CA2649786A1 - Electroplating device and method - Google Patents
Electroplating device and method Download PDFInfo
- Publication number
- CA2649786A1 CA2649786A1 CA002649786A CA2649786A CA2649786A1 CA 2649786 A1 CA2649786 A1 CA 2649786A1 CA 002649786 A CA002649786 A CA 002649786A CA 2649786 A CA2649786 A CA 2649786A CA 2649786 A1 CA2649786 A1 CA 2649786A1
- Authority
- CA
- Canada
- Prior art keywords
- substrate
- shafts
- electrically conductive
- band
- bands
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
- C25D5/06—Brush or pad plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing of the conductive pattern
- H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06112723 | 2006-04-18 | ||
| EP06112723.9 | 2006-04-18 | ||
| PCT/EP2007/053707 WO2007118875A2 (de) | 2006-04-18 | 2007-04-17 | Vorrichtung und verfahren zur galvanischen beschichtung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2649786A1 true CA2649786A1 (en) | 2007-10-25 |
Family
ID=38236519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002649786A Abandoned CA2649786A1 (en) | 2006-04-18 | 2007-04-17 | Electroplating device and method |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20090101511A1 (https=) |
| EP (1) | EP2010699A2 (https=) |
| JP (1) | JP2009534527A (https=) |
| KR (1) | KR20090009876A (https=) |
| CN (1) | CN101473072A (https=) |
| BR (1) | BRPI0710241A2 (https=) |
| CA (1) | CA2649786A1 (https=) |
| IL (1) | IL194754A0 (https=) |
| RU (1) | RU2420616C2 (https=) |
| TW (1) | TW200811316A (https=) |
| WO (1) | WO2007118875A2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110952121A (zh) * | 2018-12-17 | 2020-04-03 | 宁波森联光电科技有限公司 | 焊带制造装置和电镀机构及其电镀方法 |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5301993B2 (ja) | 2005-08-12 | 2013-09-25 | モジュメタル エルエルシー | 組成変調複合材料及びその形成方法 |
| TW200829726A (en) * | 2006-11-28 | 2008-07-16 | Basf Ag | Method and device for electrolytic coating |
| WO2009112573A2 (de) * | 2008-03-13 | 2009-09-17 | Basf Se | Verfahren und dispersion zum aufbringen einer metallschicht auf einem substrat sowie metallisierbare thermoplastische formmasse |
| NL1035265C2 (nl) * | 2008-04-07 | 2009-10-08 | Meco Equip Eng | Werkwijze en inrichting voor het elektrolytisch galvaniseren van niet-metallische glasachtige substraten. |
| WO2010144509A2 (en) | 2009-06-08 | 2010-12-16 | Modumetal Llc | Electrodeposited, nanolaminate coatings and claddings for corrosion protection |
| TW201121680A (en) * | 2009-12-18 | 2011-07-01 | Metal Ind Res & Dev Ct | Electrochemical machining device and machining method and electrode unit thereof. |
| KR101103450B1 (ko) * | 2010-07-27 | 2012-01-09 | 주식회사 케이씨텍 | 기판 도금 장치 |
| US20120231574A1 (en) * | 2011-03-12 | 2012-09-13 | Jiaxiong Wang | Continuous Electroplating Apparatus with Assembled Modular Sections for Fabrications of Thin Film Solar Cells |
| EA201500949A1 (ru) | 2013-03-15 | 2016-02-29 | Модьюметл, Инк. | Способ формирования многослойного покрытия, покрытие, сформированное вышеуказанным способом, и многослойное покрытие |
| HK1220742A1 (zh) | 2013-03-15 | 2017-05-12 | Modumetal, Inc. | 用於连续施加纳米层压金属涂层的方法和装置 |
| BR112015022235A2 (pt) | 2013-03-15 | 2017-07-18 | Modumetal Inc | revestimentos nanolaminados |
| US10472727B2 (en) | 2013-03-15 | 2019-11-12 | Modumetal, Inc. | Method and apparatus for continuously applying nanolaminate metal coatings |
| EA201500948A1 (ru) | 2013-03-15 | 2016-03-31 | Модьюметл, Инк. | Способ изготовления изделия и изделие, изготовленное вышеуказанным способом |
| EP2799939A1 (fr) * | 2013-04-30 | 2014-11-05 | Universo S.A. | Support pour le traitement de pièces de micromécanique |
| KR101419276B1 (ko) * | 2013-08-27 | 2014-07-15 | (주)엠에스티테크놀로지 | 플라즈마 전해 산화에 의한 코팅 형성 방법 |
| EP3194642A4 (en) * | 2014-09-18 | 2018-07-04 | Modumetal, Inc. | A method and apparatus for continuously applying nanolaminate metal coatings |
| BR112017005534A2 (pt) | 2014-09-18 | 2017-12-05 | Modumetal Inc | métodos de preparação de artigos por processos de eletrodeposição e fabricação aditiva |
| DE102015121349A1 (de) | 2015-12-08 | 2017-06-08 | Staku Anlagenbau Gmbh | Vorrichtung zur Oberflächenbehandlung eines Endlosmaterials sowie deren Verwendung |
| KR101681083B1 (ko) * | 2016-06-26 | 2016-12-01 | 주식회사 지에스아이 | 곡면부를 포함하는 상대전극을 갖는 도금장치 |
| US11365488B2 (en) | 2016-09-08 | 2022-06-21 | Modumetal, Inc. | Processes for providing laminated coatings on workpieces, and articles made therefrom |
