DE3682679D1 - Baeder auf basis von einer ein organisches sulphonat enthaltenden loesung fuer das plattieren von wismut und wismutlegierungen. - Google Patents

Baeder auf basis von einer ein organisches sulphonat enthaltenden loesung fuer das plattieren von wismut und wismutlegierungen.

Info

Publication number
DE3682679D1
DE3682679D1 DE8686113044T DE3682679T DE3682679D1 DE 3682679 D1 DE3682679 D1 DE 3682679D1 DE 8686113044 T DE8686113044 T DE 8686113044T DE 3682679 T DE3682679 T DE 3682679T DE 3682679 D1 DE3682679 D1 DE 3682679D1
Authority
DE
Germany
Prior art keywords
bismutis
bismuto
baeder
alloys
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686113044T
Other languages
English (en)
Inventor
Seishi Masaki
Kiyotaka Tsuji
Yoshiaki Okuhama
Toshiji Akutsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishihara Chemical Co Ltd
Daiwa Fine Chemicals Co Ltd
Original Assignee
Ishihara Chemical Co Ltd
Daiwa Fine Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishihara Chemical Co Ltd, Daiwa Fine Chemicals Co Ltd filed Critical Ishihara Chemical Co Ltd
Application granted granted Critical
Publication of DE3682679D1 publication Critical patent/DE3682679D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
DE8686113044T 1986-07-04 1986-09-22 Baeder auf basis von einer ein organisches sulphonat enthaltenden loesung fuer das plattieren von wismut und wismutlegierungen. Expired - Lifetime DE3682679D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61156361A JPH0781196B2 (ja) 1986-07-04 1986-07-04 有機スルホン酸塩からのビスマス及びビスマス合金めつき浴

Publications (1)

Publication Number Publication Date
DE3682679D1 true DE3682679D1 (de) 1992-01-09

Family

ID=15626076

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686113044T Expired - Lifetime DE3682679D1 (de) 1986-07-04 1986-09-22 Baeder auf basis von einer ein organisches sulphonat enthaltenden loesung fuer das plattieren von wismut und wismutlegierungen.

Country Status (4)

Country Link
EP (1) EP0255558B1 (de)
JP (1) JPH0781196B2 (de)
CA (1) CA1311713C (de)
DE (1) DE3682679D1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0765207B2 (ja) * 1988-09-22 1995-07-12 上村工業株式会社 ビスマス―錫合金電気めっき方法
JPH0765206B2 (ja) * 1988-09-22 1995-07-12 上村工業株式会社 ビスマス―錫合金電気めっき方法
AU632464B2 (en) * 1988-10-14 1993-01-07 Atochem North America, Inc. A method, bath and cell for the electrodeposition of tin-bismuth alloys
BR8807847A (pt) * 1988-10-14 1990-11-13 Atochem North America Metodo, banho e celula para a eletrodeposicao de ligas de estanho-bismuto
JP2819180B2 (ja) * 1990-02-22 1998-10-30 信康 土肥 すず―鉛―ビスマス合金めっき浴
US5227046A (en) * 1991-10-07 1993-07-13 Unisys Corporation Low temperature tin-bismuth electroplating system
JP3274232B2 (ja) * 1993-06-01 2002-04-15 ディップソール株式会社 錫−ビスマス合金めっき浴及びそれを使用するめっき方法
JP4728462B2 (ja) * 2000-02-29 2011-07-20 日本リーロナール有限会社 錫電気めっき液及びめっき方法
US6736954B2 (en) * 2001-10-02 2004-05-18 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
DE102005016819B4 (de) * 2005-04-12 2009-10-01 Dr.-Ing. Max Schlötter GmbH & Co KG Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten
JP2020169360A (ja) * 2019-04-03 2020-10-15 奥野製薬工業株式会社 電気めっき用Ｂｉ−Ｓｂ合金めっき液
CN113293409B (zh) * 2021-05-28 2022-06-24 中南大学 一种电解制备致密平整铋金属的方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967387A (ja) * 1982-10-08 1984-04-17 Hiyougoken すず、鉛及びすず―鉛合金メッキ浴
US4565609A (en) 1983-12-22 1986-01-21 Learonal, Inc. Bath and process for plating tin, lead and tin-lead alloys
US4565610A (en) 1983-12-22 1986-01-21 Learonal, Inc. Bath and process for plating lead and lead/tin alloys

Also Published As

Publication number Publication date
JPH0781196B2 (ja) 1995-08-30
CA1311713C (en) 1992-12-22
EP0255558A1 (de) 1988-02-10
JPS6314887A (ja) 1988-01-22
EP0255558B1 (de) 1991-11-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition