MX2014015994A - Dispositivo de electrodeposicion. - Google Patents

Dispositivo de electrodeposicion.

Info

Publication number
MX2014015994A
MX2014015994A MX2014015994A MX2014015994A MX2014015994A MX 2014015994 A MX2014015994 A MX 2014015994A MX 2014015994 A MX2014015994 A MX 2014015994A MX 2014015994 A MX2014015994 A MX 2014015994A MX 2014015994 A MX2014015994 A MX 2014015994A
Authority
MX
Mexico
Prior art keywords
pipe
interior
nozzle
female screw
plating solution
Prior art date
Application number
MX2014015994A
Other languages
English (en)
Other versions
MX353819B (es
Inventor
Kazuya Ishii
Masanari Kimoto
Tatsuya Yamamoto
Original Assignee
Nippon Steel & Sumitomo Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel & Sumitomo Metal Corp filed Critical Nippon Steel & Sumitomo Metal Corp
Publication of MX2014015994A publication Critical patent/MX2014015994A/es
Publication of MX353819B publication Critical patent/MX353819B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coating Apparatus (AREA)

Abstract

Este dispositivo de electrodeposición está equipado con: un mecanismo de sellado interior de tubería que cierra una la trayectoria de flujo interna en el interior de la tubería de acero en la dirección axial de una tubería; un ánodo insoluble cilíndrico dispuesto de manera que se orienta hacia una rosca hembra en el interior de un extremo de la tubería; un mecanismo de suministro de solución de deposición que tiene varias toberas que se extienden radialmente y se centran en el eje de la tubería de acero; y un mecanismo de sellado en la tubería extrema, la cual está montada en el extremo de la tubería y en el interior del cual se alojan varias toberas. Cuando se observa desde la dirección axial de la tubería, la punta de cada tobera se ubica entre la rosca hembra y el ánodo insoluble. Cada tobera rocía la solución de deposición en una dirección que intersecta la dirección de extensión de la tobera y que gira a la derecha o a la izquierda alrededor del centro del eje de tubería.
MX2014015994A 2012-07-02 2013-06-24 Dispositivo de electrodeposicion. MX353819B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012148476 2012-07-02
PCT/JP2013/067194 WO2014007090A1 (ja) 2012-07-02 2013-06-24 電気めっき装置

Publications (2)

Publication Number Publication Date
MX2014015994A true MX2014015994A (es) 2015-03-20
MX353819B MX353819B (es) 2018-01-31

Family

ID=49881848

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2014015994A MX353819B (es) 2012-07-02 2013-06-24 Dispositivo de electrodeposicion.

Country Status (15)

