CA2150913A1 - Electrical interconnect structures - Google Patents

Electrical interconnect structures

Info

Publication number
CA2150913A1
CA2150913A1 CA002150913A CA2150913A CA2150913A1 CA 2150913 A1 CA2150913 A1 CA 2150913A1 CA 002150913 A CA002150913 A CA 002150913A CA 2150913 A CA2150913 A CA 2150913A CA 2150913 A1 CA2150913 A1 CA 2150913A1
Authority
CA
Canada
Prior art keywords
substructure
layer
film
onto
depositing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002150913A
Other languages
English (en)
French (fr)
Inventor
Robert Glenn Dorothy
Dean Willett Face
Daniel Bruce Laubacher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2150913A1 publication Critical patent/CA2150913A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/668—Superconducting materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CA002150913A 1992-12-15 1993-12-07 Electrical interconnect structures Abandoned CA2150913A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US99227592A 1992-12-15 1992-12-15
US07/992,275 1992-12-15
US8046393A 1993-06-21 1993-06-21
US08/080,463 1993-06-21

Publications (1)

Publication Number Publication Date
CA2150913A1 true CA2150913A1 (en) 1994-06-23

Family

ID=26763551

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002150913A Abandoned CA2150913A1 (en) 1992-12-15 1993-12-07 Electrical interconnect structures

Country Status (8)

Country Link
US (1) US5567330A (enExample)
EP (1) EP0674808B1 (enExample)
JP (1) JPH08504541A (enExample)
KR (1) KR950704819A (enExample)
CA (1) CA2150913A1 (enExample)
DE (1) DE69309306T2 (enExample)
TW (1) TW245839B (enExample)
WO (1) WO1994014201A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5759625A (en) * 1994-06-03 1998-06-02 E. I. Du Pont De Nemours And Company Fluoropolymer protectant layer for high temperature superconductor film and photo-definition thereof
JP2871516B2 (ja) * 1995-03-22 1999-03-17 株式会社移動体通信先端技術研究所 酸化物超伝導薄膜装置
US5662816A (en) * 1995-12-04 1997-09-02 Lucent Technologies Inc. Signal isolating microwave splitters/combiners
US5932799A (en) * 1997-07-21 1999-08-03 Ysi Incorporated Microfluidic analyzer module
US6293012B1 (en) 1997-07-21 2001-09-25 Ysi Incorporated Method of making a fluid flow module
US6073482A (en) * 1997-07-21 2000-06-13 Ysi Incorporated Fluid flow module
SE9904263L (sv) 1999-11-23 2001-05-24 Ericsson Telefon Ab L M Supraledande substratstruktur och ett förfarande för att producera en sådan struktur
US20050062131A1 (en) * 2003-09-24 2005-03-24 Murduck James Matthew A1/A1Ox/A1 resistor process for integrated circuits
CN105940465B (zh) * 2014-03-07 2017-08-25 住友电气工业株式会社 氧化物超导薄膜线材及其制造方法
JP6789385B2 (ja) 2016-09-13 2020-11-25 グーグル エルエルシー 積層量子デバイス内の損失の低減
JP7003719B2 (ja) * 2018-02-16 2022-02-04 日本電信電話株式会社 磁性材料および磁性素子

