AU2003272505A1 - Improved silver plating method and articles made therefrom - Google Patents

Improved silver plating method and articles made therefrom Download PDF

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Publication number
AU2003272505A1
AU2003272505A1 AU2003272505A AU2003272505A AU2003272505A1 AU 2003272505 A1 AU2003272505 A1 AU 2003272505A1 AU 2003272505 A AU2003272505 A AU 2003272505A AU 2003272505 A AU2003272505 A AU 2003272505A AU 2003272505 A1 AU2003272505 A1 AU 2003272505A1
Authority
AU
Australia
Prior art keywords
silver
organic substrate
solution
metallization
aqueous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003272505A
Other languages
English (en)
Inventor
Satish N. Chandra
Vinesh Naik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noble Fiber Technologies LLC
Original Assignee
Noble Fiber Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noble Fiber Technologies LLC filed Critical Noble Fiber Technologies LLC
Publication of AU2003272505A1 publication Critical patent/AU2003272505A1/en
Abandoned legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073Multistep pretreatment
    • C23C18/2086Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • C23C18/1644Composition of the substrate porous substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1655Process features
    • C23C18/1658Process features with two steps starting with metal deposition followed by addition of reducing agent
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/285Sensitising or activating with tin based compound or composition
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • C23C18/44Coating with noble metals using reducing agents
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556Organic component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12861Group VIII or IB metal-base component
    • Y10T428/12896Ag-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Manufacture And Refinement Of Metals (AREA)
AU2003272505A 2002-09-20 2003-09-19 Improved silver plating method and articles made therefrom Abandoned AU2003272505A1 (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US41230202P 2002-09-20 2002-09-20
US41230302P 2002-09-20 2002-09-20
US41230102P 2002-09-20 2002-09-20
US41230602P 2002-09-20 2002-09-20
US60/412,306 2002-09-20
US60/412,302 2002-09-20
US60/412,301 2002-09-20
US60/412,303 2002-09-20
PCT/US2003/029293 WO2004027113A2 (fr) 2002-09-20 2003-09-19 Procede ameliore de plaquage de l'argent, et articles ainsi realises

Publications (1)

Publication Number Publication Date
AU2003272505A1 true AU2003272505A1 (en) 2004-04-08

Family

ID=32034411

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003272505A Abandoned AU2003272505A1 (en) 2002-09-20 2003-09-19 Improved silver plating method and articles made therefrom

Country Status (7)

