CA2243727A1 - Revetement reticulable positif tire sur materiel - Google Patents

Revetement reticulable positif tire sur materiel Download PDF

Info

Publication number
CA2243727A1
CA2243727A1 CA002243727A CA2243727A CA2243727A1 CA 2243727 A1 CA2243727 A1 CA 2243727A1 CA 002243727 A CA002243727 A CA 002243727A CA 2243727 A CA2243727 A CA 2243727A CA 2243727 A1 CA2243727 A1 CA 2243727A1
Authority
CA
Canada
Prior art keywords
resin
bis
trichloromethyl
triazine
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002243727A
Other languages
English (en)
Inventor
James J. Briguglio
Robert E. Hawkins
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Morton International LLC
Original Assignee
Morton International LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Morton International LLC filed Critical Morton International LLC
Publication of CA2243727A1 publication Critical patent/CA2243727A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
    • C08G61/08—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CA002243727A 1998-01-30 1998-07-21 Revetement reticulable positif tire sur materiel Abandoned CA2243727A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US1600398A 1998-01-30 1998-01-30
US09/016,003 1998-01-30
US11326798A 1998-07-10 1998-07-10
US09/113,267 1998-07-10

Publications (1)

Publication Number Publication Date
CA2243727A1 true CA2243727A1 (fr) 1999-07-30

Family

ID=26688051

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002243727A Abandoned CA2243727A1 (fr) 1998-01-30 1998-07-21 Revetement reticulable positif tire sur materiel

Country Status (4)

Country Link
EP (1) EP0933681A1 (fr)
JP (1) JPH11231520A (fr)
KR (1) KR19990066730A (fr)
CA (1) CA2243727A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160187775A1 (en) * 2014-12-30 2016-06-30 Promerus, Llc Photoimageable compositions containing thermal base generators

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6440642B1 (en) * 1999-09-15 2002-08-27 Shipley Company, L.L.C. Dielectric composition
JP2002064276A (ja) * 2000-08-22 2002-02-28 Nippon Steel Chem Co Ltd 光又は熱硬化性樹脂組成物及び多層プリント配線基板
TWI228639B (en) * 2000-11-15 2005-03-01 Vantico Ag Positive type photosensitive epoxy resin composition and printed circuit board using the same
EP1469346B1 (fr) 2002-01-23 2015-08-05 JSR Corporation Composition de résine photosensible positive et isolante, et objet durci obtenu de celle-ci
DE10204114A1 (de) * 2002-02-01 2003-08-14 Basf Coatings Ag Thermisch und mit aktinischer Strahlung härtbares Stoffgemisch, Verfahren zu seiner Herstellung und seine Verwendung
WO2005118604A1 (fr) * 2004-05-28 2005-12-15 Dow Global Technologies Inc. Composés phosphorés utiles pour la fabrication de polymères résistant à l'inflammation et exempts d'halogène
US8017296B2 (en) 2007-05-22 2011-09-13 Az Electronic Materials Usa Corp. Antireflective coating composition comprising fused aromatic rings
US7989144B2 (en) * 2008-04-01 2011-08-02 Az Electronic Materials Usa Corp Antireflective coating composition
US7932018B2 (en) 2008-05-06 2011-04-26 Az Electronic Materials Usa Corp. Antireflective coating composition
US8486609B2 (en) 2009-12-23 2013-07-16 Az Electronic Materials Usa Corp. Antireflective coating composition and process thereof
JP5661293B2 (ja) * 2010-02-08 2015-01-28 太陽ホールディングス株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
CN111051364B (zh) 2017-08-18 2023-03-14 飞纳技术有限公司 环氧化聚法呢烯及其制备方法
EP3995894A4 (fr) * 2019-07-02 2022-06-29 Shandong Shengquan New Materials Co., Ltd. Promoteur d'adhérence et composition de résine photosensible le contenant
CN112174998B (zh) * 2019-07-02 2023-06-16 山东圣泉新材料股份有限公司 一种粘合促进剂及包含其的光敏树脂组合物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS619648A (ja) * 1984-06-25 1986-01-17 Hitachi Chem Co Ltd パタ−ン形成法
JPS61275749A (ja) * 1985-05-30 1986-12-05 Nec Corp ポジレジスト材料
US5296330A (en) * 1991-08-30 1994-03-22 Ciba-Geigy Corp. Positive photoresists containing quinone diazide photosensitizer, alkali-soluble resin and tetra(hydroxyphenyl) alkane additive
JPH06102662A (ja) * 1991-10-14 1994-04-15 Sannopuko Kk 感光性樹脂組成物
US5262280A (en) * 1992-04-02 1993-11-16 Shipley Company Inc. Radiation sensitive compositions
US5532105A (en) * 1992-08-07 1996-07-02 Hitachi Chemical Company, Ltd. Photolithographically viahole-forming photosensitive element comprising two photosensitive layers for the fabrication process of multilayer wiring board
JPH08319307A (ja) * 1995-05-29 1996-12-03 Nippon Kayaku Co Ltd 樹脂組成物、レジストインキ組成物及びその硬化物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160187775A1 (en) * 2014-12-30 2016-06-30 Promerus, Llc Photoimageable compositions containing thermal base generators
US9690196B2 (en) * 2014-12-30 2017-06-27 Promerus, Llc Photoimageable compositions containing thermal base generators

Also Published As

Publication number Publication date
EP0933681A1 (fr) 1999-08-04
JPH11231520A (ja) 1999-08-27
KR19990066730A (ko) 1999-08-16

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Legal Events

Date Code Title Description
EEER Examination request
FZDE Discontinued