CA2060941A1 - Systeme servant a usiner des pieces - Google Patents

Systeme servant a usiner des pieces

Info

Publication number
CA2060941A1
CA2060941A1 CA2060941A CA2060941A CA2060941A1 CA 2060941 A1 CA2060941 A1 CA 2060941A1 CA 2060941 A CA2060941 A CA 2060941A CA 2060941 A CA2060941 A CA 2060941A CA 2060941 A1 CA2060941 A1 CA 2060941A1
Authority
CA
Canada
Prior art keywords
workpiece
work
station
orientation
random order
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2060941A
Other languages
English (en)
Other versions
CA2060941C (fr
Inventor
Mary O'connell Litteral
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delco Electronics LLC
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2060941A1 publication Critical patent/CA2060941A1/fr
Application granted granted Critical
Publication of CA2060941C publication Critical patent/CA2060941C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q39/00—Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation
    • B23Q39/04—Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation the sub-assemblies being arranged to operate simultaneously at different stations, e.g. with an annular work-table moved in steps
    • B23Q39/042—Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation the sub-assemblies being arranged to operate simultaneously at different stations, e.g. with an annular work-table moved in steps with circular arrangement of the sub-assemblies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q41/00—Combinations or associations of metal-working machines not directed to a particular result according to classes B21, B23, or B24
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1366—Spraying coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Spray Control Apparatus (AREA)
  • Automatic Assembly (AREA)
  • Multi-Process Working Machines And Systems (AREA)
  • General Factory Administration (AREA)
  • ing And Chemical Polishing (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CA002060941A 1991-02-25 1992-02-10 Systeme servant a usiner des pieces Expired - Fee Related CA2060941C (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US66076191A 1991-02-25 1991-02-25
US07/660,761 1991-02-25
US07/810,820 1991-12-19
US07/810,820 US5271953A (en) 1991-02-25 1991-12-19 System for performing work on workpieces

Publications (2)

Publication Number Publication Date
CA2060941A1 true CA2060941A1 (fr) 1992-08-26
CA2060941C CA2060941C (fr) 1997-12-30

Family

ID=27098174

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002060941A Expired - Fee Related CA2060941C (fr) 1991-02-25 1992-02-10 Systeme servant a usiner des pieces

Country Status (6)

Country Link
US (1) US5271953A (fr)
EP (1) EP0501550B1 (fr)
JP (1) JPH05186886A (fr)
CA (1) CA2060941C (fr)
DE (1) DE69214321D1 (fr)
MX (1) MX9200775A (fr)

