CA2703974C - Reduction of dielectric losses through use of organoclay in semiconductor or insulator compositions - Google Patents

Reduction of dielectric losses through use of organoclay in semiconductor or insulator compositions Download PDF

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Publication number
CA2703974C
CA2703974C CA2703974A CA2703974A CA2703974C CA 2703974 C CA2703974 C CA 2703974C CA 2703974 A CA2703974 A CA 2703974A CA 2703974 A CA2703974 A CA 2703974A CA 2703974 C CA2703974 C CA 2703974C
Authority
CA
Canada
Prior art keywords
organoclay
polymeric resin
copolymer
ethylene
article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA2703974A
Other languages
English (en)
French (fr)
Other versions
CA2703974A1 (en
Inventor
Timothy J. Person
Robert F. Eaton
Original Assignee
Union Carbide Chemicals and Plastics Technology LLC
Union Carbide Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40429787&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CA2703974(C) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Union Carbide Chemicals and Plastics Technology LLC, Union Carbide Corp filed Critical Union Carbide Chemicals and Plastics Technology LLC
Publication of CA2703974A1 publication Critical patent/CA2703974A1/en
Application granted granted Critical
Publication of CA2703974C publication Critical patent/CA2703974C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Laminated Bodies (AREA)
  • Inorganic Insulating Materials (AREA)
  • Insulated Conductors (AREA)
  • Communication Cables (AREA)
CA2703974A 2007-11-02 2008-10-15 Reduction of dielectric losses through use of organoclay in semiconductor or insulator compositions Expired - Fee Related CA2703974C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US98481307P 2007-11-02 2007-11-02
US60/984,813 2007-11-02
PCT/US2008/079915 WO2009058560A1 (en) 2007-11-02 2008-10-15 Reduction of dielectric losses through use organoclay in semiconductor or insulator compositions

Publications (2)

Publication Number Publication Date
CA2703974A1 CA2703974A1 (en) 2009-05-07
CA2703974C true CA2703974C (en) 2017-03-07

Family

ID=40429787

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2703974A Expired - Fee Related CA2703974C (en) 2007-11-02 2008-10-15 Reduction of dielectric losses through use of organoclay in semiconductor or insulator compositions

Country Status (11)

Country Link
US (2) US9959951B2 (https=)
EP (1) EP2215158B1 (https=)
JP (1) JP5473926B2 (https=)
KR (1) KR101461700B1 (https=)
CN (1) CN101918486B (https=)
AT (1) ATE541890T1 (https=)
BR (1) BRPI0817164A2 (https=)
CA (1) CA2703974C (https=)
MX (1) MX2010004829A (https=)
TW (1) TW200936665A (https=)
WO (1) WO2009058560A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6104277B2 (ja) * 2011-12-13 2017-03-29 ダウ グローバル テクノロジーズ エルエルシー エチレン−プロピレン−ジエン共重合体組成物
EA034758B1 (ru) 2014-08-19 2020-03-17 Бореалис Аг Новая сшитая полимерная композиция, структурный слой и кабель
US20160104555A1 (en) * 2014-10-10 2016-04-14 General Electric Company Method for improving the electric field distribution in a high voltage direct current cable
CN107771199B (zh) 2015-06-17 2021-05-25 陶氏环球技术有限责任公司 使用在管式反应器中制得且任选地经支化剂改性的高熔融强度乙烯类聚合物制得交联电缆绝缘材料的方法
WO2022036672A1 (en) 2020-08-21 2022-02-24 Dow Global Technologies Llc Meltblown nonwovens having high volume resistivity and articles thereof
EP4413070A1 (en) 2021-10-05 2024-08-14 Borealis AG Cable

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2627194B2 (ja) * 1989-07-31 1997-07-02 株式会社豊田中央研究所 ポリエステル複合材料及びその製造方法
JPH0652728A (ja) * 1992-07-31 1994-02-25 Showa Electric Wire & Cable Co Ltd 電力ケーブル
JP3349747B2 (ja) * 1993-02-26 2002-11-25 株式会社フジクラ 絶縁組成物および電力ケーブル
US5780376A (en) * 1996-02-23 1998-07-14 Southern Clay Products, Inc. Organoclay compositions
CZ273598A3 (cs) * 1996-12-31 1999-01-13 The Dow Chemical Company Kompozity polymer-organické jíly a jejich příprava
FR2793592B1 (fr) 1999-03-04 2001-06-08 Cit Alcatel Cable d'energie ayant des caracteristiques mecaniques, thermiques, electriques, et de tenue au feu sensiblement ameliorees
US6524702B1 (en) * 1999-08-12 2003-02-25 Dow Global Technologies Inc. Electrical devices having polymeric members
US6737464B1 (en) * 2000-05-30 2004-05-18 University Of South Carolina Research Foundation Polymer nanocomposite comprising a matrix polymer and a layered clay material having a low quartz content
US6740396B2 (en) * 2001-02-26 2004-05-25 Pirelli Cavi E Sistemi S.P.A. Cable with coating of a composite material
JP2003022710A (ja) * 2001-07-06 2003-01-24 Toshiba Corp 低誘電型絶縁材料とその製造方法
US6825253B2 (en) 2002-07-22 2004-11-30 General Cable Technologies Corporation Insulation compositions containing metallocene polymers
ATE380385T1 (de) 2002-09-10 2007-12-15 Union Carbide Chem Plastic Kabelummantelungs-zusammensetzungen aus polypropylen mit verbesserter schmelzstärke und physikalischen eigenschaften
US7226422B2 (en) * 2002-10-09 2007-06-05 Cardiac Pacemakers, Inc. Detection of congestion from monitoring patient response to a recumbent position
US7144934B2 (en) * 2002-10-24 2006-12-05 Dow Global Technologies Inc. Charge dissipation modifiers for olefinic interpolymer compositions
CA2528850C (en) 2003-06-09 2012-05-01 Union Carbide Corporation Strippable semi-conductive insulation shield
ATE463036T1 (de) * 2003-09-25 2010-04-15 Dow Global Technologies Inc Ablösbare halbleitende abschirmung und zusammensetzungen dafür
JP2006028208A (ja) * 2004-07-12 2006-02-02 Fujikura Ltd 低誘電性・耐熱性樹脂組成物、これを用いた成形品及びプリント回路基板

Also Published As

Publication number Publication date
CA2703974A1 (en) 2009-05-07
WO2009058560A1 (en) 2009-05-07
EP2215158A1 (en) 2010-08-11
JP5473926B2 (ja) 2014-04-16
MX2010004829A (es) 2010-07-28
US20110100675A1 (en) 2011-05-05
JP2011503784A (ja) 2011-01-27
KR101461700B1 (ko) 2014-11-17
CN101918486A (zh) 2010-12-15
KR20100099688A (ko) 2010-09-13
US20180211742A1 (en) 2018-07-26
BRPI0817164A2 (pt) 2016-08-09
TW200936665A (en) 2009-09-01
US9959951B2 (en) 2018-05-01
CN101918486B (zh) 2016-05-11
EP2215158B1 (en) 2012-01-18
US10354775B2 (en) 2019-07-16
ATE541890T1 (de) 2012-02-15

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Effective date: 20130821

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