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59144190A (ja) * 1983-02-08 1984-08-18 Agency Of Ind Science & Technol 超伝導回路用実装基板
US4474828A (en) * 1983-03-30 1984-10-02 Sperry Corporation Method of controlling the supercurrent of a Josephson junction device
KR900001273B1 (ko) * 1983-12-23 1990-03-05 후지쑤 가부시끼가이샤 반도체 집적회로 장치
JPS61239649A (ja) * 1985-04-13 1986-10-24 Fujitsu Ltd 高速集積回路パツケ−ジ
CA1329952C (en) * 1987-04-27 1994-05-31 Yoshihiko Imanaka Multi-layer superconducting circuit substrate and process for manufacturing same
US4942142A (en) * 1987-07-27 1990-07-17 Sumitomo Electric Industries Ltd. Superconducting thin film and a method for preparing the same
US4980339A (en) * 1987-07-29 1990-12-25 Matsushita Electric Industrial Co., Ltd. Superconductor structure
US4837609A (en) * 1987-09-09 1989-06-06 American Telephone And Telegraph Company, At&T Bell Laboratories Semiconductor devices having superconducting interconnects
JPH01157007A (ja) * 1987-12-11 1989-06-20 Sony Corp 超電導線材
JPH01158757A (ja) * 1987-12-16 1989-06-21 Hitachi Ltd 回路実装構造
JP2598973B2 (ja) * 1988-07-27 1997-04-09 三洋電機株式会社 積層型超電導素子
EP0358879A3 (en) * 1988-09-13 1991-02-27 Hewlett-Packard Company Method of making high density interconnects
US5087605A (en) * 1989-06-01 1992-02-11 Bell Communications Research, Inc. Layered lattice-matched superconducting device and method of making
JPH0710005B2 (ja) * 1989-08-31 1995-02-01 アメリカン テレフォン アンド テレグラフ カムパニー 超伝導体相互接続装置
US5159347A (en) * 1989-11-14 1992-10-27 E-Systems, Inc. Micromagnetic circuit
EP0586558A4 (en) * 1991-05-08 1994-07-13 Superconductor Tech Multichip interconnect module including superconductive materials
EP0538077B1 (en) * 1991-10-18 1996-05-22 Shinko Electric Industries Co. Ltd. Super conducting quantum interference device

Also Published As

Publication number Publication date
EP0674808A1 (en) 1995-10-04
JPH08504541A (ja) 1996-05-14
KR950704819A (ko) 1995-11-20
TW245839B (enExample) 1995-04-21
EP0674808B1 (en) 1997-03-26
DE69309306D1 (de) 1997-04-30
WO1994014201A1 (en) 1994-06-23
US5567330A (en) 1996-10-22
DE69309306T2 (de) 1997-09-04

Similar Documents

Publication Publication Date Title
US4918811A (en) Multichip integrated circuit packaging method
US5168078A (en) Method of making high density semiconductor structure
WO2023122732A1 (en) Direct bonding on package substrates
US4783695A (en) Multichip integrated circuit packaging configuration and method
US5420102A (en) Superconducting films on alkaline earth fluoride substrate with multiple buffer layers
US5449659A (en) Method of bonding multilayer structures of crystalline materials
EP0584410A1 (en) Superconducting electronic structures and methods of preparing same
EP0285445A2 (en) Electric circuit having superconducting multilayered structure and manufacturing method for same
US6216941B1 (en) Method for forming high frequency connections to high temperature superconductor circuits and other fragile materials
US5567330A (en) Electrical interconnect structures and processes
CA2054795C (en) Superconducting device having an extremely thin superconducting channel formed of oxide superconductor material and method for manufacturing the same
JP3027549B2 (ja) 超伝導体ヘテロ−エピタキシャルジョセフソン接合
US5025304A (en) High density semiconductor structure and method of making the same
CA2054597C (en) Superconducting circuit and a process for fabricating the same
US5578226A (en) Multi-layered superconductive interconnects
US6479139B1 (en) Superconducting substrate structure and a method of producing such structure
US5747873A (en) Technique for fabricating hybrid high-temperature superconductor-semiconductor circuits
US5554884A (en) Multilevel metallization process for use in fabricating microelectronic devices
US5646096A (en) Process for fabrication superconducting wiring lines
EP0325408A2 (en) Semiconductor device having an interconnection layer
Afonso et al. Y1Ba2Cu3O7–x multilayer structures with a thick SiO2 interlayer for multichip modules
Paik et al. Studies on the high-temperature superconductor (HTS)/metal/polymer dielectric interconnect structure for packaging applications
JP2644885B2 (ja) 多層回路基板
Cooksey et al. Recent advances in high temperature superconductor multichip modules
Zhang et al. Superconducting multilayer structures with a thick SiO/sub 2/dielectric interlayer for multichip modules

Legal Events

Date Code Title Description
FZDE Discontinued