DE69019558D1 - Verfahren und Gerät zur Kontrolle des Verlaufs einer Flüssigkeit zur Minimisierung der Partikelkontamination. - Google Patents
Verfahren und Gerät zur Kontrolle des Verlaufs einer Flüssigkeit zur Minimisierung der Partikelkontamination.Info
- Publication number
- DE69019558D1 DE69019558D1 DE69019558T DE69019558T DE69019558D1 DE 69019558 D1 DE69019558 D1 DE 69019558D1 DE 69019558 T DE69019558 T DE 69019558T DE 69019558 T DE69019558 T DE 69019558T DE 69019558 D1 DE69019558 D1 DE 69019558D1
- Authority
- DE
- Germany
- Prior art keywords
- controlling
- liquid
- flow
- particle contamination
- minimize particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D16/00—Control of fluid pressure
- G05D16/20—Control of fluid pressure characterised by the use of electric means
- G05D16/2006—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means
- G05D16/2013—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means
- G05D16/2026—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means with a plurality of throttling means
- G05D16/2046—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means with a plurality of throttling means the plurality of throttling means being arranged for the control of a single pressure from a plurality of converging pressures
- G05D16/2053—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means with a plurality of throttling means the plurality of throttling means being arranged for the control of a single pressure from a plurality of converging pressures the plurality of throttling means comprising only a first throttling means acting on a higher pressure and a second throttling means acting on a lower pressure, e.g. the atmosphere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0396—Involving pressure control
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/7722—Line condition change responsive valves
- Y10T137/7758—Pilot or servo controlled
- Y10T137/7761—Electrically actuated valve
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Physical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/319,257 US4987933A (en) | 1989-03-03 | 1989-03-03 | Fluid flow control method and apparatus for minimizing particle contamination |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69019558D1 true DE69019558D1 (de) | 1995-06-29 |
DE69019558T2 DE69019558T2 (de) | 1996-02-01 |
Family
ID=23241500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69019558T Expired - Fee Related DE69019558T2 (de) | 1989-03-03 | 1990-02-27 | Verfahren und Gerät zur Kontrolle des Verlaufs einer Flüssigkeit zur Minimisierung der Partikelkontamination. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4987933A (de) |
EP (1) | EP0385709B1 (de) |
JP (1) | JP3000223B2 (de) |
KR (1) | KR950011846B1 (de) |
CA (1) | CA2010604C (de) |
DE (1) | DE69019558T2 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5231291A (en) * | 1989-08-01 | 1993-07-27 | Canon Kabushiki Kaisha | Wafer table and exposure apparatus with the same |
US5217053A (en) * | 1990-02-05 | 1993-06-08 | Texas Instruments Incorporated | Vented vacuum semiconductor wafer cassette |
US5308989A (en) * | 1992-12-22 | 1994-05-03 | Eaton Corporation | Fluid flow control method and apparatus for an ion implanter |
DE4419333A1 (de) * | 1994-06-02 | 1995-12-07 | Bolz Alfred Gmbh Co Kg | Abfüllanlage für gefährliche, schütt- oder fließfähige Medien |
US5542458A (en) * | 1994-08-22 | 1996-08-06 | Gilbarco Inc. | Vapor recovery system for a fuel delivery system |
EP1098005B1 (de) | 1995-03-07 | 2011-05-11 | Pressure Biosciences, Inc. | Druckwechselreaktor |
US5633506A (en) * | 1995-07-17 | 1997-05-27 | Eaton Corporation | Method and apparatus for in situ removal of contaminants from ion beam neutralization and implantation apparatuses |
US5554854A (en) * | 1995-07-17 | 1996-09-10 | Eaton Corporation | In situ removal of contaminants from the interior surfaces of an ion beam implanter |
