CA2722942A1 - Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making - Google Patents
Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making Download PDFInfo
- Publication number
- CA2722942A1 CA2722942A1 CA2722942A CA2722942A CA2722942A1 CA 2722942 A1 CA2722942 A1 CA 2722942A1 CA 2722942 A CA2722942 A CA 2722942A CA 2722942 A CA2722942 A CA 2722942A CA 2722942 A1 CA2722942 A1 CA 2722942A1
- Authority
- CA
- Canada
- Prior art keywords
- layer
- dopant concentration
- raised region
- semiconductor material
- conductivity type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/80—FETs having rectifying junction gate electrodes
- H10D30/83—FETs having PN junction gate electrodes
- H10D30/831—Vertical FETs having PN junction gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/211—Gated diodes
- H10D12/212—Gated diodes having PN junction gates, e.g. field controlled diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/051—Manufacture or treatment of FETs having PN junction gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/202—FETs having static field-induced regions, e.g. static-induction transistors [SIT] or permeable base transistors [PBT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/213—Channel regions of field-effect devices
- H10D62/221—Channel regions of field-effect devices of FETs
- H10D62/328—Channel regions of field-effect devices of FETs having PN junction gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
Landscapes
- Junction Field-Effect Transistors (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/117,121 | 2008-05-08 | ||
| US12/117,121 US7977713B2 (en) | 2008-05-08 | 2008-05-08 | Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making |
| PCT/US2009/042983 WO2009137578A2 (en) | 2008-05-08 | 2009-05-06 | Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2722942A1 true CA2722942A1 (en) | 2009-11-12 |
Family
ID=41265372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2722942A Abandoned CA2722942A1 (en) | 2008-05-08 | 2009-05-06 | Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US7977713B2 (enExample) |
| EP (1) | EP2289103A4 (enExample) |
| JP (1) | JP5593308B2 (enExample) |
| KR (1) | KR20110018891A (enExample) |
| CN (1) | CN102084484B (enExample) |
| AU (1) | AU2009244273A1 (enExample) |
| CA (1) | CA2722942A1 (enExample) |
| TW (1) | TWI415258B (enExample) |
| WO (1) | WO2009137578A2 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8012539B2 (en) | 2008-05-09 | 2011-09-06 | Kraton Polymers U.S. Llc | Method for making sulfonated block copolymers, method for making membranes from such block copolymers and membrane structures |
| NZ592399A (en) | 2008-11-05 | 2013-12-20 | Power Integrations Inc | Vertical junction field effect transistors having sloped sidewalls and methods of making |
| US20110049532A1 (en) * | 2009-08-28 | 2011-03-03 | Microsemi Corporation | Silicon carbide dual-mesa static induction transistor |
| US8263713B2 (en) | 2009-10-13 | 2012-09-11 | Kraton Polymers U.S. Llc | Amine neutralized sulfonated block copolymers and method for making same |
| US8445631B2 (en) | 2009-10-13 | 2013-05-21 | Kraton Polymers U.S. Llc | Metal-neutralized sulfonated block copolymers, process for making them and their use |
| US8211784B2 (en) * | 2009-10-26 | 2012-07-03 | Advanced Ion Beam Technology, Inc. | Method for manufacturing a semiconductor device with less leakage current induced by carbon implant |
| KR20120091368A (ko) * | 2009-12-08 | 2012-08-17 | 에스에스 에스시 아이피, 엘엘시 | 주입된 측벽들을 가지는 반도체 장치들의 제조 방법 및 그에 의해 제조된 장치들 |
| TWI394278B (zh) * | 2009-12-29 | 2013-04-21 | Vanguard Int Semiconduct Corp | 半導體結構及其製造方法 |
| CN103038886A (zh) * | 2010-05-25 | 2013-04-10 | Ssscip有限公司 | 反向偏压下栅极-源极泄漏降低的自对准半导体装置及制作方法 |
| US9429366B2 (en) | 2010-09-29 | 2016-08-30 | Kraton Polymers U.S. Llc | Energy recovery ventilation sulfonated block copolymer laminate membrane |
| US9394414B2 (en) | 2010-09-29 | 2016-07-19 | Kraton Polymers U.S. Llc | Elastic, moisture-vapor permeable films, their preparation and their use |