Country Link
US (1) US9790610B2 (es)
EP (1) EP2868777B1 (es)
JP (1) JP5699253B2 (es)
CN (1) CN104379819B (es)
AR (1) AR091612A1 (es)
AU (1) AU2013284698B2 (es)
BR (1) BR112014032167B8 (es)
CA (1) CA2873691C (es)
EA (1) EA027461B1 (es)
IN (1) IN2014DN09788A (es)
MX (1) MX353819B (es)
MY (1) MY186849A (es)
PL (1) PL2868777T3 (es)
UA (1) UA110181C2 (es)
WO (1) WO2014007090A1 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6177350B2 (ja) * 2013-12-13 2017-08-09 新日鐵住金株式会社 鋼管の電気めっき装置
US9610611B2 (en) 2014-02-12 2017-04-04 Baker Hughes Incorporated Method of lining an inner surface of a tubular and system for doing same
CN105256364A (zh) * 2015-11-30 2016-01-20 成都市天目电子设备有限公司 一种高效电镀设备
EP3425089B1 (en) * 2016-03-03 2022-05-25 Nippon Steel Corporation Electroplating apparatus
US11148327B2 (en) 2018-03-29 2021-10-19 Baker Hughes, A Ge Company, Llc Method for forming a mud motor stator
CN118326484B (zh) * 2024-06-17 2024-08-09 山东新申昊智能装备有限公司 一种大跨度无缝钢管耐腐蚀层电镀装置和电镀方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673073A (en) * 1970-10-07 1972-06-27 Automation Ind Inc Apparatus for electroplating the interior of an elongated pipe
US3956096A (en) * 1973-03-23 1976-05-11 Electro-Coatings, Inc. Apparatus for plating aircraft cylinders
CH581200A5 (es) * 1974-04-27 1976-10-29 Bes Sa
JPS5948500U (ja) * 1982-09-17 1984-03-30 アジアオプチカル株式会社 スコ−プラチカル
JPS59166694A (ja) * 1983-03-10 1984-09-20 C Uyemura & Co Ltd 筒状ワ−クのめつき処理装置
JPS609893A (ja) 1983-06-29 1985-01-18 Sumitomo Metal Ind Ltd 長尺管の局部的自動めっき装置
JPS61133387A (ja) * 1984-11-30 1986-06-20 Tokuda Seisakusho Ltd エツチング装置
JPS61133397A (ja) * 1984-11-30 1986-06-20 Nippon Kokan Kk <Nkk> 管端のめつき装置
US5002649A (en) 1988-03-28 1991-03-26 Sifco Industries, Inc. Selective stripping apparatus
US5620575A (en) * 1993-12-27 1997-04-15 Honda Giken Kogyo Kabushiki Kaisha Composite plating apparatus and apparatus for dispersing air bubbles within a composite plating solution
JP4434948B2 (ja) * 2002-07-18 2010-03-17 株式会社荏原製作所 めっき装置及びめっき方法
US7875158B2 (en) * 2003-03-11 2011-01-25 Ebara Corporation Plating apparatus
KR101083491B1 (ko) * 2003-10-21 2011-11-16 이디이케이 리서치 에이쥐 금속의 표면 처리를 위한 일체식 전해질 공급부를 갖는전극 디바이스
US7867368B2 (en) * 2004-06-16 2011-01-11 Honda Motor Co., Ltd. Plating apparatus
JP4391894B2 (ja) 2004-06-16 2009-12-24 本田技研工業株式会社 メッキ装置
US20070221495A1 (en) * 2006-03-23 2007-09-27 Applied Materials, Inc. Electropolish assisted electrochemical mechanical polishing apparatus
WO2007142747A2 (en) * 2006-04-21 2007-12-13 Sifco Selective Plating Selective plating system
CN201309972Y (zh) * 2008-12-07 2009-09-16 曹新忠 电镀液加注器
US9205441B2 (en) * 2010-08-31 2015-12-08 Nippon Steel & Sumitomo Metal Corporation Coating apparatus for applying a UV curable resin to a threaded end of a steel pipe
JP2012082450A (ja) * 2010-10-07 2012-04-26 Teramikros Inc めっき装置およびめっき方法
CN102453934B (zh) * 2012-01-16 2017-09-19 广东保迪环保电镀设备有限公司 内孔局部电镀设备
JP6177350B2 (ja) * 2013-12-13 2017-08-09 新日鐵住金株式会社 鋼管の電気めっき装置

Also Published As

Publication number Publication date
US9790610B2 (en) 2017-10-17
AU2013284698A1 (en) 2014-12-04
UA110181C2 (uk) 2015-11-25
CN104379819A (zh) 2015-02-25
AU2013284698B2 (en) 2016-07-21
BR112014032167B8 (pt) 2021-12-07
MX353819B (es) 2018-01-31
EP2868777A4 (en) 2016-02-24
CN104379819B (zh) 2016-10-26
MY186849A (en) 2021-08-26
JP5699253B2 (ja) 2015-04-08
EP2868777A1 (en) 2015-05-06
WO2014007090A1 (ja) 2014-01-09
JPWO2014007090A1 (ja) 2016-06-02
CA2873691A1 (en) 2014-01-09
EP2868777B1 (en) 2016-10-05
CA2873691C (en) 2016-10-11
AR091612A1 (es) 2015-02-18
EA027461B1 (ru) 2017-07-31
IN2014DN09788A (es) 2015-07-31
EA201492225A1 (ru) 2015-05-29
BR112014032167B1 (pt) 2021-10-19
BR112014032167A2 (pt) 2017-06-27
US20150136590A1 (en) 2015-05-21
PL2868777T3 (pl) 2017-05-31

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