KR100189981B1 (ko) * | 1995-11-21 | 1999-06-01 | 윤종용 | 진공 시스템을 구비한 반도체 소자 제조장치 |
US5672882A (en) * | 1995-12-29 | 1997-09-30 | Advanced Micro Devices, Inc. | Ion implantation device with a closed-loop process chamber pressure control system |
GB2325561B (en) * | 1997-05-20 | 2001-10-17 | Applied Materials Inc | Apparatus for and methods of implanting desired chemical species in semiconductor substrates |
US6278542B1 (en) | 1998-11-23 | 2001-08-21 | Light And Sound Design Ltd. | Programmable light beam shape altering device using separate programmable micromirrors for each primary color |
FR2807951B1 (fr) * | 2000-04-20 | 2003-05-16 | Cit Alcatel | Procede et systeme de pompage des chambres de transfert d'equipement de semi-conducteur |
DE10144923A1 (de) | 2001-09-12 | 2003-03-27 | Guehring Joerg | Spanabhebendes Werkzeug mit Wendeschneidplatte |
SG2014011944A (en) | 2005-08-30 | 2014-08-28 | Advanced Tech Materials | Boron ion implantation using alternative fluorinated boron precursors, and formation of large boron hydrides for implantation |
EP2494581B1 (de) | 2009-10-27 | 2016-05-18 | Entegris Inc. | Ionenimplantationssystem und -verfahren |
US8598022B2 (en) | 2009-10-27 | 2013-12-03 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
JP5908476B2 (ja) | 2010-08-30 | 2016-04-26 | インテグリス・インコーポレーテッド | 固体材料から化合物又はその中間体を調製するための装置及び方法並びにそのような化合物及び中間体の使用 |
TWI583442B (zh) | 2011-10-10 | 2017-05-21 | 恩特葛瑞斯股份有限公司 | B2f4之製造程序 |
JP2014146486A (ja) * | 2013-01-29 | 2014-08-14 | Jeol Ltd | 荷電粒子線装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3963043A (en) * | 1975-01-02 | 1976-06-15 | Motorola, Inc. | Pressure sensing method and apparatus for gases |
DE2811345C2 (de) * | 1978-03-16 | 1986-12-11 | Knorr-Bremse AG, 8000 München | Druckregler für pneumatische Drücke, insbesondere in Fahrzeugen |
US4373549A (en) * | 1979-02-12 | 1983-02-15 | Hewlett-Packard Company | Mass flow/pressure control system |
US4433951A (en) * | 1981-02-13 | 1984-02-28 | Lam Research Corporation | Modular loadlock |
JPS5998217A (ja) * | 1982-11-26 | 1984-06-06 | Fujikin:Kk | 流量制御装置 |
JPS60189854A (ja) * | 1984-03-10 | 1985-09-27 | Shimadzu Corp | 試料交換装置 |
JPS6191375A (ja) * | 1984-10-11 | 1986-05-09 | Hitachi Electronics Eng Co Ltd | プラズマエツチング装置の排気ベント機構 |
US4717829A (en) * | 1985-03-14 | 1988-01-05 | Varian Associates, Inc. | Platen and beam setup flag assembly for ion implanter |
US4672210A (en) * | 1985-09-03 | 1987-06-09 | Eaton Corporation | Ion implanter target chamber |
US4705951A (en) * | 1986-04-17 | 1987-11-10 | Varian Associates, Inc. | Wafer processing system |
US4739787A (en) * | 1986-11-10 | 1988-04-26 | Stoltenberg Kevin J | Method and apparatus for improving the yield of integrated circuit devices |
US4836233A (en) * | 1988-06-06 | 1989-06-06 | Eclipse Ion Technology, Inc. | Method and apparatus for venting vacuum processing equipment |
-
1989
- 1989-03-03 US US07/319,257 patent/US4987933A/en not_active Expired - Lifetime
-
1990
- 1990-02-21 CA CA002010604A patent/CA2010604C/en not_active Expired - Fee Related
- 1990-02-27 KR KR1019900002530A patent/KR950011846B1/ko not_active IP Right Cessation
- 1990-02-27 DE DE69019558T patent/DE69019558T2/de not_active Expired - Fee Related
- 1990-02-27 EP EP90302052A patent/EP0385709B1/de not_active Expired - Lifetime
- 1990-03-03 JP JP2052573A patent/JP3000223B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4987933A (en) | 1991-01-29 |
JP3000223B2 (ja) | 2000-01-17 |
KR900014772A (ko) | 1990-10-24 |
KR950011846B1 (ko) | 1995-10-11 |
EP0385709A2 (de) | 1990-09-05 |
CA2010604A1 (en) | 1990-09-03 |
EP0385709B1 (de) | 1995-05-24 |
CA2010604C (en) | 1996-07-02 |
JPH02291652A (ja) | 1990-12-03 |
EP0385709A3 (de) | 1991-06-05 |
DE69019558T2 (de) | 1996-02-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: AXCELIS TECHNOLOGIES, INC., BEVERLY, MASS., US |
|
8339 | Ceased/non-payment of the annual fee |