| BR112013007705A2 (pt) | 2010-10-18 | 2016-08-09 | Kraton Polymers Us Llc | solução tendo uma composição de copolímero em bloco sulfonado, película ou membrana, dispersão aquosa, compósito, composição de copolímeto em bloco sulfonado, processo, método para formar uma composição de copolímero em bloco sulfonado, e, célula eletrodialítica |
| US8519410B1 (en) | 2010-12-20 | 2013-08-27 | Microsemi Corporation | Silicon carbide vertical-sidewall dual-mesa static induction transistor |
| US9861941B2 (en) | 2011-07-12 | 2018-01-09 | Kraton Polymers U.S. Llc | Modified sulfonated block copolymers and the preparation thereof |
| US8969912B2 (en) * | 2011-08-04 | 2015-03-03 | Avogy, Inc. | Method and system for a GaN vertical JFET utilizing a regrown channel |
| US8946788B2 (en) * | 2011-08-04 | 2015-02-03 | Avogy, Inc. | Method and system for doping control in gallium nitride based devices |
| US9184305B2 (en) * | 2011-08-04 | 2015-11-10 | Avogy, Inc. | Method and system for a GAN vertical JFET utilizing a regrown gate |
| CN105493291A (zh) | 2013-06-06 | 2016-04-13 | 美国联合碳化硅公司 | 沟槽屏蔽连接结型场效应晶体管 |
| WO2015115202A1 (ja) * | 2014-01-28 | 2015-08-06 | 三菱電機株式会社 | 炭化珪素半導体装置及び炭化珪素半導体装置の製造方法 |
| US9224845B1 (en) * | 2014-11-12 | 2015-12-29 | Stmicroelectronics, Inc. | Silicon carbide static induction transistor and process for making a silicon carbide static induction transistor |
| US10396215B2 (en) | 2015-03-10 | 2019-08-27 | United Silicon Carbide, Inc. | Trench vertical JFET with improved threshold voltage control |
| CN106158943A (zh) * | 2016-06-28 | 2016-11-23 | 长安大学 | N沟碳化硅静电感应晶闸管及其制造方法 |
| CN109791951B (zh) * | 2016-09-09 | 2023-08-01 | 美国联合碳化硅公司 | 具有改进的阈值电压控制的沟槽垂直jfet |
| JP6787367B2 (ja) | 2017-07-26 | 2020-11-18 | 株式会社デンソー | 半導体装置 |
| US10276667B1 (en) | 2018-05-31 | 2019-04-30 | Silanna Asia Pte Ltd | High voltage breakdown tapered vertical conduction junction transistor |
| JP7204582B2 (ja) | 2019-06-10 | 2023-01-16 | 株式会社島精機製作所 | 編地引下げ装置 |
| CN113054000A (zh) * | 2021-03-15 | 2021-06-29 | 无锡新洁能股份有限公司 | 超结结型场效应晶体管及其制作方法 |
| EP4228009A1 (en) * | 2022-02-11 | 2023-08-16 | Infineon Technologies Austria AG | Trench junction field effect transistor comprising a mesa region |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2984752A (en) | 1953-08-13 | 1961-05-16 | Rca Corp | Unipolar transistors |
| JPS53121581A (en) | 1977-03-31 | 1978-10-24 | Seiko Instr & Electronics Ltd | Logical element of electrostatic inductive transistor |
| US4364072A (en) | 1978-03-17 | 1982-12-14 | Zaidan Hojin Handotai Kenkyu Shinkokai | Static induction type semiconductor device with multiple doped layers for potential modification |
| US4403396A (en) | 1981-12-24 | 1983-09-13 | Gte Laboratories Incorporated | Semiconductor device design and process |
| US4587540A (en) * | 1982-04-05 | 1986-05-06 | International Business Machines Corporation | Vertical MESFET with mesa step defining gate length |
| US5262668A (en) * | 1992-08-13 | 1993-11-16 | North Carolina State University At Raleigh | Schottky barrier rectifier including schottky barrier regions of differing barrier heights |
| DE4423068C1 (de) * | 1994-07-01 | 1995-08-17 | Daimler Benz Ag | Feldeffekt-Transistoren aus SiC und Verfahren zu ihrer Herstellung |
| US5429956A (en) | 1994-09-30 | 1995-07-04 | United Microelectronics Corporation | Method for fabricating a field effect transistor with a self-aligned anti-punchthrough implant channel |
| US5592005A (en) | 1995-03-31 | 1997-01-07 | Siliconix Incorporated | Punch-through field effect transistor |
| US5753938A (en) * | 1996-08-08 | 1998-05-19 | North Carolina State University | Static-induction transistors having heterojunction gates and methods of forming same |
| JPH10275918A (ja) * | 1997-03-28 | 1998-10-13 | Toyo Electric Mfg Co Ltd | 半導体装置 |
| JP3180895B2 (ja) * | 1997-08-18 | 2001-06-25 | 富士電機株式会社 | 炭化けい素半導体装置の製造方法 |
| US5945701A (en) | 1997-12-19 | 1999-08-31 | Northrop Grumman Corporation | Static induction transistor |
