ES2104603T3 - Una pelicula multicapa y un laminado para uso en la produccion de placas para circuitos impresos. - Google Patents

Una pelicula multicapa y un laminado para uso en la produccion de placas para circuitos impresos.

Info

Publication number
ES2104603T3
ES2104603T3 ES90905889T ES90905889T ES2104603T3 ES 2104603 T3 ES2104603 T3 ES 2104603T3 ES 90905889 T ES90905889 T ES 90905889T ES 90905889 T ES90905889 T ES 90905889T ES 2104603 T3 ES2104603 T3 ES 2104603T3
Authority
ES
Spain
Prior art keywords
pounds
width
multilayer film
metal foil
carrier sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES90905889T
Other languages
English (en)
Inventor
Stephen M Imfeld
Randall S Shipley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Chemical Co
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Application granted granted Critical
Publication of ES2104603T3 publication Critical patent/ES2104603T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31507—Of polycarbonate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide
    • Y10T428/3175—Next to addition polymer from unsaturated monomer[s]
    • Y10T428/31757—Polymer of monoethylenically unsaturated hydrocarbon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]
    • Y10T428/31797—Next to addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31909—Next to second addition polymer from unsaturated monomers
    • Y10T428/31913—Monoolefin polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Adhesive Tapes (AREA)

Abstract

UNA LAMINA (10) DE UNA CAPA DE UNA CINTA METALICA CHAPADA Y UN FILM MULTICAPA QUE TIENE UNA CAPA SUPERFICIAL COMPUESTA DE LO ANTERIOR Y UNA CAPA DE SOPORTE (24) QUE CONTIENE UNA RESINA TERMOPLASTICA CAPAZ DE RESISTIR TEMPERATURAS DE HASTA 200 C SIN ABLANDARSE Y CON OTRA CAPA SUPERFICIAL COMPUESTA DE UNA CAPA ADHESIVA (26) QUE CONTIENE UNA RESINA TERMOPLASTICA CON UN PUNTO DE FUSION ENTRE 100 Y 200 C. OPCIONALMENTE, SE PUEDE EMPLEAR UNA CAPA DE UNION (28) ENTRE LA CAPA DE APOYO (24) Y LA ADHESIVA (26). EL FILM MULTICAPA ES UTIL COMO HOJA PROTECTORA PARA UNA CINTA METALICA CHAPADA (18) UTILIZADA EN LA PRODUCCION DE PLACAS DE CIRCUITOS IMPRESOS. LA HOJA PROTECTORA SUMINISTRA UNA PROTECCION TEMPORAL, ES DESPLEGABLE, Y SE UTILIZA PARA LA PROTECCION CONTRA LA CONTAMINACION Y EL DAÑO FISICO A LA CINTA METALICA ANTES Y DURANTE LA FABRICACION DE LA PLACA DE CIRCUITO IMPRESO. LA ADHESION DE LA HOJA PROTECTORA (20) DE LA CINTA METALICA (18) MEDIDA UTILIZANDO LA PRUEBA DE DESPEGUE DE 180 GRADOS ES MENOR DE 0,4 LB/PULGADA-ANCHO Y MAYOR QUE 0,005 LB/PULGADA-ANCHO (0,18 A 0,002 KGS/2,54 CM-ANCHO) Y PREFERENTEMENTE MENOR DE 0,1 LBS/PULGADA-ANCHO Y MAYOR QUE 0,01 LBS/PULGADA-ANCHO (0,05 A 0,005 KGS/2,54 CM-ANCHO).
ES90905889T 1989-03-22 1990-03-22 Una pelicula multicapa y un laminado para uso en la produccion de placas para circuitos impresos. Expired - Lifetime ES2104603T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/326,931 US5057372A (en) 1989-03-22 1989-03-22 Multilayer film and laminate for use in producing printed circuit boards

Publications (1)

Publication Number Publication Date
ES2104603T3 true ES2104603T3 (es) 1997-10-16

Family

ID=23274380

Family Applications (1)

Application Number Title Priority Date Filing Date
ES90905889T Expired - Lifetime ES2104603T3 (es) 1989-03-22 1990-03-22 Una pelicula multicapa y un laminado para uso en la produccion de placas para circuitos impresos.

Country Status (10)

Country Link
US (1) US5057372A (es)
EP (1) EP0464144B1 (es)
JP (1) JP3142554B2 (es)
KR (1) KR0168034B1 (es)
AT (1) ATE156420T1 (es)
CA (1) CA2012670C (es)
DE (1) DE69031216T2 (es)
DK (1) DK0464144T3 (es)
ES (1) ES2104603T3 (es)
WO (1) WO1990011182A1 (es)

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US6127051A (en) * 1998-04-10 2000-10-03 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
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US6129998A (en) * 1998-04-10 2000-10-10 R.E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6183880B1 (en) * 1998-08-07 2001-02-06 Mitsui Mining & Smelting Co., Ltd. Composite foil of aluminum and copper
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US6372364B1 (en) 1999-08-18 2002-04-16 Microcoating Technologies, Inc. Nanostructure coatings
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US6921451B2 (en) * 2002-06-28 2005-07-26 Metallized Products, Inc. Method of and apparatus for protecting thin copper foil and other shiny substrates during handling and rigorous processing, as pcb manufacture and the like, by electric-charge adherence thereto of thin release-layered plastic films and the like, and improved products produced thereby
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US8129009B2 (en) * 2004-04-13 2012-03-06 E. I. Du Pont De Nemours And Company Composition comprising ethylene copolymer
US20060222796A1 (en) * 2005-04-04 2006-10-05 Morris Barry A Structure comprising metallized film and ethylene copolymer
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Also Published As

Publication number Publication date
CA2012670A1 (en) 1990-09-22
EP0464144A4 (en) 1992-04-01
KR920700106A (ko) 1992-02-19
CA2012670C (en) 1999-04-27
EP0464144A1 (en) 1992-01-08
DK0464144T3 (da) 1998-03-16
WO1990011182A1 (en) 1990-10-04
EP0464144B1 (en) 1997-08-06
JPH04506584A (ja) 1992-11-12
DE69031216D1 (de) 1997-09-11
DE69031216T2 (de) 1998-02-05
ATE156420T1 (de) 1997-08-15
US5057372A (en) 1991-10-15
JP3142554B2 (ja) 2001-03-07
KR0168034B1 (ko) 1999-01-15

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