CA1293653C - Nozzle device - Google Patents
Nozzle deviceInfo
- Publication number
- CA1293653C CA1293653C CA000512019A CA512019A CA1293653C CA 1293653 C CA1293653 C CA 1293653C CA 000512019 A CA000512019 A CA 000512019A CA 512019 A CA512019 A CA 512019A CA 1293653 C CA1293653 C CA 1293653C
- Authority
- CA
- Canada
- Prior art keywords
- component
- nozzle
- combination
- heated fluid
- nozzle means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US79044885A | 1985-10-23 | 1985-10-23 | |
US790,448 | 1985-10-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1293653C true CA1293653C (en) | 1991-12-31 |
Family
ID=25150710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA000512019A Expired - Fee Related CA1293653C (en) | 1985-10-23 | 1986-06-20 | Nozzle device |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS62113497A (de) |
CA (1) | CA1293653C (de) |
DE (1) | DE3624728A1 (de) |
FR (1) | FR2589029B1 (de) |
GB (1) | GB2181981B (de) |
IT (1) | IT1209978B (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4787548A (en) * | 1987-07-27 | 1988-11-29 | Pace Incorporated | Nozzle structure for soldering and desoldering |
DE3881623D1 (de) * | 1987-08-31 | 1993-07-15 | Siemens Ag | Loetkopf zum ein- oder ausloeten von bauelementen mittels einer beheizung durch heissgas, insbesondere fuer oberflaechenmontierbare bauelemente (smd). |
ATE90248T1 (de) * | 1989-09-29 | 1993-06-15 | Siemens Nixdorf Inf Syst | Loetvorrichtung zum aufloeten von bauelementen auf leiterplatten. |
DE9113986U1 (de) * | 1991-11-11 | 1992-04-16 | Zevac Auslötsysteme GmbH, 3548 Arolsen | Lötvorrichtung zum Ein- und Auslöten von elektrischen Bauelementen |
JP2714520B2 (ja) * | 1992-08-28 | 1998-02-16 | 株式会社日立製作所 | 実装部品着脱装置 |
DE4345109C2 (de) * | 1993-12-28 | 2002-10-24 | Finetech Ges Fuer Elektronik T | Werkzeug zum Löten und Entlöten von Lötstellen einer Sockelfassung eines vielpoligen integrierten Schaltkreises |
DE4422341C2 (de) * | 1994-06-27 | 1997-03-06 | Martin Umwelt & Energietech | Löteinrichtung |
EP3368488A1 (de) * | 2015-10-30 | 2018-09-05 | Corning Incorporated | 3d-geformter gegenstand auf glasbasis, verfahren und vorrichtung zur herstellung davon |
CN115365600B (zh) * | 2022-09-16 | 2023-09-15 | 李文雄 | 一种用于电路板芯片的焊拆装置及焊拆方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3522407A (en) * | 1968-03-05 | 1970-08-04 | Argus Eng Co | Heating method |
US3718800A (en) * | 1968-03-05 | 1973-02-27 | Argus Eng Co | Infrared heating apparatus |
US4295596A (en) * | 1979-12-19 | 1981-10-20 | Western Electric Company, Inc. | Methods and apparatus for bonding an article to a metallized substrate |
JPS5873189A (ja) * | 1981-10-27 | 1983-05-02 | 富士通株式会社 | 電子部品自動取外し装置の熱風ノズルユニツトの構造 |
DE8334840U1 (de) * | 1983-12-05 | 1984-03-22 | Cooper Industries, Inc., 77210 Houston, Tex. | Loetgeraet zum befestigen von elektrischen und elektronischen bauteilen auf leiterplatten |
GB2154921B (en) * | 1984-02-24 | 1988-06-08 | Pace Inc | Device for attaching modular electronic components to or removing them from an insulative substrate |
FR2573950B3 (fr) * | 1984-11-27 | 1987-06-19 | Matra | Procede et dispositif d'extraction de composants electroniques soudes |
JPS61141197A (ja) * | 1984-12-14 | 1986-06-28 | 富士通株式会社 | フラツトリ−ド形電子部品の取外し方法及びその装置 |
JPS6285494A (ja) * | 1985-10-09 | 1987-04-18 | 株式会社日立製作所 | 部品取り外し装置 |
-
1986
- 1986-06-20 CA CA000512019A patent/CA1293653C/en not_active Expired - Fee Related
- 1986-07-22 DE DE19863624728 patent/DE3624728A1/de not_active Ceased
- 1986-07-31 GB GB8618672A patent/GB2181981B/en not_active Expired
- 1986-08-07 IT IT8648369A patent/IT1209978B/it active
- 1986-09-03 JP JP61207643A patent/JPS62113497A/ja active Pending
- 1986-10-20 FR FR8614537A patent/FR2589029B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
IT1209978B (it) | 1989-08-30 |
GB8618672D0 (en) | 1986-09-10 |
JPS62113497A (ja) | 1987-05-25 |
GB2181981B (en) | 1989-11-08 |
DE3624728A1 (de) | 1987-04-23 |
IT8648369A0 (it) | 1986-08-07 |
FR2589029A1 (fr) | 1987-04-24 |
GB2181981A (en) | 1987-05-07 |
FR2589029B1 (fr) | 1995-06-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MKLA | Lapsed |