CA2037063A1 - Appareil optique d'usinage - Google Patents

Appareil optique d'usinage

Info

Publication number
CA2037063A1
CA2037063A1 CA2037063A CA2037063A CA2037063A1 CA 2037063 A1 CA2037063 A1 CA 2037063A1 CA 2037063 A CA2037063 A CA 2037063A CA 2037063 A CA2037063 A CA 2037063A CA 2037063 A1 CA2037063 A1 CA 2037063A1
Authority
CA
Canada
Prior art keywords
light
light source
machining apparatus
optical machining
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2037063A
Other languages
English (en)
Other versions
CA2037063C (fr
Inventor
Nobuyuki Zumoto
Toshinori Yagi
Yasuhito Myoi
Yoshie Uchiyama
Masaaki Tanaka
Teruo Miyamoto
Masao Izumo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2114795A external-priority patent/JPH0783950B2/ja
Priority claimed from JP3004817A external-priority patent/JPH04356392A/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CA2037063A1 publication Critical patent/CA2037063A1/fr
Application granted granted Critical
Publication of CA2037063C publication Critical patent/CA2037063C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G03F7/2006—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light using coherent light; using polarised light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/702—Reflective illumination, i.e. reflective optical elements other than folding mirrors, e.g. extreme ultraviolet [EUV] illumination systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
CA002037063A 1990-04-28 1991-02-26 Appareil optique d'usinage Expired - Fee Related CA2037063C (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2114795A JPH0783950B2 (ja) 1989-10-11 1990-04-28 光処理装置
JP114795/90 1990-04-28
JP4817/91 1991-01-21
JP3004817A JPH04356392A (ja) 1991-01-21 1991-01-21 光処理装置

Publications (2)

Publication Number Publication Date
CA2037063A1 true CA2037063A1 (fr) 1991-10-29
CA2037063C CA2037063C (fr) 1995-01-17

Family

ID=26338654

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002037063A Expired - Fee Related CA2037063C (fr) 1990-04-28 1991-02-26 Appareil optique d'usinage

Country Status (3)