Country Link
US (1) US20040173056A1 (fr)
EP (1) EP1590499A3 (fr)
JP (1) JP2006514713A (fr)
KR (1) KR20050074951A (fr)
AU (1) AU2003272505A1 (fr)
CA (1) CA2539656A1 (fr)
WO (1) WO2004027113A2 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6605751B1 (en) 1997-11-14 2003-08-12 Acrymed Silver-containing compositions, devices and methods for making
DE60028415T2 (de) 1999-12-30 2007-06-06 Acrymed, Portland Methode und zusammensetzungen für verbesserte abgabevorrichtungen
US8486426B2 (en) 2002-07-29 2013-07-16 Kimberly-Clark Worldwide, Inc. Methods and compositions for treatment of dermal conditions
CN101010004B (zh) 2004-07-30 2012-10-03 金伯利-克拉克环球有限公司 抗微生物的装置和组合物
AU2005280443B2 (en) 2004-07-30 2011-02-03 Avent, Inc. Antimicrobial silver compositions
US8361553B2 (en) * 2004-07-30 2013-01-29 Kimberly-Clark Worldwide, Inc. Methods and compositions for metal nanoparticle treated surfaces
WO2006023913A2 (fr) * 2004-08-23 2006-03-02 Noble Fiber Technologies, Llc Procede de metallisation de mousse polymere pour la production de materiau antimicrobien et de filtration
WO2006034249A2 (fr) 2004-09-20 2006-03-30 Acrymed, Inc. Compositions antimicrobiennes amorphes
US20060130700A1 (en) * 2004-12-16 2006-06-22 Reinartz Nicole M Silver-containing inkjet ink
US7297373B2 (en) * 2005-11-18 2007-11-20 Noble Fiber Technologies, Llc Conductive composites
CA2641822C (fr) * 2006-02-08 2016-11-29 Acrymed, Inc. Procedes et compositions destines a des surfaces traitees avec des nanoparticules metalliques
EP2015722B1 (fr) 2006-04-28 2016-11-16 Avent, Inc. Pansements pour site antimicrobien
DE102006055763B4 (de) * 2006-11-21 2011-06-22 Militz, Detlef, 15366 Verfahren zur Metallisierung von Polyester, metallisierter Polyester und dessen Verwendung
KR100891353B1 (ko) * 2007-07-10 2009-04-08 (주)골드터치코리아 플라즈마를 이용한 분사식 은경막 코팅방법
US20120047636A1 (en) * 2010-08-24 2012-03-01 Christopher Fehmel Sports helmet
US9192625B1 (en) 2011-07-01 2015-11-24 Mangala Joshi Antimicrobial nanocomposite compositions, fibers and films
KR101250778B1 (ko) * 2012-11-05 2013-04-08 신상규 은 회수방법, 은 정제용 전기분해장치 및 그를 통해 정제된 은 재생방법
CL2014003397A1 (es) * 2014-12-12 2015-08-07 Leyton Nelson Roberto Osses Composición química libre de cianuros para recubrir de manera in situ superficies metálicas; y metodo para recubrir de manera in situ superficies metalicas de manera autocatalitica.
KR102316361B1 (ko) * 2017-02-28 2021-10-25 한국전자기술연구원 은나노와이어를 포함한 분산액 및 그를 이용한 고유연성 투명 전도성 코팅 기판의 제조방법
WO2020150504A1 (fr) * 2019-01-16 2020-07-23 De La Vega Sanchez De Lozada Rafael Sac d'athlétisme antibactérien et désodorisant

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US3960573A (en) * 1972-08-07 1976-06-01 Photocircuits Division Of Kollmorgan Corporation Novel precious metal sensitizing solutions
US3993845A (en) * 1973-07-30 1976-11-23 Ppg Industries, Inc. Thin films containing metallic copper and silver by replacement without subsequent accelerated oxidation
US3978271A (en) * 1975-04-15 1976-08-31 Ppg Industries, Inc. Thin metallic nickel-silver films by chemical replacement
US4204013A (en) * 1978-10-20 1980-05-20 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine
US4312913A (en) * 1980-05-12 1982-01-26 Textile Products Incorporated Heat conductive fabric
US4716055A (en) * 1985-08-05 1987-12-29 Basf Corporation Conductive fiber and method of making same
JP2894493B2 (ja) * 1988-02-09 1999-05-24 三菱マテリアル株式会社 銀被覆有機繊維の製造方法
JP2832247B2 (ja) * 1990-07-24 1998-12-09 三井金属鉱業株式会社 銀被覆銅粉の製造方法
US5218171A (en) * 1991-11-25 1993-06-08 Champlain Cable Corporation Wire and cable having conductive fiber core
US5302415A (en) * 1992-12-08 1994-04-12 E. I. Du Pont De Nemours And Company Electroless plated aramid surfaces and a process for making such surfaces
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Also Published As

Publication number Publication date
KR20050074951A (ko) 2005-07-19
CA2539656A1 (fr) 2004-04-01
EP1590499A3 (fr) 2005-12-14
WO2004027113A3 (fr) 2005-10-27
EP1590499A2 (fr) 2005-11-02
US20040173056A1 (en) 2004-09-09
JP2006514713A (ja) 2006-05-11
WO2004027113A2 (fr) 2004-04-01

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Legal Events

Date Code Title Description
MK4 Application lapsed section 142(2)(d) - no continuation fee paid for the application