A (en) * 1983-03-10 1984-09-20 C Uyemura & Co Ltd Plating apparatus for tubular workpiece
JPS609893A (en) 1983-06-29 1985-01-18 Sumitomo Metal Ind Ltd Local automatic plating device
JPS61133397A (en) * 1984-11-30 1986-06-20 Nippon Kokan Kk <Nkk> Plating device for pipe end
JPS61133387A (en) * 1984-11-30 1986-06-20 Tokuda Seisakusho Ltd Etching device
US5002649A (en) * 1988-03-28 1991-03-26 Sifco Industries, Inc. Selective stripping apparatus
US5620575A (en) * 1993-12-27 1997-04-15 Honda Giken Kogyo Kabushiki Kaisha Composite plating apparatus and apparatus for dispersing air bubbles within a composite plating solution
CN100439571C (en) * 2002-07-18 2008-12-03 株式会社荏原制作所 Plating device
JP4805141B2 (en) 2003-03-11 2011-11-02 株式会社荏原製作所 Electroplating equipment
CN1860260B (en) * 2003-10-21 2011-05-04 Edk研究股份公司 Electrode device with integrated electrolyte supply for the surface treatment of metals
DE112005001372T5 (en) * 2004-06-16 2007-05-16 Honda Motor Co Ltd plating
JP4391894B2 (en) 2004-06-16 2009-12-24 本田技研工業株式会社 Plating equipment
US20070221495A1 (en) * 2006-03-23 2007-09-27 Applied Materials, Inc. Electropolish assisted electrochemical mechanical polishing apparatus
WO2007142747A2 (en) * 2006-04-21 2007-12-13 Sifco Selective Plating Selective plating system
CN201309972Y (en) * 2008-12-07 2009-09-16 曹新忠 Injector of electric plating solution
WO2012029967A1 (en) * 2010-08-31 2012-03-08 Sumitomo Metal Industries, Ltd. Coating apparatus for applying a uv curable resin to a threaded end of a steel pipe
JP2012082450A (en) * 2010-10-07 2012-04-26 Teramikros Inc Plating device and plating method
CN102453934B (en) * 2012-01-16 2017-09-19 广东保迪环保电镀设备有限公司 Endoporus selective plating device
EP3081674B1 (en) * 2013-12-13 2018-03-28 Nippon Steel & Sumitomo Metal Corporation Device for electroplating steel pipe

Also Published As

Publication number Publication date
AR091612A1 (en) 2015-02-18
BR112014032167A2 (en) 2017-06-27
CN104379819A (en) 2015-02-25
MY186849A (en) 2021-08-26
CN104379819B (en) 2016-10-26
EP2868777A1 (en) 2015-05-06
EP2868777A4 (en) 2016-02-24
CA2873691C (en) 2016-10-11
US20150136590A1 (en) 2015-05-21
UA110181C2 (en) 2015-11-25
EP2868777B1 (en) 2016-10-05
CA2873691A1 (en) 2014-01-09
JP5699253B2 (en) 2015-04-08
WO2014007090A1 (en) 2014-01-09
MX353819B (en) 2018-01-31
BR112014032167B1 (en) 2021-10-19
AU2013284698B2 (en) 2016-07-21
BR112014032167B8 (en) 2021-12-07
JPWO2014007090A1 (en) 2016-06-02
MX2014015994A (en) 2015-03-20
EA027461B1 (en) 2017-07-31
US9790610B2 (en) 2017-10-17
EA201492225A1 (en) 2015-05-29
AU2013284698A1 (en) 2014-12-04
PL2868777T3 (en) 2017-05-31

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