CA2021682A1 - Chip-carrier with alpha ray shield - Google Patents

Chip-carrier with alpha ray shield

Info

Publication number
CA2021682A1
CA2021682A1 CA 2021682 CA2021682A CA2021682A1 CA 2021682 A1 CA2021682 A1 CA 2021682A1 CA 2021682 CA2021682 CA 2021682 CA 2021682 A CA2021682 A CA 2021682A CA 2021682 A1 CA2021682 A1 CA 2021682A1
Authority
CA
Canada
Prior art keywords
chip
carrier
alpha ray
ray shield
alpha
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA 2021682
Other languages
French (fr)
Other versions
CA2021682C (en
Inventor
Yukio Yamaguchi
Mutsuo Tsuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP18755289A external-priority patent/JPH0353549A/en
Priority claimed from JP3208790A external-priority patent/JP2836166B2/en
Priority claimed from JP2042933A external-priority patent/JP2570880B2/en
Application filed by Individual filed Critical Individual
Publication of CA2021682A1 publication Critical patent/CA2021682A1/en
Application granted granted Critical
Publication of CA2021682C publication Critical patent/CA2021682C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

In a chip-carrier provided with a chip-carrier substrate, a chip-carrier cover and an IC chip, said IC chip being arranged at a distance from a circuit surface of the IC
chip being directed toward the chip-carrier substrate, an .alpha.-ray shielding film made of film material containing few radioactive elements, and adhered to a surface of the chip-carrier substrate facing the IC chip or to the circuit surface of the IC chip is provided for protecting the IC chip from soft errors caused by .alpha.-rays.
CA 2021682 1989-07-21 1990-07-20 Chip-carrier with alpha ray shield Expired - Fee Related CA2021682C (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP18755289A JPH0353549A (en) 1989-07-21 1989-07-21 Chip carrier type semiconductor device
JP187552/1989 1989-07-21
JP32087/1990 1990-02-13
JP3208790A JP2836166B2 (en) 1990-02-13 1990-02-13 Chip carrier
JP2042933A JP2570880B2 (en) 1990-02-22 1990-02-22 Chip carrier
JP42933/1990 1990-02-22

Publications (2)

Publication Number Publication Date
CA2021682A1 true CA2021682A1 (en) 1991-01-22
CA2021682C CA2021682C (en) 1995-01-03

Family

ID=27287579

Family Applications (1)

Application Number Title Priority Date Filing Date
CA 2021682 Expired - Fee Related CA2021682C (en) 1989-07-21 1990-07-20 Chip-carrier with alpha ray shield

Country Status (2)

Country Link
CA (1) CA2021682C (en)
FR (1) FR2650121B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114942493A (en) * 2022-05-05 2022-08-26 武汉光迅科技股份有限公司 Chip assembly, optical device and assembly method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588356A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Semiconductor device
JPS55128851A (en) * 1979-03-28 1980-10-06 Hitachi Ltd Semiconductor memory device
JPS6015152B2 (en) * 1980-01-09 1985-04-17 株式会社日立製作所 Resin-encapsulated semiconductor memory device
JPS5931045A (en) * 1982-04-16 1984-02-18 Mitsubishi Electric Corp Resin sealed type semiconductor device and manufacture thereof
JPS59127843A (en) * 1983-01-12 1984-07-23 Fujitsu Ltd Manufacture of semiconductor device
US4709301A (en) * 1985-09-05 1987-11-24 Nec Corporation Package
JPH0638458B2 (en) * 1985-09-12 1994-05-18 日本電気株式会社 Chip carrier and method of manufacturing the same
JPS6376444A (en) * 1986-09-19 1988-04-06 Nec Corp Chip carrier
JPS6390843A (en) * 1986-10-03 1988-04-21 Nec Corp Structure for mounting integrated circuit
JPS63229726A (en) * 1987-03-18 1988-09-26 Nec Corp Hybrid integrated circuit device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114942493A (en) * 2022-05-05 2022-08-26 武汉光迅科技股份有限公司 Chip assembly, optical device and assembly method
CN114942493B (en) * 2022-05-05 2024-01-30 武汉光迅科技股份有限公司 Chip assembly, optical device and assembly method

Also Published As

Publication number Publication date
CA2021682C (en) 1995-01-03
FR2650121A1 (en) 1991-01-25
FR2650121B1 (en) 1997-07-25

Similar Documents

Publication Publication Date Title
JPS5588356A (en) Semiconductor device
DE69033241D1 (en) Protect an integrated circuit chip with a conductive shield
EP0097833A3 (en) Substrate for integrated circuit packages
DE3275789D1 (en) Substrate for mounting integrated circuit chips
FR2533369B1 (en) PROTECTION CIRCUIT FOR INTEGRATED CIRCUIT DEVICES AND SEMICONDUCTOR STRUCTURE FOR PROTECTING AN INTEGRATED CIRCUIT
DE3474885D1 (en) A semiconductor device comprising an alpha-rays shielding layer
FR2574978B1 (en) DEVICE FOR IRRADIATION OF MATERIAL BY AN ELECTRONIC BEAM
JPS55166943A (en) Semiconductor device
CA2021682A1 (en) Chip-carrier with alpha ray shield
HK1006804A1 (en) Packaging curable materials
JPS57100467A (en) Ic substrate for active matrix display body
DE3167889D1 (en) Particle or luminous radiation impact localisation device and cathode ray oscilloscope comprising such a device
JPS52127597A (en) Sheet shielding material of radioactive ray with flexibility
JPS577144A (en) Semiconductor device
JPS5636136A (en) Semiconductor device
EP0181737A3 (en) Method of fabricating integrated circuits incorporating steps to detect presence of gettering sites
PT79354A (en) Contact device for protection of electronic components against el ectromagnetic radiations
JPS55128845A (en) Semiconductor device
JPS5626448A (en) Semiconductor device
JPS5785240A (en) Semiconductor device
JPS5694650A (en) Resin-sealed semiconductor device
JPS5552246A (en) Semiconductor device
JPS5739557A (en) Semiconductor device
JPS55140250A (en) Semiconductor device
DE3065954D1 (en) Integrated circuit with alpha radiation shielding means

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed