CA2539656A1 - Procede ameliore de plaquage de l'argent, et articles ainsi realises - Google Patents
Procede ameliore de plaquage de l'argent, et articles ainsi realises Download PDFInfo
- Publication number
- CA2539656A1 CA2539656A1 CA002539656A CA2539656A CA2539656A1 CA 2539656 A1 CA2539656 A1 CA 2539656A1 CA 002539656 A CA002539656 A CA 002539656A CA 2539656 A CA2539656 A CA 2539656A CA 2539656 A1 CA2539656 A1 CA 2539656A1
- Authority
- CA
- Canada
- Prior art keywords
- silver
- organic substrate
- solution
- metallization
- aqueous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1644—Composition of the substrate porous substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12896—Ag-base component
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
Abstract
L'invention porte sur un procédé amélioré de plaquage d'argent sur un substrat organique utilisant en partie du Na¿4?EDTA qui facilite la formation de grains et la récupération de l'argent présent dans des déchets. L'invention porte également sur des articles réalisés à l'aide dudit procédé.
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41230602P | 2002-09-20 | 2002-09-20 | |
US41230202P | 2002-09-20 | 2002-09-20 | |
US41230302P | 2002-09-20 | 2002-09-20 | |
US41230102P | 2002-09-20 | 2002-09-20 | |
US60/412,306 | 2002-09-20 | ||
US60/412,302 | 2002-09-20 | ||
US60/412,303 | 2002-09-20 | ||
US60/412,301 | 2002-09-20 | ||
PCT/US2003/029293 WO2004027113A2 (fr) | 2002-09-20 | 2003-09-19 | Procede ameliore de plaquage de l'argent, et articles ainsi realises |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2539656A1 true CA2539656A1 (fr) | 2004-04-01 |
Family
ID=32034411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002539656A Abandoned CA2539656A1 (fr) | 2002-09-20 | 2003-09-19 | Procede ameliore de plaquage de l'argent, et articles ainsi realises |
Country Status (7)
Country | Link |
---|---|
US (1) | US20040173056A1 (fr) |
EP (1) | EP1590499A3 (fr) |
JP (1) | JP2006514713A (fr) |
KR (1) | KR20050074951A (fr) |
AU (1) | AU2003272505A1 (fr) |
CA (1) | CA2539656A1 (fr) |
WO (1) | WO2004027113A2 (fr) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6605751B1 (en) | 1997-11-14 | 2003-08-12 | Acrymed | Silver-containing compositions, devices and methods for making |
DE60028415T2 (de) | 1999-12-30 | 2007-06-06 | Acrymed, Portland | Methode und zusammensetzungen für verbesserte abgabevorrichtungen |
US8486426B2 (en) | 2002-07-29 | 2013-07-16 | Kimberly-Clark Worldwide, Inc. | Methods and compositions for treatment of dermal conditions |
IN266973B (fr) | 2004-07-30 | 2007-07-06 | Kimberly Clark Co | |
CN101010004B (zh) | 2004-07-30 | 2012-10-03 | 金伯利-克拉克环球有限公司 | 抗微生物的装置和组合物 |
US8361553B2 (en) * | 2004-07-30 | 2013-01-29 | Kimberly-Clark Worldwide, Inc. | Methods and compositions for metal nanoparticle treated surfaces |
KR20070061539A (ko) | 2004-08-23 | 2007-06-13 | 노블 화이버 테크놀로지스, 엘엘씨 | 항균재료 및 필터재료를 제조하기 위한 폴리머 발포재의금속화 방법 |
WO2006034249A2 (fr) | 2004-09-20 | 2006-03-30 | Acrymed, Inc. | Compositions antimicrobiennes amorphes |
US20060130700A1 (en) * | 2004-12-16 | 2006-06-22 | Reinartz Nicole M | Silver-containing inkjet ink |
US7297373B2 (en) * | 2005-11-18 | 2007-11-20 | Noble Fiber Technologies, Llc | Conductive composites |
IN264350B (fr) * | 2006-02-08 | 2009-02-20 | Kimberly Clark Co | |
WO2007127236A2 (fr) | 2006-04-28 | 2007-11-08 | Acrymed, Inc. | Pansements pour site antimicrobien |
DE102006055763B4 (de) * | 2006-11-21 | 2011-06-22 | Militz, Detlef, 15366 | Verfahren zur Metallisierung von Polyester, metallisierter Polyester und dessen Verwendung |
KR100891353B1 (ko) * | 2007-07-10 | 2009-04-08 | (주)골드터치코리아 | 플라즈마를 이용한 분사식 은경막 코팅방법 |
US20120047636A1 (en) * | 2010-08-24 | 2012-03-01 | Christopher Fehmel | Sports helmet |
