WO1990015478A3 - Assemblage ameliore tridimensionnel de composants de circuit, et methode associee - Google Patents

Assemblage ameliore tridimensionnel de composants de circuit, et methode associee Download PDF

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Publication number
WO1990015478A3
WO1990015478A3 PCT/US1990/002757 US9002757W WO9015478A3 WO 1990015478 A3 WO1990015478 A3 WO 1990015478A3 US 9002757 W US9002757 W US 9002757W WO 9015478 A3 WO9015478 A3 WO 9015478A3
Authority
WO
WIPO (PCT)
Prior art keywords
carrier package
circuit component
carrier
package assembly
improved
Prior art date
Application number
PCT/US1990/002757
Other languages
English (en)
Other versions
WO1990015478A2 (fr
Inventor
G Mark Berhold
Original Assignee
Trove Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trove Technology Inc filed Critical Trove Technology Inc
Publication of WO1990015478A2 publication Critical patent/WO1990015478A2/fr
Publication of WO1990015478A3 publication Critical patent/WO1990015478A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/023—Stackable modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Abstract

Plusieurs boîtiers porteurs (71) de composants de circuit en forme de plaque sont empilés adjacents entre eux avec leurs faces plates (72, 74) en contact pour former un ensemble de boîtiers porteurs (40). Chaque boîtier porteur loge un ou plusieurs composants de circuit électrique (110) couplés à des contacts électriques (84, 86) sur les faces plates et à des contacts électriques (98) ou des broches droites (424, 436) prévues sur les côtés. Ces broches coopèrent avec celles des boîtiers porteurs adjacents pour effectuer une connexion électrique avec les composants des circuits. Une plaquette à circuit imprimé flexible (50) ayant un réseau de sites de contact (52) interconnectés sélectivement par des traces imprimées de routage (54) entoure l'assemblage de boîtier porteur. Les extrémités de l'assemblage de boîtier porteur sont pourvues de blocs connecteurs de support et d'interconnexion électrique (22, 16). Plusieurs assemblages de boîtier porteur peuvent être interconnectés directement, par emboîtement, ou par l'intermédiaire de structures intermédiaires de connexion.
PCT/US1990/002757 1989-05-19 1990-05-18 Assemblage ameliore tridimensionnel de composants de circuit, et methode associee WO1990015478A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35576589A 1989-05-19 1989-05-19
US355,765 1989-05-19

Publications (2)

Publication Number Publication Date
WO1990015478A2 WO1990015478A2 (fr) 1990-12-13
WO1990015478A3 true WO1990015478A3 (fr) 1991-03-21

Family

ID=23398753

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1990/002757 WO1990015478A2 (fr) 1989-05-19 1990-05-18 Assemblage ameliore tridimensionnel de composants de circuit, et methode associee

Country Status (4)

Country Link
EP (1) EP0428695A4 (fr)
JP (1) JPH03506105A (fr)
CA (1) CA2033081A1 (fr)
WO (1) WO1990015478A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4198498B2 (ja) * 2003-03-24 2008-12-17 株式会社モリテックス 環状斜光照明装置の製造方法とフレキシブル配線基板
US7112877B2 (en) * 2004-06-28 2006-09-26 General Electric Company High density package with wrap around interconnect
JP4400673B2 (ja) * 2007-12-13 2010-01-20 住友金属鉱山株式会社 立体的回路基板の形成装置および形成方法
DE102008017155B4 (de) * 2008-04-03 2016-08-11 Siemens Healthcare Gmbh Haltevorrichtung für Leiterplatten auf gekrümmten Flächen
JP2012156528A (ja) * 2012-03-22 2012-08-16 Spansion Llc 積層型半導体装置及び積層型半導体装置の製造方法
DE102012205439A1 (de) * 2012-04-03 2013-10-10 Zf Friedrichshafen Ag Schaltungsträger und Verfahren zur Herstellung desselben
US9407021B2 (en) * 2013-12-29 2016-08-02 Continental Automotive Systems, Inc. Compound cylinder PCB connection

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3065384A (en) * 1959-12-18 1962-11-20 Burroughs Corp Modularized electrical network assembly
US3596140A (en) * 1969-12-01 1971-07-27 Ronald A Walsh Demountable peripheral-contact electronic circuit board assembly
US4868712A (en) * 1987-02-04 1989-09-19 Woodman John K Three dimensional integrated circuit package

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT324470B (de) * 1972-11-02 1975-09-10 Gossen Gmbh Anordnung zür verdrahtung von elektrischen drehschaltern mit mehreren schaltebenen
US4833568A (en) * 1988-01-29 1989-05-23 Berhold G Mark Three-dimensional circuit component assembly and method corresponding thereto

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3065384A (en) * 1959-12-18 1962-11-20 Burroughs Corp Modularized electrical network assembly
US3596140A (en) * 1969-12-01 1971-07-27 Ronald A Walsh Demountable peripheral-contact electronic circuit board assembly
US4868712A (en) * 1987-02-04 1989-09-19 Woodman John K Three dimensional integrated circuit package

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP0428695A4 *

Also Published As

Publication number Publication date
WO1990015478A2 (fr) 1990-12-13
CA2033081A1 (fr) 1990-11-20
EP0428695A4 (en) 1991-12-27
EP0428695A1 (fr) 1991-05-29
JPH03506105A (ja) 1991-12-26

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