CA1311713C - Bains de solution de sulfonates organiques pour le placage de bismuth ou d'alliages a base de bismuth - Google Patents

Bains de solution de sulfonates organiques pour le placage de bismuth ou d'alliages a base de bismuth

Info

Publication number
CA1311713C
CA1311713C CA 519048 CA519048A CA1311713C CA 1311713 C CA1311713 C CA 1311713C CA 519048 CA519048 CA 519048 CA 519048 A CA519048 A CA 519048A CA 1311713 C CA1311713 C CA 1311713C
Authority
CA
Canada
Prior art keywords
bismuth
acid
baths
radical
alloy plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CA 519048
Other languages
English (en)
Inventor
Seishi Masaki
Kiyotaka Tsuji
Yoshiaki Okuhama
Toshiji Akutsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishihara Chemical Co Ltd
Daiwa Fine Chemicals Co Ltd
Original Assignee
Ishihara Chemical Co Ltd
Daiwa Fine Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishihara Chemical Co Ltd, Daiwa Fine Chemicals Co Ltd filed Critical Ishihara Chemical Co Ltd
Application granted granted Critical
Publication of CA1311713C publication Critical patent/CA1311713C/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CA 519048 1986-07-04 1986-09-25 Bains de solution de sulfonates organiques pour le placage de bismuth ou d'alliages a base de bismuth Expired - Lifetime CA1311713C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP156361/1986 1986-07-04
JP61156361A JPH0781196B2 (ja) 1986-07-04 1986-07-04 有機スルホン酸塩からのビスマス及びビスマス合金めつき浴

Publications (1)

Publication Number Publication Date
CA1311713C true CA1311713C (fr) 1992-12-22

Family

ID=15626076

Family Applications (1)

Application Number Title Priority Date Filing Date
CA 519048 Expired - Lifetime CA1311713C (fr) 1986-07-04 1986-09-25 Bains de solution de sulfonates organiques pour le placage de bismuth ou d'alliages a base de bismuth

Country Status (4)

Country Link
EP (1) EP0255558B1 (fr)
JP (1) JPH0781196B2 (fr)
CA (1) CA1311713C (fr)
DE (1) DE3682679D1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0765206B2 (ja) * 1988-09-22 1995-07-12 上村工業株式会社 ビスマス―錫合金電気めっき方法
JPH0765207B2 (ja) * 1988-09-22 1995-07-12 上村工業株式会社 ビスマス―錫合金電気めっき方法
AU632464B2 (en) * 1988-10-14 1993-01-07 Atochem North America, Inc. A method, bath and cell for the electrodeposition of tin-bismuth alloys
KR960008155B1 (ko) * 1988-10-14 1996-06-20 엠 앤드 티 케미칼즈, 아이엔씨. 주석-비스무트 합금의 전기도금법
JP2819180B2 (ja) * 1990-02-22 1998-10-30 信康 土肥 すず―鉛―ビスマス合金めっき浴
US5227046A (en) * 1991-10-07 1993-07-13 Unisys Corporation Low temperature tin-bismuth electroplating system
JP3274232B2 (ja) * 1993-06-01 2002-04-15 ディップソール株式会社 錫−ビスマス合金めっき浴及びそれを使用するめっき方法
JP4728462B2 (ja) * 2000-02-29 2011-07-20 日本リーロナール有限会社 錫電気めっき液及びめっき方法
US6736954B2 (en) 2001-10-02 2004-05-18 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
DE102005016819B4 (de) * 2005-04-12 2009-10-01 Dr.-Ing. Max Schlötter GmbH & Co KG Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten
JP2020169360A (ja) * 2019-04-03 2020-10-15 奥野製薬工業株式会社 電気めっき用Ｂｉ−Ｓｂ合金めっき液
CN113293409B (zh) * 2021-05-28 2022-06-24 中南大学 一种电解制备致密平整铋金属的方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967387A (ja) * 1982-10-08 1984-04-17 Hiyougoken すず、鉛及びすず―鉛合金メッキ浴
US4565610A (en) 1983-12-22 1986-01-21 Learonal, Inc. Bath and process for plating lead and lead/tin alloys
US4565609A (en) 1983-12-22 1986-01-21 Learonal, Inc. Bath and process for plating tin, lead and tin-lead alloys

Also Published As

Publication number Publication date
DE3682679D1 (de) 1992-01-09
EP0255558B1 (fr) 1991-11-27
EP0255558A1 (fr) 1988-02-10
JPH0781196B2 (ja) 1995-08-30
JPS6314887A (ja) 1988-01-22

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Legal Events

Date Code Title Description
MKEX Expiry