US9192625B1 (en) | 2011-07-01 | 2015-11-24 | Mangala Joshi | Antimicrobial nanocomposite compositions, fibers and films |
KR101250778B1 (ko) * | 2012-11-05 | 2013-04-08 | 신상규 | 은 회수방법, 은 정제용 전기분해장치 및 그를 통해 정제된 은 재생방법 |
CL2014003397A1 (es) * | 2014-12-12 | 2015-08-07 | Leyton Nelson Roberto Osses | Composición química libre de cianuros para recubrir de manera in situ superficies metálicas; y metodo para recubrir de manera in situ superficies metalicas de manera autocatalitica. |
KR102316361B1 (ko) * | 2017-02-28 | 2021-10-25 | 한국전자기술연구원 | 은나노와이어를 포함한 분산액 및 그를 이용한 고유연성 투명 전도성 코팅 기판의 제조방법 |
US11533972B2 (en) | 2019-01-16 | 2022-12-27 | Salt Athletic, Inc. | Anti-bacterial and deodorizing athletic bag |
CN116083891B (zh) * | 2022-12-30 | 2024-10-18 | 湖北铭宇水晶饰品有限公司 | 吸塑片上的水钻的镀银方法及镀银系统 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3960573A (en) * | 1972-08-07 | 1976-06-01 | Photocircuits Division Of Kollmorgan Corporation | Novel precious metal sensitizing solutions |
US3993845A (en) * | 1973-07-30 | 1976-11-23 | Ppg Industries, Inc. | Thin films containing metallic copper and silver by replacement without subsequent accelerated oxidation |
US3978271A (en) * | 1975-04-15 | 1976-08-31 | Ppg Industries, Inc. | Thin metallic nickel-silver films by chemical replacement |
US4204013A (en) * | 1978-10-20 | 1980-05-20 | Oxy Metal Industries Corporation | Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine |
US4312913A (en) * | 1980-05-12 | 1982-01-26 | Textile Products Incorporated | Heat conductive fabric |
US4716055A (en) * | 1985-08-05 | 1987-12-29 | Basf Corporation | Conductive fiber and method of making same |
JP2894493B2 (ja) * | 1988-02-09 | 1999-05-24 | 三菱マテリアル株式会社 | 銀被覆有機繊維の製造方法 |
JP2832247B2 (ja) * | 1990-07-24 | 1998-12-09 | 三井金属鉱業株式会社 | 銀被覆銅粉の製造方法 |
US5218171A (en) * | 1991-11-25 | 1993-06-08 | Champlain Cable Corporation | Wire and cable having conductive fiber core |
US5302415A (en) * | 1992-12-08 | 1994-04-12 | E. I. Du Pont De Nemours And Company | Electroless plated aramid surfaces and a process for making such surfaces |
US5322553A (en) * | 1993-02-22 | 1994-06-21 | Applied Electroless Concepts | Electroless silver plating composition |
US5466485A (en) * | 1995-01-30 | 1995-11-14 | E. I. Du Pont De Nemours And Company | Process for batch-plating aramid fibers |
US5648003A (en) * | 1995-05-01 | 1997-07-15 | Liang; David H. | Surgical glove that protects against infection by providing heat in response to penetration thereof by a medical instrument and method therefor |
US6861570B1 (en) * | 1997-09-22 | 2005-03-01 | A. Bart Flick | Multilayer conductive appliance having wound healing and analgesic properties |
WO2000075395A1 (fr) * | 1999-06-09 | 2000-12-14 | Laird Technologies, Inc. | Mousse polymere electroconductrice et son procede de fabrication |
-
2003
- 2003-09-19 US US10/666,568 patent/US20040173056A1/en not_active Abandoned
- 2003-09-19 CA CA002539656A patent/CA2539656A1/fr not_active Abandoned
- 2003-09-19 AU AU2003272505A patent/AU2003272505A1/en not_active Abandoned
- 2003-09-19 EP EP03754690A patent/EP1590499A3/fr not_active Withdrawn
- 2003-09-19 JP JP2004537944A patent/JP2006514713A/ja not_active Withdrawn
- 2003-09-19 KR KR1020057004857A patent/KR20050074951A/ko not_active Application Discontinuation
- 2003-09-19 WO PCT/US2003/029293 patent/WO2004027113A2/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2004027113A2 (fr) | 2004-04-01 |
US20040173056A1 (en) | 2004-09-09 |
JP2006514713A (ja) | 2006-05-11 |
KR20050074951A (ko) | 2005-07-19 |
EP1590499A2 (fr) | 2005-11-02 |
EP1590499A3 (fr) | 2005-12-14 |
WO2004027113A3 (fr) | 2005-10-27 |
AU2003272505A1 (en) | 2004-04-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
FZDE | Discontinued |