| KR100661691B1 (ko) * | 1999-12-24 | 2006-12-26 | 스미토모덴키고교가부시키가이샤 | 접합형 전계 효과 트랜지스터 및 그 제조 방법 |
| US6816294B2 (en) | 2001-02-16 | 2004-11-09 | Electro Scientific Industries, Inc. | On-the-fly beam path error correction for memory link processing |
| JP4127987B2 (ja) * | 2001-08-23 | 2008-07-30 | 株式会社日立製作所 | 半導体装置 |
| JP4288907B2 (ja) * | 2001-08-29 | 2009-07-01 | 株式会社デンソー | 炭化珪素半導体装置及びその製造方法 |
| US6855970B2 (en) * | 2002-03-25 | 2005-02-15 | Kabushiki Kaisha Toshiba | High-breakdown-voltage semiconductor device |
| JP4122880B2 (ja) * | 2002-07-24 | 2008-07-23 | 住友電気工業株式会社 | 縦型接合型電界効果トランジスタ |
| JP2004134547A (ja) * | 2002-10-10 | 2004-04-30 | Hitachi Ltd | 半導体装置 |
| JP4265234B2 (ja) | 2003-02-13 | 2009-05-20 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
| US6943407B2 (en) * | 2003-06-17 | 2005-09-13 | International Business Machines Corporation | Low leakage heterojunction vertical transistors and high performance devices thereof |
| US20050067630A1 (en) | 2003-09-25 | 2005-03-31 | Zhao Jian H. | Vertical junction field effect power transistor |
| US7187021B2 (en) * | 2003-12-10 | 2007-03-06 | General Electric Company | Static induction transistor |
| US7407837B2 (en) * | 2004-01-27 | 2008-08-05 | Fuji Electric Holdings Co., Ltd. | Method of manufacturing silicon carbide semiconductor device |
| US7211845B1 (en) * | 2004-04-19 | 2007-05-01 | Qspeed Semiconductor, Inc. | Multiple doped channel in a multiple doped gate junction field effect transistor |
| US7820511B2 (en) * | 2004-07-08 | 2010-10-26 | Semisouth Laboratories, Inc. | Normally-off integrated JFET power switches in wide bandgap semiconductors and methods of making |
| US7202528B2 (en) * | 2004-12-01 | 2007-04-10 | Semisouth Laboratories, Inc. | Normally-off integrated JFET power switches in wide bandgap semiconductors and methods of making |
| US7279368B2 (en) * | 2005-03-04 | 2007-10-09 | Cree, Inc. | Method of manufacturing a vertical junction field effect transistor having an epitaxial gate |
| US7534666B2 (en) * | 2005-07-27 | 2009-05-19 | International Rectifier Corporation | High voltage non punch through IGBT for switch mode power supplies |
| JP2006080554A (ja) * | 2005-10-24 | 2006-03-23 | Denso Corp | 炭化珪素半導体装置の製造方法 |
| JP4939797B2 (ja) * | 2005-11-01 | 2012-05-30 | ルネサスエレクトロニクス株式会社 | スイッチング半導体装置 |
| US7763506B2 (en) * | 2007-09-10 | 2010-07-27 | Infineon Technologies Austria Ag | Method for making an integrated circuit including vertical junction field effect transistors |
| CN103038886A (zh) * | 2010-05-25 | 2013-04-10 | Ssscip有限公司 | 反向偏压下栅极-源极泄漏降低的自对准半导体装置及制作方法 |
-
2008
- 2008-05-08 US US12/117,121 patent/US7977713B2/en active Active
-
2009
- 2009-05-06 AU AU2009244273A patent/AU2009244273A1/en not_active Abandoned
- 2009-05-06 CA CA2722942A patent/CA2722942A1/en not_active Abandoned
- 2009-05-06 WO PCT/US2009/042983 patent/WO2009137578A2/en not_active Ceased
- 2009-05-06 CN CN2009801262403A patent/CN102084484B/zh not_active Expired - Fee Related
- 2009-05-06 KR KR1020107027357A patent/KR20110018891A/ko not_active Ceased
- 2009-05-06 JP JP2011508627A patent/JP5593308B2/ja not_active Expired - Fee Related
- 2009-05-06 EP EP09743564.8A patent/EP2289103A4/en not_active Withdrawn
- 2009-05-07 TW TW098115099A patent/TWI415258B/zh active
-
2011
- 2011-05-16 US US13/108,505 patent/US8507335B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TWI415258B (zh) | 2013-11-11 |
| CN102084484B (zh) | 2013-06-05 |
| TW200952175A (en) | 2009-12-16 |
| JP5593308B2 (ja) | 2014-09-17 |
| US7977713B2 (en) | 2011-07-12 |
| EP2289103A4 (en) | 2013-07-31 |
| EP2289103A2 (en) | 2011-03-02 |
| US8507335B2 (en) | 2013-08-13 |
| US20110217829A1 (en) | 2011-09-08 |
| JP2011521446A (ja) | 2011-07-21 |
| CN102084484A (zh) | 2011-06-01 |
| WO2009137578A3 (en) | 2010-03-04 |
| WO2009137578A2 (en) | 2009-11-12 |
| US20090278177A1 (en) | 2009-11-12 |
| KR20110018891A (ko) | 2011-02-24 |
| AU2009244273A1 (en) | 2009-11-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request |
Effective date: 20140227 |
|
| FZDE | Discontinued |
Effective date: 20150506 |