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US7048841B2 (en) 1998-12-07 2006-05-23 Semitool, Inc. Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
CN1244722C (zh) * 1998-07-10 2006-03-08 塞米用具公司 采用无电镀和电镀进行镀铜的装置
US6773560B2 (en) 1998-07-10 2004-08-10 Semitool, Inc. Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces
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US6645356B1 (en) 1998-12-07 2003-11-11 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
US6309520B1 (en) * 1998-12-07 2001-10-30 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
TW483950B (en) 1998-12-31 2002-04-21 Semitool Inc Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece
US6296707B1 (en) * 1999-03-17 2001-10-02 Gerber Coburn Optical, Inc. Apparatus for coating a surface of one or more lenses
US7645366B2 (en) * 1999-07-12 2010-01-12 Semitool, Inc. Microelectronic workpiece holders and contact assemblies for use therewith
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US6673216B2 (en) * 1999-08-31 2004-01-06 Semitool, Inc. Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing
US6259519B1 (en) 1999-08-31 2001-07-10 Intelligent Machine Concepts, L.L.C. Method of determining the planar inclination of a surface
US6554212B2 (en) * 2001-02-08 2003-04-29 Ipr Automation Lp Robot spray head for cavity treatment
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US7118658B2 (en) * 2002-05-21 2006-10-10 Semitool, Inc. Electroplating reactor
US20040146461A1 (en) * 2003-01-29 2004-07-29 Vincenzo Giuliano Oral contrast media composition for computerized axial tomographic examinations and method
DE10340916A1 (de) * 2003-09-05 2005-03-31 Sig Technology Ltd. Verfahren und Vorrichtung zur Handhabung von Werkstücken
US7210556B2 (en) * 2004-01-15 2007-05-01 Saipem America Inc. Method and apparatus for installing a sensor array
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US8534959B2 (en) 2005-01-17 2013-09-17 Fairfield Industries Incorporated Method and apparatus for deployment of ocean bottom seismometers
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US20070284350A1 (en) * 2006-06-09 2007-12-13 Gm Global Technology Operations, Inc. System and Method for Reducing Weld Spatter
US7748341B2 (en) * 2006-08-10 2010-07-06 Satisloh North America, Inc. Lens coating apparatus
GB0711697D0 (en) * 2007-06-16 2007-07-25 Rolls Royce Plc Method of manufacture
US7632043B2 (en) * 2007-08-23 2009-12-15 Fairfield Industries Incorporated Seismic sensor transfer device
US7767025B2 (en) * 2007-09-30 2010-08-03 Intel Corporation Nozzle array configuration to facilitate deflux process improvement in chip attach process
US8310899B2 (en) 2008-12-23 2012-11-13 Fairfield Industries Incorporated Multiple receiver line deployment and recovery
US10042068B2 (en) 2008-12-23 2018-08-07 Fairfield Industries Incorporated Conveyance system and method for underwater seismic exploration
WO2013106442A1 (fr) 2012-01-10 2013-07-18 Hzo, Inc. Masques servant à l'application de revêtements de protection sur des ensembles électroniques, ensembles électroniques masqués, et procédés associés
JP2013143563A (ja) 2012-01-10 2013-07-22 Hzo Inc 内部耐水性被覆を備える電子デバイスを組み立てるためのシステム
CN104334287A (zh) 2012-03-23 2015-02-04 Hzo股份有限公司 用于将保护覆层施加至电子装置组件的设备、系统以及方法
CN102689302B (zh) * 2012-05-31 2015-08-19 上海发那科机器人有限公司 一种柔性机器人系统
WO2013192222A2 (fr) * 2012-06-18 2013-12-27 Hzo, Inc. Systèmes et procédés pour appliquer des revêtements de protection sur des surfaces internes de dispositifs électroniques complètement assemblés
WO2013192209A2 (fr) * 2012-06-18 2013-12-27 Hzo, Inc. Appareils, systèmes et procédés pour protéger des ensembles dispositif électronique
DE102012212206A1 (de) * 2012-07-12 2014-01-16 Siemens Aktiengesellschaft Drehteller, Kreisteiltisch, Montagesystem und Betriebsverfahren
US9465078B2 (en) 2012-11-02 2016-10-11 Fairfield Industries, Inc. Battery capacity and durability prediction method
US10449568B2 (en) 2013-01-08 2019-10-22 Hzo, Inc. Masking substrates for application of protective coatings
EP2780935A4 (fr) 2013-01-08 2015-11-11 Hzo Inc Retrait de parties sélectionnées de revêtements protecteurs de substrats
US9894776B2 (en) 2013-01-08 2018-02-13 Hzo, Inc. System for refurbishing or remanufacturing an electronic device
CN104190780B (zh) * 2014-08-25 2016-05-18 华东泰克西汽车铸造有限公司 切削冲孔设备自动控制方法
US9674963B1 (en) * 2015-06-03 2017-06-06 Eric Sari Multilevel machine to process coatings
DE102015117558A1 (de) * 2015-10-15 2017-04-20 Lpkf Laser & Electronics Ag Verfahren zum Herstellen von strukturierten Beschichtungen auf einem Formteil und Vorrichtung zur Durchführung des Verfahrens
CN105289877B (zh) * 2015-11-14 2018-05-29 东莞市新力光表面处理科技有限公司 一种胶条转台式自动喷涂生产线
US9841522B2 (en) 2016-03-31 2017-12-12 Fairfield Industries, Inc. Loading a helical conveyor for underwater seismic exploration
US10114137B2 (en) 2016-03-31 2018-10-30 Fairfield Industries, Inc. Underwater seismic exploration with a helical conveyor and skid structure
US10151848B2 (en) 2016-03-31 2018-12-11 Fairfield Industries, Inc. Helical conveyor for underwater seismic exploration
US10048397B2 (en) 2016-03-31 2018-08-14 Fairfield Industries, Inc. Conveyance system and method for underwater seismic exploration
US10018742B2 (en) 2016-03-31 2018-07-10 Fairfield Industries, Inc. Skid structure for underwater seismic exploration
JP6806638B2 (ja) * 2017-07-03 2021-01-06 株式会社デンソーテン はんだ付け装置およびはんだ付け方法
JP6972062B2 (ja) * 2019-04-12 2021-11-24 株式会社安川電機 生産システム及び制御方法

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Also Published As

Publication number Publication date
US5271953A (en) 1993-12-21
EP0501550A2 (fr) 1992-09-02
MX9200775A (es) 1992-08-01
EP0501550A3 (en) 1993-01-13
JPH05186886A (ja) 1993-07-27
DE69214321D1 (de) 1996-11-14
EP0501550B1 (fr) 1996-10-09
CA2060941C (fr) 1997-12-30

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Legal Events

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EEER Examination request
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