CA2010604A1 - Methode et appareil de regulation fluidique reduisant au maximum la contamination particulaire - Google Patents
Methode et appareil de regulation fluidique reduisant au maximum la contamination particulaireInfo
- Publication number
- CA2010604A1 CA2010604A1 CA2010604A CA2010604A CA2010604A1 CA 2010604 A1 CA2010604 A1 CA 2010604A1 CA 2010604 A CA2010604 A CA 2010604A CA 2010604 A CA2010604 A CA 2010604A CA 2010604 A1 CA2010604 A1 CA 2010604A1
- Authority
- CA
- Canada
- Prior art keywords
- fluid flow
- flow control
- process chamber
- control method
- particle contamination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D16/00—Control of fluid pressure
- G05D16/20—Control of fluid pressure characterised by the use of electric means
- G05D16/2006—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means
- G05D16/2013—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means
- G05D16/2026—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means with a plurality of throttling means
- G05D16/2046—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means with a plurality of throttling means the plurality of throttling means being arranged for the control of a single pressure from a plurality of converging pressures
- G05D16/2053—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means with a plurality of throttling means the plurality of throttling means being arranged for the control of a single pressure from a plurality of converging pressures the plurality of throttling means comprising only a first throttling means acting on a higher pressure and a second throttling means acting on a lower pressure, e.g. the atmosphere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0396—Involving pressure control
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/7722—Line condition change responsive valves
- Y10T137/7758—Pilot or servo controlled
- Y10T137/7761—Electrically actuated valve
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/319,257 US4987933A (en) | 1989-03-03 | 1989-03-03 | Fluid flow control method and apparatus for minimizing particle contamination |
US319,257 | 1989-03-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2010604A1 true CA2010604A1 (fr) | 1990-09-03 |
CA2010604C CA2010604C (fr) | 1996-07-02 |
Family
ID=23241500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002010604A Expired - Fee Related CA2010604C (fr) | 1989-03-03 | 1990-02-21 | Methode et appareil de regulation fluidique reduisant au maximum la contamination particulaire |
Country Status (6)
Country | Link |
---|---|
US (1) | US4987933A (fr) |
EP (1) | EP0385709B1 (fr) |
JP (1) | JP3000223B2 (fr) |
KR (1) | KR950011846B1 (fr) |
CA (1) | CA2010604C (fr) |
DE (1) | DE69019558T2 (fr) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5231291A (en) * | 1989-08-01 | 1993-07-27 | Canon Kabushiki Kaisha | Wafer table and exposure apparatus with the same |
US5217053A (en) * | 1990-02-05 | 1993-06-08 | Texas Instruments Incorporated | Vented vacuum semiconductor wafer cassette |
US5308989A (en) * | 1992-12-22 | 1994-05-03 | Eaton Corporation | Fluid flow control method and apparatus for an ion implanter |
DE4419333A1 (de) * | 1994-06-02 | 1995-12-07 | Bolz Alfred Gmbh Co Kg | Abfüllanlage für gefährliche, schütt- oder fließfähige Medien |
US5542458A (en) * | 1994-08-22 | 1996-08-06 | Gilbarco Inc. | Vapor recovery system for a fuel delivery system |
AU5305296A (en) * | 1995-03-07 | 1996-09-23 | Biomolecular Assays, Inc. | Pressure cycling reactor |
US5633506A (en) * | 1995-07-17 | 1997-05-27 | Eaton Corporation | Method and apparatus for in situ removal of contaminants from ion beam neutralization and implantation apparatuses |