Country Link
US (1) US5223693A (fr)
CA (1) CA2037063C (fr)
DE (1) DE4106423C2 (fr)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
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US5362940A (en) * 1990-11-09 1994-11-08 Litel Instruments Use of Fresnel zone plates for material processing
JP2953179B2 (ja) * 1991-05-30 1999-09-27 三菱電機株式会社 光処理装置
DE4143066A1 (de) * 1991-12-27 1993-07-01 Jenoptik Jena Gmbh Verfahren und anordnung zum markieren von oberflaechen
US5310986A (en) * 1992-04-28 1994-05-10 Mitsubishi Denki Kabushiki Kaisha Laser machining apparatus
ES2114943T3 (es) * 1992-07-01 1998-06-16 Litel Instr Inc Uso de placas de zona de fresnel para tratamiento de material.
US6016223A (en) * 1992-08-31 2000-01-18 Canon Kabushiki Kaisha Double bessel beam producing method and apparatus
US5290992A (en) * 1992-10-07 1994-03-01 International Business Machines Corporation Apparatus for maximizing light beam utilization
US5367143A (en) * 1992-12-30 1994-11-22 International Business Machines Corporation Apparatus and method for multi-beam drilling
JP3211525B2 (ja) * 1993-04-22 2001-09-25 オムロン株式会社 薄材メッシュ、その製造方法及びその製造装置
US5294774A (en) * 1993-08-03 1994-03-15 Videojet Systems International, Inc. Laser marker system
US5481407A (en) * 1993-09-14 1996-01-02 Litel Instruments Apparatus and process for using Fresnel zone plate array for processing materials
KR100259969B1 (ko) * 1993-09-30 2000-06-15 로버트 피. 아킨즈 전필드마스크 조사 강화방법 및 장치
US5645740A (en) * 1993-11-01 1997-07-08 Naiman; Charles S. System and assemblage for producing microtexturized substrates and implants
US5558788A (en) * 1993-11-30 1996-09-24 Martin Marietta Energy Systems, Inc. Dual beam optical system for pulsed laser ablation film deposition
US5571429A (en) * 1994-02-25 1996-11-05 Litel Instruments Apparatus and process for high speed laminate processing with computer generated holograms
US5539175A (en) * 1994-03-21 1996-07-23 Litel Instruments Apparatus and process for optically ablated openings having designed profile
JP3209641B2 (ja) * 1994-06-02 2001-09-17 三菱電機株式会社 光加工装置及び方法
JPH0866781A (ja) * 1994-08-30 1996-03-12 Mitsubishi Electric Corp エキシマレーザビーム照射装置
CA2217018C (fr) 1995-04-26 2006-10-17 Minnesota Mining And Manufacturing Company Procede et dispositif permettant d'effectuer des expositions iteratives
DE69618318T2 (de) * 1995-10-11 2002-08-14 Sanyo Electric Co., Ltd. Verfahren und Vorrichtung zur optischen Behandlung
DE59609763D1 (de) * 1995-12-19 2002-11-07 Bayerische Motoren Werke Ag Verfahren zur ausbildung einer anrissstelle zum bruchtrennen eines bauteils, insbesondere pleuel für brennkraftmaschinen
WO1997038356A1 (fr) * 1996-04-10 1997-10-16 Asm Lithography B.V. Appareil photolithographique
DE19626176A1 (de) * 1996-06-29 1998-01-08 Deutsche Forsch Luft Raumfahrt Lithographie-Belichtungseinrichtung und Lithographie-Verfahren
WO1998021629A2 (fr) * 1996-11-15 1998-05-22 Diffraction, Ltd. Masque holographique en ligne destine au micro-usinage
US5756236A (en) * 1997-01-29 1998-05-26 International Business Machines Corporation Fabrication of high resolution aluminum ablation masks
DE19724061C2 (de) * 1997-06-07 2001-11-22 Univ Stuttgart Strahlwerkzeuge Vorrichtung zur Laserbearbeitung eines Werkstückes
JP3751772B2 (ja) * 1999-08-16 2006-03-01 日本電気株式会社 半導体薄膜製造装置
US6847029B2 (en) * 2000-07-27 2005-01-25 Zetetic Institute Multiple-source arrays with optical transmission enhanced by resonant cavities
US7194803B2 (en) * 2001-07-05 2007-03-27 Flowserve Management Company Seal ring and method of forming micro-topography ring surfaces with a laser
KR100700641B1 (ko) * 2004-12-03 2007-03-27 삼성에스디아이 주식회사 레이저 조사 장치, 패터닝 방법 및 그를 이용한 레이저열전사 패터닝 방법과 이를 이용한 유기 전계 발광 소자의제조 방법
DE102006059818B4 (de) * 2006-12-11 2017-09-14 Kleo Ag Belichtungsanlage
US8139199B2 (en) * 2007-04-02 2012-03-20 Nikon Corporation Exposure method, exposure apparatus, light converging pattern formation member, mask, and device manufacturing method
US20100129617A1 (en) * 2008-11-21 2010-05-27 Corrigan Thomas R Laser ablation tooling via sparse patterned masks
DE102009032210B4 (de) 2009-07-03 2011-06-09 Kleo Ag Bearbeitungsanlage
TWI565990B (zh) * 2013-01-14 2017-01-11 鴻海精密工業股份有限公司 光耦合透鏡
RU2661977C1 (ru) * 2014-07-03 2018-07-23 Ниппон Стил Энд Сумитомо Метал Корпорейшн Устройство лазерной обработки
US10260941B2 (en) * 2016-10-04 2019-04-16 Precitec Optronik Gmbh Chromatic confocal distance sensor

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1765145C3 (de) * 1968-04-09 1973-11-29 Siemens Ag, 1000 Berlin U. 8000 Muenchen Verfahren zum Bearbeiten dunner Schichten von elektrischen Schalt kreisen mit Laserstrahlen
US3588435A (en) * 1968-05-28 1971-06-28 Square D Co Solid-state heat control and initiating circuit for a resistance welder control
US3545733A (en) * 1969-04-21 1970-12-08 Leeming Anderson Kiln for heat treatment of articles on a continuous basis
US3742182A (en) * 1971-12-27 1973-06-26 Coherent Radiation Method for scanning mask forming holes with a laser beam
US4390994A (en) * 1980-07-14 1983-06-28 Roberts James R Laser utilizing coated, multicapillary array as output window
US4480168A (en) * 1982-03-29 1984-10-30 Canadian Patents & Development Limited Laser-surface coupler
DE3639580A1 (de) * 1985-11-20 1987-05-21 Mitsubishi Electric Corp Laseranordnung
JPS63220991A (ja) * 1987-03-06 1988-09-14 Semiconductor Energy Lab Co Ltd 光加工方法

Also Published As

Publication number Publication date
DE4106423A1 (de) 1991-10-31
DE4106423C2 (de) 1995-08-24
US5223693A (en) 1993-06-29
CA2037063C (fr) 1995-01-17

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Legal Events

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