CA2033081A1 - Circuit tridimensionnel et methode d'assemblage - Google Patents
Circuit tridimensionnel et methode d'assemblageInfo
- Publication number
- CA2033081A1 CA2033081A1 CA002033081A CA2033081A CA2033081A1 CA 2033081 A1 CA2033081 A1 CA 2033081A1 CA 002033081 A CA002033081 A CA 002033081A CA 2033081 A CA2033081 A CA 2033081A CA 2033081 A1 CA2033081 A1 CA 2033081A1
- Authority
- CA
- Canada
- Prior art keywords
- carrier
- electrical
- circuit component
- recited
- component assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/023—Stackable modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US35576589A | 1989-05-19 | 1989-05-19 | |
US355,765 | 1989-05-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2033081A1 true CA2033081A1 (fr) | 1990-11-20 |
Family
ID=23398753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002033081A Abandoned CA2033081A1 (fr) | 1989-05-19 | 1990-05-18 | Circuit tridimensionnel et methode d'assemblage |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0428695A4 (fr) |
JP (1) | JPH03506105A (fr) |
CA (1) | CA2033081A1 (fr) |
WO (1) | WO1990015478A2 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4198498B2 (ja) * | 2003-03-24 | 2008-12-17 | 株式会社モリテックス | 環状斜光照明装置の製造方法とフレキシブル配線基板 |
US7112877B2 (en) * | 2004-06-28 | 2006-09-26 | General Electric Company | High density package with wrap around interconnect |
JP4400673B2 (ja) * | 2007-12-13 | 2010-01-20 | 住友金属鉱山株式会社 | 立体的回路基板の形成装置および形成方法 |
DE102008017155B4 (de) * | 2008-04-03 | 2016-08-11 | Siemens Healthcare Gmbh | Haltevorrichtung für Leiterplatten auf gekrümmten Flächen |
JP2012156528A (ja) * | 2012-03-22 | 2012-08-16 | Spansion Llc | 積層型半導体装置及び積層型半導体装置の製造方法 |
DE102012205439A1 (de) * | 2012-04-03 | 2013-10-10 | Zf Friedrichshafen Ag | Schaltungsträger und Verfahren zur Herstellung desselben |
US9407021B2 (en) * | 2013-12-29 | 2016-08-02 | Continental Automotive Systems, Inc. | Compound cylinder PCB connection |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3065384A (en) * | 1959-12-18 | 1962-11-20 | Burroughs Corp | Modularized electrical network assembly |
US3596140A (en) * | 1969-12-01 | 1971-07-27 | Ronald A Walsh | Demountable peripheral-contact electronic circuit board assembly |
AT324470B (de) * | 1972-11-02 | 1975-09-10 | Gossen Gmbh | Anordnung zür verdrahtung von elektrischen drehschaltern mit mehreren schaltebenen |
US4868712A (en) * | 1987-02-04 | 1989-09-19 | Woodman John K | Three dimensional integrated circuit package |
US4833568A (en) * | 1988-01-29 | 1989-05-23 | Berhold G Mark | Three-dimensional circuit component assembly and method corresponding thereto |
-
1990
- 1990-05-18 CA CA002033081A patent/CA2033081A1/fr not_active Abandoned
- 1990-05-18 WO PCT/US1990/002757 patent/WO1990015478A2/fr not_active Application Discontinuation
- 1990-05-18 EP EP19900909290 patent/EP0428695A4/en not_active Withdrawn
- 1990-05-18 JP JP2508740A patent/JPH03506105A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO1990015478A3 (fr) | 1991-03-21 |
WO1990015478A2 (fr) | 1990-12-13 |
EP0428695A4 (en) | 1991-12-27 |
EP0428695A1 (fr) | 1991-05-29 |
JPH03506105A (ja) | 1991-12-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FZDE | Dead |