US5554854A (en) * | 1995-07-17 | 1996-09-10 | Eaton Corporation | In situ removal of contaminants from the interior surfaces of an ion beam implanter |
KR100189981B1 (ko) * | 1995-11-21 | 1999-06-01 | 윤종용 | 진공 시스템을 구비한 반도체 소자 제조장치 |
US5672882A (en) * | 1995-12-29 | 1997-09-30 | Advanced Micro Devices, Inc. | Ion implantation device with a closed-loop process chamber pressure control system |
GB2325561B (en) * | 1997-05-20 | 2001-10-17 | Applied Materials Inc | Apparatus for and methods of implanting desired chemical species in semiconductor substrates |
US6278542B1 (en) | 1998-11-23 | 2001-08-21 | Light And Sound Design Ltd. | Programmable light beam shape altering device using separate programmable micromirrors for each primary color |
FR2807951B1 (fr) * | 2000-04-20 | 2003-05-16 | Cit Alcatel | Procede et systeme de pompage des chambres de transfert d'equipement de semi-conducteur |
DE10144923A1 (de) | 2001-09-12 | 2003-03-27 | Guehring Joerg | Spanabhebendes Werkzeug mit Wendeschneidplatte |
CN103170447B (zh) | 2005-08-30 | 2015-02-18 | 先进科技材料公司 | 使用替代的氟化含硼前驱体的硼离子注入和用于注入的大氢化硼的形成 |
US8598022B2 (en) | 2009-10-27 | 2013-12-03 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
JP5919195B2 (ja) | 2009-10-27 | 2016-05-18 | インテグリス・インコーポレーテッド | イオン注入システムおよび方法 |
CN103201824B (zh) | 2010-08-30 | 2016-09-07 | 恩特格里斯公司 | 由固体材料制备化合物或其中间体以及使用该化合物和中间体的设备和方法 |
TWI583442B (zh) | 2011-10-10 | 2017-05-21 | 恩特葛瑞斯股份有限公司 | B2f4之製造程序 |
JP2014146486A (ja) * | 2013-01-29 | 2014-08-14 | Jeol Ltd | 荷電粒子線装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3963043A (en) * | 1975-01-02 | 1976-06-15 | Motorola, Inc. | Pressure sensing method and apparatus for gases |
DE2811345C2 (de) * | 1978-03-16 | 1986-12-11 | Knorr-Bremse AG, 8000 München | Druckregler für pneumatische Drücke, insbesondere in Fahrzeugen |
US4373549A (en) * | 1979-02-12 | 1983-02-15 | Hewlett-Packard Company | Mass flow/pressure control system |
US4433951A (en) * | 1981-02-13 | 1984-02-28 | Lam Research Corporation | Modular loadlock |
JPS5998217A (ja) * | 1982-11-26 | 1984-06-06 | Fujikin:Kk | 流量制御装置 |
JPS60189854A (ja) * | 1984-03-10 | 1985-09-27 | Shimadzu Corp | 試料交換装置 |
JPS6191375A (ja) * | 1984-10-11 | 1986-05-09 | Hitachi Electronics Eng Co Ltd | プラズマエツチング装置の排気ベント機構 |
US4717829A (en) * | 1985-03-14 | 1988-01-05 | Varian Associates, Inc. | Platen and beam setup flag assembly for ion implanter |
US4672210A (en) * | 1985-09-03 | 1987-06-09 | Eaton Corporation | Ion implanter target chamber |
US4705951A (en) * | 1986-04-17 | 1987-11-10 | Varian Associates, Inc. | Wafer processing system |
US4739787A (en) * | 1986-11-10 | 1988-04-26 | Stoltenberg Kevin J | Method and apparatus for improving the yield of integrated circuit devices |
US4836233A (en) * | 1988-06-06 | 1989-06-06 | Eclipse Ion Technology, Inc. | Method and apparatus for venting vacuum processing equipment |
-
1989
- 1989-03-03 US US07/319,257 patent/US4987933A/en not_active Expired - Lifetime
-
1990
- 1990-02-21 CA CA002010604A patent/CA2010604C/fr not_active Expired - Fee Related
- 1990-02-27 KR KR1019900002530A patent/KR950011846B1/ko not_active IP Right Cessation
- 1990-02-27 EP EP90302052A patent/EP0385709B1/fr not_active Expired - Lifetime
- 1990-02-27 DE DE69019558T patent/DE69019558T2/de not_active Expired - Fee Related
- 1990-03-03 JP JP2052573A patent/JP3000223B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0385709A3 (fr) | 1991-06-05 |
EP0385709B1 (fr) | 1995-05-24 |
KR950011846B1 (ko) | 1995-10-11 |
US4987933A (en) | 1991-01-29 |
CA2010604C (fr) | 1996-07-02 |
KR900014772A (ko) | 1990-10-24 |
JP3000223B2 (ja) | 2000-01-17 |
DE69019558T2 (de) | 1996-02-01 |
EP0385709A2 (fr) | 1990-09-05 |
DE69019558D1 (de) | 1995-06-29 |
JPH02291652A (ja) | 1990-12-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |