CA2033081A1 - Circuit tridimensionnel et methode d'assemblage - Google Patents

Circuit tridimensionnel et methode d'assemblage

Info

Publication number
CA2033081A1
CA2033081A1 CA002033081A CA2033081A CA2033081A1 CA 2033081 A1 CA2033081 A1 CA 2033081A1 CA 002033081 A CA002033081 A CA 002033081A CA 2033081 A CA2033081 A CA 2033081A CA 2033081 A1 CA2033081 A1 CA 2033081A1
Authority
CA
Canada
Prior art keywords
carrier
electrical
circuit component
recited
component assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002033081A
Other languages
English (en)
Inventor
G. Mark Berhold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TROVE TECHNOLOGY Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2033081A1 publication Critical patent/CA2033081A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/023Stackable modules
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/046Planar parts of folded PCBs making an angle relative to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09018Rigid curved substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/09418Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10515Stacked components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
CA002033081A 1989-05-19 1990-05-18 Circuit tridimensionnel et methode d'assemblage Abandoned CA2033081A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35576589A 1989-05-19 1989-05-19
US355,765 1989-05-19

Publications (1)

Publication Number Publication Date
CA2033081A1 true CA2033081A1 (fr) 1990-11-20

Family

ID=23398753

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002033081A Abandoned CA2033081A1 (fr) 1989-05-19 1990-05-18 Circuit tridimensionnel et methode d'assemblage

Country Status (4)

Country Link
EP (1) EP0428695A4 (fr)
JP (1) JPH03506105A (fr)
CA (1) CA2033081A1 (fr)
WO (1) WO1990015478A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4198498B2 (ja) * 2003-03-24 2008-12-17 株式会社モリテックス 環状斜光照明装置の製造方法とフレキシブル配線基板
US7112877B2 (en) * 2004-06-28 2006-09-26 General Electric Company High density package with wrap around interconnect
JP4400673B2 (ja) * 2007-12-13 2010-01-20 住友金属鉱山株式会社 立体的回路基板の形成装置および形成方法
DE102008017155B4 (de) * 2008-04-03 2016-08-11 Siemens Healthcare Gmbh Haltevorrichtung für Leiterplatten auf gekrümmten Flächen
JP2012156528A (ja) * 2012-03-22 2012-08-16 Spansion Llc 積層型半導体装置及び積層型半導体装置の製造方法
DE102012205439A1 (de) * 2012-04-03 2013-10-10 Zf Friedrichshafen Ag Schaltungsträger und Verfahren zur Herstellung desselben
US9407021B2 (en) * 2013-12-29 2016-08-02 Continental Automotive Systems, Inc. Compound cylinder PCB connection

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3065384A (en) * 1959-12-18 1962-11-20 Burroughs Corp Modularized electrical network assembly
US3596140A (en) * 1969-12-01 1971-07-27 Ronald A Walsh Demountable peripheral-contact electronic circuit board assembly
AT324470B (de) * 1972-11-02 1975-09-10 Gossen Gmbh Anordnung zür verdrahtung von elektrischen drehschaltern mit mehreren schaltebenen
US4868712A (en) * 1987-02-04 1989-09-19 Woodman John K Three dimensional integrated circuit package
US4833568A (en) * 1988-01-29 1989-05-23 Berhold G Mark Three-dimensional circuit component assembly and method corresponding thereto

Also Published As

Publication number Publication date
WO1990015478A3 (fr) 1991-03-21
WO1990015478A2 (fr) 1990-12-13
EP0428695A4 (en) 1991-12-27
EP0428695A1 (fr) 1991-05-29
JPH03506105A (ja) 1991-12-26

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Legal Events

Date Code Title Description
FZDE Dead