CA2012670A1 - Film multicouche et stratifie utilises dans la fabrication des cartes de circuits imprimes - Google Patents
Film multicouche et stratifie utilises dans la fabrication des cartes de circuits imprimesInfo
- Publication number
- CA2012670A1 CA2012670A1 CA2012670A CA2012670A CA2012670A1 CA 2012670 A1 CA2012670 A1 CA 2012670A1 CA 2012670 A CA2012670 A CA 2012670A CA 2012670 A CA2012670 A CA 2012670A CA 2012670 A1 CA2012670 A1 CA 2012670A1
- Authority
- CA
- Canada
- Prior art keywords
- pounds
- width
- printed circuit
- multilayer film
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31507—Of polycarbonate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
- Y10T428/3175—Next to addition polymer from unsaturated monomer[s]
- Y10T428/31757—Polymer of monoethylenically unsaturated hydrocarbon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
- Y10T428/31797—Next to addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31909—Next to second addition polymer from unsaturated monomers
- Y10T428/31913—Monoolefin polymer
Abstract
Pellicule multicouche dont l'une des couches de surface est une couche de support contenant une résine thermoplastique, apte à supporter des températures allant jusqu'à 200 degrés C sans ramollir; l'autre couche de surface est un couche adhésive à base d'une résine thermoplastique, dont le point de fusion se situe dans une plage de 100-200 degrés C. On peut, facultativement, utiliser une couche de liaison entre la couche de support et la couche adhésive. La pellicule multicouche est utile comme feuille protectrice de transport pour les substrats métalliques destinés à la production de plaquettes de circuits imprimés. La feuille protectrice assure temporairement une protection de surface pelable pour le substrat métallique, empêchant ainsi la contamination et l'altération physique du substrat aussi bien avant que pendant la formation de ces plaquettes de circuits imprimés. L'adhérence de la feuille protectrice au substrat métallique, mesurée à l'aide d'un essai de pelage à 180 degrés, est inférieure à 0,4 lb/po de largeur, et supérieure à 0,005 lb/po de largeur (0,18 à 0,002 kg/2,54 cm de largeur), et préférablement inférieure à 0,1 lb/po de largeur et supérieure à 0,01 lb/po de largeur (0,05 à 0,005 kg/2,54 cm de largeur).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US326,931 | 1989-03-22 | ||
US07/326,931 US5057372A (en) | 1989-03-22 | 1989-03-22 | Multilayer film and laminate for use in producing printed circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2012670A1 true CA2012670A1 (fr) | 1990-09-22 |
CA2012670C CA2012670C (fr) | 1999-04-27 |
Family
ID=23274380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002012670A Expired - Fee Related CA2012670C (fr) | 1989-03-22 | 1990-03-21 | Film multicouche et stratifie utilises dans la fabrication des cartes de circuits imprimes |
Country Status (10)
Country | Link |
---|---|
US (1) | US5057372A (fr) |
EP (1) | EP0464144B1 (fr) |
JP (1) | JP3142554B2 (fr) |
KR (1) | KR0168034B1 (fr) |
AT (1) | ATE156420T1 (fr) |
CA (1) | CA2012670C (fr) |
DE (1) | DE69031216T2 (fr) |
DK (1) | DK0464144T3 (fr) |
ES (1) | ES2104603T3 (fr) |
WO (1) | WO1990011182A1 (fr) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5178924A (en) * | 1991-06-17 | 1993-01-12 | Minnesota Mining And Manufacturing Company | Release liner |
US5413838A (en) * | 1991-06-18 | 1995-05-09 | Sumitomo Bakelite Company Limited | Both-side roughened copper foil with protection film |
US5153050A (en) * | 1991-08-27 | 1992-10-06 | Johnston James A | Component of printed circuit boards |
US5822856A (en) * | 1996-06-28 | 1998-10-20 | International Business Machines Corporation | Manufacturing circuit board assemblies having filled vias |
US5858550A (en) * | 1997-02-06 | 1999-01-12 | Alliedsignal Inc. | High temperature release films |
US6129998A (en) * | 1998-04-10 | 2000-10-10 | R.E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
US6355360B1 (en) | 1998-04-10 | 2002-03-12 | R.E. Service Company, Inc. | Separator sheet laminate for use in the manufacture of printed circuit boards |
US6129990A (en) * | 1998-04-10 | 2000-10-10 | R. E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
US6127051A (en) * | 1998-04-10 | 2000-10-03 | R. E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
US6183880B1 (en) * | 1998-08-07 | 2001-02-06 | Mitsui Mining & Smelting Co., Ltd. | Composite foil of aluminum and copper |
US6770380B2 (en) | 1998-08-11 | 2004-08-03 | Nikko Materials Usa, Inc. | Resin/copper/metal laminate and method of producing same |
WO2000018555A1 (fr) | 1998-10-01 | 2000-04-06 | Airtech International, Inc. | Procede de moulage ou de durcissement d'une matiere de resine a des temperatures elevees au moyen d'un film de separation multicouche |
US6372364B1 (en) | 1999-08-18 | 2002-04-16 | Microcoating Technologies, Inc. | Nanostructure coatings |
JP4300687B2 (ja) * | 1999-10-28 | 2009-07-22 | 味の素株式会社 | 接着フィルムを用いた多層プリント配線板の製造法 |
US6783860B1 (en) | 2001-05-11 | 2004-08-31 | R. E. Service Company, Inc. | Laminated entry and exit material for drilling printed circuit boards |
US6921451B2 (en) * | 2002-06-28 | 2005-07-26 | Metallized Products, Inc. | Method of and apparatus for protecting thin copper foil and other shiny substrates during handling and rigorous processing, as pcb manufacture and the like, by electric-charge adherence thereto of thin release-layered plastic films and the like, and improved products produced thereby |
US6638607B1 (en) | 2002-10-30 | 2003-10-28 | International Business Machines Corporation | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements |
WO2004060033A1 (fr) * | 2002-12-24 | 2004-07-15 | Sentrex Company | Produit multicouche pour fabriquer des cartes de circuits imprimes |
US20050112344A1 (en) * | 2003-08-20 | 2005-05-26 | Redfern Sean M. | Apparatus and method for use in printed circuit board drilling applications |
BRPI0415579A (pt) * | 2003-10-17 | 2007-01-02 | Du Pont | estrutura em multicamadas, embalagem e processo |
KR101065975B1 (ko) | 2003-12-26 | 2011-09-19 | 세키스이가가쿠 고교가부시키가이샤 | 이형 필름 |
US8129009B2 (en) * | 2004-04-13 | 2012-03-06 | E. I. Du Pont De Nemours And Company | Composition comprising ethylene copolymer |
US20060222796A1 (en) * | 2005-04-04 | 2006-10-05 | Morris Barry A | Structure comprising metallized film and ethylene copolymer |
WO2009045932A1 (fr) | 2007-09-28 | 2009-04-09 | Tri-Star Laminates, Inc. | Meilleurs systèmes et procédés de perçage de trous dans des cartes à circuit imprimé |
CN101457128A (zh) * | 2007-12-14 | 2009-06-17 | 3M创新有限公司 | 复合高温胶带及其制造方法 |
DE102009054435A1 (de) | 2009-11-25 | 2011-05-26 | Kechter, Andreas, Dipl.-Ing. | Heizbarer Gassensor und Verfahren zu dessen Herstellung |
KR101234974B1 (ko) * | 2011-03-07 | 2013-02-20 | (주)인터플렉스 | 연성인쇄회로기판 커버레이 적층용 이형필름 |
EP2828901B1 (fr) | 2012-03-21 | 2017-01-04 | Parker Hannifin Corporation | Procédés de fabrication de rouleau à rouleau pour la production de dispositifs à polymère électroactif autoréparant |
WO2013155377A1 (fr) | 2012-04-12 | 2013-10-17 | Bayer Materialscience Ag | Transducteurs eap à performances améliorées |