| TW201821649A (zh) | 2016-09-09 | 2018-06-16 | 美商馬杜合金股份有限公司 | 層合物與奈米層合物材料於工具及模製方法之應用 |
| EP3512987A1 (en) | 2016-09-14 | 2019-07-24 | Modumetal, Inc. | System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom |
| US12076965B2 (en) | 2016-11-02 | 2024-09-03 | Modumetal, Inc. | Topology optimized high interface packing structures |
| WO2018175975A1 (en) | 2017-03-24 | 2018-09-27 | Modumetal, Inc. | Lift plungers with electrodeposited coatings, and systems and methods for producing the same |
| EP3612669A1 (en) | 2017-04-21 | 2020-02-26 | Modumetal, Inc. | Tubular articles with electrodeposited coatings, and systems and methods for producing the same |
| CN112272717B (zh) | 2018-04-27 | 2024-01-05 | 莫杜美拓有限公司 | 用于使用旋转生产具有纳米层压物涂层的多个制品的设备、系统和方法 |
| CN110306218B (zh) * | 2019-07-15 | 2024-11-08 | 中国石油天然气集团有限公司 | 一种发动机主轴孔自动控制式刷镀设备 |
| CN113512749A (zh) * | 2020-12-08 | 2021-10-19 | 郑州大学 | 一种电镀金刚石刀具实验装置 |
| US20240200222A1 (en) * | 2021-04-21 | 2024-06-20 | Mitsubishi Electric Corporation | Plating electrode and plating method that uses the plating electrode |
| CN113400698B (zh) * | 2021-05-11 | 2022-12-20 | 重庆金美新材料科技有限公司 | 一种导电传动带及其制备方法、薄膜水电镀设备 |
| CN115896907A (zh) * | 2022-10-19 | 2023-04-04 | 重庆金美新材料科技有限公司 | 一种阴极导电机构和电镀系统 |
| DE102023120210B4 (de) * | 2023-07-28 | 2025-03-13 | Ce Cell Engineering Gmbh | Anlage zur elektrischen Kontaktierung von Wafersolarzellen, Inline-Produktionsvorrichtung und Herstellungsverfahren für eine Wafersolarzelle |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1756267U (de) * | 1957-06-27 | 1957-11-14 | Aschaffenburger Zellstoffwerke | Polsterkissen fuer verpakkungszwecke und als sitzkissen geeignet. |
| DE1756267A1 (de) * | 1968-04-27 | 1971-10-07 | Carl Klingspor | Galvanisiervorrichtung fuer Gewebe |
| LU80496A1 (fr) * | 1978-11-09 | 1980-06-05 | Cockerill | Procede et diopositif pour le depot electrolytique en continu et a haute densite de courant d'un metal de recouvrement sur une tole |
| SU1435668A1 (ru) * | 1986-06-09 | 1988-11-07 | Предприятие П/Я В-8657 | Устройство дл двусторонней жидкостной обработки плоских изделий |
| DE4413149A1 (de) * | 1994-04-15 | 1995-10-19 | Schmid Gmbh & Co Geb | Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten |
| GB0005883D0 (en) * | 2000-03-13 | 2000-05-03 | Lowe John M | Electro-plating apparatus and a method of electoplating |
| DE10234705B4 (de) * | 2001-10-25 | 2008-01-17 | Infineon Technologies Ag | Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen |
| WO2003038158A2 (de) * | 2001-10-25 | 2003-05-08 | Infineon Technologies Ag | Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen |
| DE10342512B3 (de) * | 2003-09-12 | 2004-10-28 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut |
-
2007
- 2007-04-17 US US12/297,864 patent/US20090101511A1/en not_active Abandoned
- 2007-04-17 JP JP2009505867A patent/JP2009534527A/ja not_active Withdrawn
- 2007-04-17 RU RU2008145108/02A patent/RU2420616C2/ru not_active IP Right Cessation
- 2007-04-17 WO PCT/EP2007/053707 patent/WO2007118875A2/de not_active Ceased
- 2007-04-17 CN CNA2007800226453A patent/CN101473072A/zh active Pending
- 2007-04-17 CA CA002649786A patent/CA2649786A1/en not_active Abandoned
- 2007-04-17 KR KR1020087028157A patent/KR20090009876A/ko not_active Withdrawn
- 2007-04-17 BR BRPI0710241-0A patent/BRPI0710241A2/pt not_active IP Right Cessation
- 2007-04-17 EP EP07728172A patent/EP2010699A2/de not_active Withdrawn
- 2007-04-18 TW TW096113679A patent/TW200811316A/zh unknown
-
2008
- 2008-10-22 IL IL194754A patent/IL194754A0/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110952121A (zh) * | 2018-12-17 | 2020-04-03 | 宁波森联光电科技有限公司 | 焊带制造装置和电镀机构及其电镀方法 |
| CN110952121B (zh) * | 2018-12-17 | 2023-12-05 | 嘉兴瑞通智能装备有限公司 | 焊带制造装置和电镀机构及其电镀方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2010699A2 (de) | 2009-01-07 |
| US20090101511A1 (en) | 2009-04-23 |
| KR20090009876A (ko) | 2009-01-23 |
| IL194754A0 (en) | 2009-08-03 |
| CN101473072A (zh) | 2009-07-01 |
| WO2007118875A2 (de) | 2007-10-25 |
| JP2009534527A (ja) | 2009-09-24 |
| RU2008145108A (ru) | 2010-05-27 |
| WO2007118875A3 (de) | 2008-08-07 |
| BRPI0710241A2 (pt) | 2011-08-09 |
| TW200811316A (en) | 2008-03-01 |
| RU2420616C2 (ru) | 2011-06-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |