CA1293653C - Nozzle device - Google Patents
Nozzle deviceInfo
- Publication number
- CA1293653C CA1293653C CA000512019A CA512019A CA1293653C CA 1293653 C CA1293653 C CA 1293653C CA 000512019 A CA000512019 A CA 000512019A CA 512019 A CA512019 A CA 512019A CA 1293653 C CA1293653 C CA 1293653C
- Authority
- CA
- Canada
- Prior art keywords
- component
- nozzle
- combination
- heated fluid
- nozzle means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
ABSTRACT OF THE DISCLOSURE
Device for delivering heated fluid to the sides of a component to melt solder at terminals disposed at the periphery of the component. The device includes a nozzle for delivering heated fluid generally in a first direction to the sides of the component, and a baffle disposed within or above the nozzle for directing the heated fluid generally laterally with respect to the first direction prior to delivery of the heated fluid towards the sides of the component. The nozzle has down-wardly extending sides, and the sides are dimensioned so that the component can be accommodated within the nozzle the baffle produces good distribution and mixing of heated air above and about the terminals, and this avoids the generation of hot spots, and produces simultaneous or essentially simultaneous melting of the solder at all of the leads to facilitate quick and convenient attachment of the com-ponent to or removal of the component from a printed circuit board. The downwardly extending sides of the nozzle are preferably vertically oriented with respect to the printed circuit board while the lower edges thereof are disposed at least below the body of the component such that heated fluid is forced through a constricted space as it passes the com-ponent terminals to thus optimize transfer of heat from the fluid to the solder at the terminals.
Device for delivering heated fluid to the sides of a component to melt solder at terminals disposed at the periphery of the component. The device includes a nozzle for delivering heated fluid generally in a first direction to the sides of the component, and a baffle disposed within or above the nozzle for directing the heated fluid generally laterally with respect to the first direction prior to delivery of the heated fluid towards the sides of the component. The nozzle has down-wardly extending sides, and the sides are dimensioned so that the component can be accommodated within the nozzle the baffle produces good distribution and mixing of heated air above and about the terminals, and this avoids the generation of hot spots, and produces simultaneous or essentially simultaneous melting of the solder at all of the leads to facilitate quick and convenient attachment of the com-ponent to or removal of the component from a printed circuit board. The downwardly extending sides of the nozzle are preferably vertically oriented with respect to the printed circuit board while the lower edges thereof are disposed at least below the body of the component such that heated fluid is forced through a constricted space as it passes the com-ponent terminals to thus optimize transfer of heat from the fluid to the solder at the terminals.
Description
-2- i ~
The present in~ention re~ates to a ~evlce for delivering heated fluid, such as air, to the sides of a comDonent to melt solder at ,erminals disposed at the periphery of the component.
BhCKGROUND OF ~HE I~VEI~TION
Devices suitable lor use in remo~ing or installing modular electronic components from a substrate such as a printed circuit board include those which direct heated air at the terminals of the component from a source of heated air above the component to simultaneously melt the solder on each of the terminals. Examples of such devices are disclosed in U S. patents 4,295,596 and 4,366,925.
The devices in each of those two patents operate by direct-ing hot air onto .he terminals of a component; followed by removal of the component either mechanicall~ or by the application of suct-on.
A disadvantage associated with the prior devices is that heated air is not delivered uniiormly to the terminals, and this results in the generation of--hot spots in the region of the terminals and non-uniform melting or the solder. In light of this, removal of the components is often hindered due to the fact that the solder at one or more of the terminals is not melted when the solder at the remaining terminals is melted, and removal of the component under these circumstances is often accompanied by damage to the component, the leads and/or the printed circuit board.
It is therefore an object of the present invention to provide an improved device for delivering heated fluid -to the sides of the component to uniformly melt solder at terminals disposed at the periphery of the component to facilitate clean installation or removal of the com-ponent from a substrate.
~293653 In one aspect of the present invention there is provided an improved device of the above type incorporating a nozzle member and a baffle member disposed above or within the nozzle member for obtaining good distribution and mixing of heated air about the terminals in order to avoid the generation of hot spots and to ensure simultaneous melting of solder at all of the terminals to enable easy removal of the component from or installation of the component on a printed circuit board.
In a further aspect of this invention there is provided a constricted passageway to the heated fluid at the location of the terminals to facilitate rapid and effective heat transfer from the heated fluid to the solder to be melted at the terminals.
In another aspect of the present invention there is provided an improved nozzle suitable for use in conjunction with a device of the above type in the installing and removal of electronic components from circuits printed on a substrate.
SUMMARY OF THE INVENTION
Therefore, in accordance with the present invention, there is provided in combination, an electronic component, a substrate and a device for effectuating the removal or installation of the electronic component by the delivering of heated fluid along the sides of the electronic component to melt solder at terminals disposed at the periphery thereof, the device comprising means for generating a flow of the heated fluid and nozzle means removably mounted in association with the means for generating and the electronic component for receiving the flow of the heated fluid from the means for generating and for passing it along the sides of the electronic . , ' lZ93653 component while maintaining a pocket of cooler fluid above the electronic component; wherein the nozzle means consists of a tube having four side plates of a metallic material having a low thermal conductivity, high temperature capability and structural stability, the side plates being connected together into a rectangular parallelepiped having a hollow interior space completely spanning the distance between the plates;
wherein the electronic component is disposed within the interior space in a manner creating a means for evenly distributing the flow of heated fluid along side walls of the component by defining a constricted passageway between the each side plate and a respective side wall of the electronic component that has a width, between each respective side plate and side wall of the component, in a range of 5-50 mils; and wherein the nozzle means is oriented with the side plates extending normal to the substrate in a manner creating a means for controlling the transfer of heat to the terminas from the fluid flow exiting the nozzle means, by a lower edge of the side plates being spaced from the substrate by a distance within a range of 5-50 mils.
According to another embodiment of the invention, the nozzle means includes a locating means for locating a component within the nozzle in a particular predetermined orientation.
According to one embodiment, the locating means comprises a radiused portion disposed at at least three corners of the nozzle means.
In accordance with a second aspect of the present invention there is provided a method of effectuating the removal or installation of an electronic component on a substrate by the delivery of heated fluid along the sides of the electronic component to melt solder at terminals disposed at the periphery thereof comprising the steps of:
(A) providing a nozzle consisting of a tube having four side B
1Zg3~iS3 - 4a -plates, of a metallic material of low thermal conductivity, high temperature capability, and structural stability, connected together into a rectangular parallelepiped having a hollow interior space completely spanning the distance between the plates: (B) delivering a flow of heated fluid into the interior space; (C) disposing the electronic component within the interior space in a manner defining a constricted passageway, between each side plate and a respective side wall of the component, the passageway having a width, between the respective side plate and side walls of the electronic component, in a range of 5-50 mils for evenly distributing the flow of heated fluid along the side wall of the component while maintaining a pocket of cooler fluid above the component;
(D) orienting the nozzle with the side plates extending normal to the substrate and controlling the transfer of heat to the terminals, from the fluid flow exiting the nozzle, by spacing a lower edge of the side plates of the nozzle from the substrate at a distance within a range of 5-50 mils.
B
12~3653 BRlEF DESCRIPTION OF THE DRAWINGS
The invention of the present application will now be described in more detail with reference to preferred embodi-ments, given only by way of example, and with reference to the accompanying drawings, in which:
Figure 1 is a schematic side elevation of an earlier component removal/installation arrangement;
Figure 2 is a schematic side elevation of a component removal/installation device of the present invention;
Figure 3 is a perspective exploded view of a device of the present invention;
Figure 4 is an enlarged view of a portion of the device illustrated in Figure 2;
Figure 5 and 6 are schematic side elevations of alterna-tive embodiments of the present invention;
Figures 7 through 11 are alternative embodiments of baffle means usable in the device of the present invention;
Figure 12 is a schematic side elevation of a further embodiment of the device of the present invention; and Figure 13 is a plan view of a nozzle of the present invention showing a locating means.
DETAILED DESCRIPTION OF THE INVENTION
The component removal/installation device of the present invention is particularly suited for use in conjunction with the device described and claimed in copending Canadian patent application serial number 475,000 filed February 22, 1985.
~Pi 125~
In the following description, reference will be made to air as the fluid being heated. However, it will be ap-preciated that the invention is not limited to the use of air, and other fluids such as inert gases, including nitro-gen, argon and carbon dioxide, may be used, if desired.
Referring now to the drawings, Figure 1 shows schemati-cally, the component removal installation arrangement described in copending Canadian patent application serial number 511,073 filed June 6, 1986. The arrangement shown in Figure 1, and generally referenced 2, comprises a nozzle 4, a heated device 6 and an orifice plate 8 having a plurality of orifices 10 extending around the periphery of the orifice plate. The hea~er device 6 is separated from the orifice plate 8 to provide a plenum 12, and heated air, which is heated by the heater device 6, passes from the plenum 12 through the orifices 10 into the nozzle 4 and ultimately reaches the terminals 14 of the component 16 in order to effect melting of solder or the like at the terminals.
Turning to Figures 2 through 10, which illustrate embodiments of the cornponent removal/installation device of the present application, the orifice plate 8 illustrated in Figure 1 is replaced by a baffle member 18 for directing heated air entering above the baffle plate generally lateral-ly, as indicated by arrows 20 prior to delivery of heated air towards component 22. In the embodiment illustrated in Figure 2, air is heated by a heated device 24, and enters into region 26 above the baffle member 18 through entry port 28. In the region 26, the heated air is directed generally laterally as indicated by the arrow 20, and then descends towards the ~J~
~.c~
` ~7- lZ93653 .
compo,nent 22 as indicated by ,he arrows 30. This lateral deflection of heated air prior to delivery to~-ards the component 22 produces goo~ mixing and distribution of the air about terminals 32 of the co~,Donent 22, and thereby avoids the formation of hot spots and non-uniform melting of solder at the .erminals 32. A primary objec,ive of the device of the present inven.ion is to achieve simul.aneous or subs,antially si,nul.aneous melting of solder at the terminals 32 in order to enable ouick and clean re-moval of the conpor.ents from the printed circuit board 34, in order to minimize damage to the component 22, the terminals 32 and/or board 34. The uniform distribution and mixinq of heated air by the nozzle cevice of the present invention also facilitates clean and easy installation of a component onto a printed circuit board, and this zspect of operation of the device of the present application is discussed in more detail below.
Figure 3 shows an exploded perspective view of a preferred c~nstruction of the device of the present in-vention. The heater device 24 may be any suitable device for heating air, and is pref~-rably the heater device described and claimed in the above-mentioned co-pen~ing application serial number 74~,~0,. The heater device24 is connected to a spacer member 36 having an opening 38 through which heated air passes towards baffle member 18.
BaLfie member 18 may comprise a plate, preferably.by having elongated apertures 40 disposed about the edge of the baffle plate 18. A central aperture 42 is pro-vided for receiving a vacuum conduit 44 for removing a component from the printed circuit board 34 following melting of the solder at the terminals 32 or for holding a component prior to installation on the printed circuit board. The vacuum conduit 44 is connected to a source of vacuum (not shown), and is provided with a suction cup 46 (Figure 2) in order to ensure good attachment of the component 22 to the vacuum conduit 44.
The baffle member 18 is connected to a separator plate 48 having an opening 50 through which heated air passes following lateral deflection by the baffle member 18. The separator plate 48 is connected to nozzle 52 having a heated air delivery conduit 54 through which heated air passes towards the terminals 32 of the component 22. According to a preferred arrangement, the heated air delivery conduit 54 may be provided with spacer elements 56 in order to maintain the nozzle 52 at a desired distance above the upper surface 58 of the printed circuit board 34 so that heated air can exit through aperture 60 (Figure 4) after contacting and heating the solder at the terminals 32. In order to ensure good delivery of heated air from the heater device 24 through the baffle member 18 and the nozzle 52, a sealing member 62 is provided on an upper surface of the apertured separator plate 48. This sealing member can be of any suitable sealing material, for example an asbestos-containing material.
Figure 4 illustrates schematically the desired flow of heated air past the terminals 32 of the component 22. A constricted passageway for the heated air because the side members 64 of the heater air delivery conduit 54 are close to the sides 66 of the component 22 as well as to the upper surface 58 of the printed circuit board 34.