US9954159B2 (en) | 2012-08-16 | 2018-04-24 | Parker-Hannifin Corporation | Electrical interconnect terminals for rolled dielectric elastomer transducers |
TW201436311A (zh) * | 2012-10-16 | 2014-09-16 | 拜耳智慧財產有限公司 | 金屬化介電膜之方法 |
US9889628B2 (en) | 2013-11-18 | 2018-02-13 | Hyundai Motor Company | Low specific gravity and high stiffness sandwich type steel sheet and method for manufacturing the same |
KR102055523B1 (ko) * | 2019-05-23 | 2019-12-12 | 임용범 | 플라스틱 소재 열성형공정용 보호테이프, 이 보호테이프의 제조방법 및, 이 보호테이프을 이용한 플라스틱 소재의 열성형방법 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3544662A (en) * | 1966-11-02 | 1970-12-01 | Celanese Corp | High-melting polymer compositions comprising a 3-methyl-1-butene polymer and another polyolefin |
JPS5517507B2 (fr) * | 1972-06-29 | 1980-05-12 | ||
US3892900A (en) * | 1972-11-02 | 1975-07-01 | Daicel Ltd | Masking films |
JPS5278069A (en) * | 1975-12-24 | 1977-07-01 | Fuji Kinzoku Kakou Kk | Printed circuit board |
US4182457A (en) * | 1976-08-10 | 1980-01-08 | Toyo Seikan Kaisha Limited | Multilayer container |
CH613152A5 (en) * | 1976-08-13 | 1979-09-14 | Uop Inc | Process for producing a metallised laminate |
US4241129A (en) * | 1978-12-15 | 1980-12-23 | The Dow Chemical Company | Delamination resistant multilayer metal/polymer composites |
AU533447B2 (en) * | 1978-12-18 | 1983-11-24 | Asahi Kasei Kogyo Kabushiki Kaisha | Stretching multi layer film |
JPS56111637A (en) * | 1979-08-22 | 1981-09-03 | Hitachi Chem Co Ltd | Production of adhesive-coated laminated sheet |
US4386991A (en) * | 1980-02-18 | 1983-06-07 | Mitsui Petrochemical Industries, Ltd. | Method of bonding 4-methyl-1-pentene polymers |
US4455181A (en) * | 1980-09-22 | 1984-06-19 | General Electric Company | Method of transfer lamination of copper thin sheets and films |
JPS5758396A (en) * | 1980-09-25 | 1982-04-08 | Kanegafuchi Chemical Ind | Method of producing metal foil lined laminated board |
JPS5770653A (en) * | 1980-10-22 | 1982-05-01 | Mitsubishi Gas Chemical Co | Manufacture of laminated board |
JPS5770654A (en) * | 1980-10-22 | 1982-05-01 | Mitsubishi Gas Chemical Co | Manufacture of laminated board |
DE3116078A1 (de) * | 1981-04-22 | 1983-01-20 | IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen | "praegefolie" |
JPS58128846A (ja) * | 1982-01-26 | 1983-08-01 | 東芝ケミカル株式会社 | ポリイミド系樹脂片面銅張積層板の製造方法 |
JPS6028442A (ja) * | 1983-07-26 | 1985-02-13 | Mitsui Petrochem Ind Ltd | ポリ4−メチル−1−ペンテンフイルム |
US4617207A (en) * | 1983-08-15 | 1986-10-14 | Mitsui Toatsu Chemicals, Incorporated | Thermoplastic resin sheet |
IL73386A0 (en) * | 1984-01-09 | 1985-01-31 | Stauffer Chemical Co | Transfer laminate and method of forming an electrical circuit pattern therewith |
US4857400A (en) * | 1984-02-22 | 1989-08-15 | Gila River Products, Inc. | Stratiform press pads and methods for use thereof in laminating flexible printed circuits |
US4690845A (en) * | 1984-02-22 | 1987-09-01 | Gila River Products, Inc. | Method and apparatus for laminating flexible printed circuits |
US4604324A (en) * | 1984-09-28 | 1986-08-05 | Mobil Oil Corporation | Multi-layer polypropylene film structure and method of forming the same |
US4753847A (en) * | 1984-10-01 | 1988-06-28 | Martin J. Wilheim | Mold release sheet laminate |
US4883718A (en) * | 1985-02-12 | 1989-11-28 | Mitsui Toatsu Chemicals, Inc. | Flexible copper-clad circuit substrate |
US4861648A (en) * | 1988-03-14 | 1989-08-29 | Gila River Products, Inc. | Materials for laminating flexible printed circuits |
CA1296833C (fr) * | 1988-04-05 | 1992-03-03 | Erica Marie-Jose Besso | Feuille de demoulage en polymethylpentene |
JPH0325996A (ja) * | 1989-06-23 | 1991-02-04 | Nitto Boseki Co Ltd | 射出成形プリント配線板用転写シート及びその製造方法 |
-
1989
- 1989-03-22 US US07/326,931 patent/US5057372A/en not_active Expired - Lifetime
-
1990
- 1990-03-21 CA CA002012670A patent/CA2012670C/fr not_active Expired - Fee Related
- 1990-03-22 DK DK90905889.3T patent/DK0464144T3/da active
- 1990-03-22 EP EP90905889A patent/EP0464144B1/fr not_active Expired - Lifetime
- 1990-03-22 JP JP02505532A patent/JP3142554B2/ja not_active Expired - Fee Related
- 1990-03-22 AT AT90905889T patent/ATE156420T1/de not_active IP Right Cessation
- 1990-03-22 DE DE69031216T patent/DE69031216T2/de not_active Expired - Fee Related
- 1990-03-22 ES ES90905889T patent/ES2104603T3/es not_active Expired - Lifetime
- 1990-03-22 WO PCT/US1990/001547 patent/WO1990011182A1/fr active IP Right Grant
- 1990-03-22 KR KR1019900702487A patent/KR0168034B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR920700106A (ko) | 1992-02-19 |
DE69031216D1 (de) | 1997-09-11 |
ES2104603T3 (es) | 1997-10-16 |
EP0464144A1 (fr) | 1992-01-08 |
ATE156420T1 (de) | 1997-08-15 |
CA2012670C (fr) | 1999-04-27 |
US5057372A (en) | 1991-10-15 |
DK0464144T3 (da) | 1998-03-16 |
JPH04506584A (ja) | 1992-11-12 |
JP3142554B2 (ja) | 2001-03-07 |
EP0464144A4 (en) | 1992-04-01 |
KR0168034B1 (ko) | 1999-01-15 |
DE69031216T2 (de) | 1998-02-05 |
WO1990011182A1 (fr) | 1990-10-04 |
EP0464144B1 (fr) | 1997-08-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2012670A1 (fr) | Film multicouche et stratifie utilises dans la fabrication des cartes de circuits imprimes | |
CA2044614A1 (fr) | Adhesif autocollant enlevable | |
MX168109B (es) | Pelicula de multiples capas con mejor adhesion de capa | |
LV10219B (en) | Multilayer material with diffraction structural layer and method of protection of certificate | |
MY123407A (en) | Double-faced pressure-sensitive adhesive sheet and pressure-sensitive adhesive member | |
EP0242655A3 (en) | Colour-proofing sheet and production process | |
ATE88590T1 (de) | Ultraduenne chemisch widerstandsfaehige markierung und verfahren zur herstellung einer solchen. | |
DE3560584D1 (en) | Adhesive tape | |
MY126711A (en) | Adhesive tape for temporary-attachment of green sheets for ceramic electronic devices and method for producing ceramic electronic devices. | |
KR970008719B1 (en) | Laminate and self - adhesive tape | |
JPS5584381A (en) | Manufacture of pressure-sensitive adhesive type paper adhesive tape | |
CA2338670A1 (fr) | Materiau lamelle en resine/cuivre/metal et procede de production correspondant | |
TWI265189B (en) | Adhesive tape for temporary-attachment of green sheets for ceramic electronic devices and method for producing ceramic electronic devices | |
JPS6482931A (en) | Resin-coated metallic sheet and manufacture thereof | |
JPS5761595A (en) | Transfer sheet | |
JPS5610579A (en) | Adhesive material having back-release property | |
JPS55152775A (en) | Pressure-sensitive double-side adhesive tape | |
JPS5424951A (en) | Double-coated adhesive tape, sheet, or film | |
JPS5747371A (en) | Pressure-sensitive packaging film | |
JPS5761592A (en) | Transfer sheet | |
JPS56121732A (en) | Manufacture of ornamental body | |
JPS5457580A (en) | Solvent adsorbing laminated film | |
FR2300841A1 (fr) | Supports provisoires et leur procede de fabrication | |
JPS5311931A (en) | Method of laminating surface material in the production of corrugated board for interior | |
JPS54153836A (en) | Adhesive tape |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed | ||
MKLA | Lapsed |
Effective date: 20010321 |
|
MKLA | Lapsed |
Effective date: 20010321 |