Preferably, in order to establish this effect, the walls 64 should be parallel (that is, substantially vertically oriented with respect to board 34). Moreover, the lower edge 65 of the nozzle should be disposed at least below the upper surface 67' of the component 22.
.
The ba fle me~ber 18 laterall~ disDerses and distribu~es the heated air to all s~ces of the com-ponent, and there is subs.antially no in,erference (such as tenas to occur with the apertures 10 ill~stra.ed in Fig~re 1) with the flo~ of heated air tow2rds the sides 66 of the component 2~. Thus, the he2ted air deli~ery con~uit 54 is confiaured so .hat nea.ed a.r pacses .ne ,erminals 32 as shown b~ .he arrow 68 to effect heat transfer from the heate~ air to tne solder a, the terminals 32. As discussed belo~, the termin2is 32 may be below the body of com?onent 22 or extend la.erally from the sidesof the comDonent 22.
Due to .he spacing of .he sidewall from the side of the component and the spacing of the lower edge of ihe nozzle from the board, melting of the solder of adjacent components is avoided. That is, most of the heat in the heated air is transfered to the solder to be melted. Thus, when it finally exits from under the lower edge of the nozzle, it mixes with the ambient air thus dropping its temperature. Further, the spacing of the lower edge from the board may preferably be such as to act as a control on the flow of the heated air as it passes the terminal and thus insure sufficient heat-is transferred to the solder to be melted. In general, the-spacing between the nozzle wall and the side of the component is preferably about 5-50 mils as is the spacing of the lower edge of the nozzle from the board where it should be understood spacings outside this range may also be employed. The ratio of the spacings will depend on the particular componentwhere in some instances the spacing of the wall from the side of the component will be greater than the spacing between the lower edge of the nozzle and the board while, in other instances, the reverse will be true, again depending on the particular component. In general, closeness of the sidewall to the component contributes to even reflow while closeness of the lower edge of the nozzle to the board contributes to air flow control.
- l o- 1293653 From the above discussion, it will be appreciated that ~he àesign of the aevice of the present invention is intended to provide uniform mixing OI h_ated air to-aether with even distribution of the heaied air between the ~ozzle and the sides of the comDonent in order to effec. simultaneous or subs.antially simul aneous mel.ing of tne solder at ihe t--_~inals of the component~
FiGu~es 5 end 6 show altern2.ive em~odiments for the shape of the nozzle 54. ~he parallel siced nozzle confiauration shown in Figures 2 through 9 is preferred, as stetçd above, but it is possible, according to the inventi.on, to utilize different nozzle shapes, such as the do~nw2rdly convercent configuration shown in Figure 5 or the downwardly divergent configuration shown in Figure 6.
In r.eferring to Figure 3, the hea~ed device 24, spacer memb,er 36, and baffle member 18 typicallv are connected ,o one another and form a portion of a hea.er unit such,zs heater unit 174(Figure 11) ~fvthe above mentioned co-pending app]ication~ ~ . Accoraingly, these members may be connected together via the apertures 39.
Moreover, the separator plate 48 and nozzle 52 may also be fixedly connected to baffle 18 via apertures 41. However, it is preferable that the separator plate and nozzle being moveable as a unit with respect to the above mentioned heater unit. Thus, separator plate 48 and nozzle 52 typically would be in-corporated in a nozzle locator unit such as u~i~ 176 (Figure 17) of co-pending application Cq~ G. where separator plate 48 and nozzle 52 of t~e present in-vention would respectively correspond to separator plate 180 and nozzle 178 of the above co-pending application.
~oreover, wnen the separator plate and nozzle are move-able as a unit with respect to the heater unit, it can be seen the sealing member 62 is effective to maintain a lluid seal when the nozzle l~cator unit is positiQned adjacent the heating unit.
lZ93653 ~ ot only is the nozzle locator unit including separator plate 48 and nozzle 52 moveable with respect to the heating unit but also the nozzle is typically re-moveable from the nozzle locator unit. Thus, different size nozzles may be employed to accommoda.e different size components. As shown in Figure 3, spring clips 43 may be disposed at opposite sides of separate plate ~8, tne clips having inwardly extending portions 45 for re-taining the flange 47 of nozzle 52 in place ~;hereby the nozzle is slideably inserted or removed in the direction of arrow A. The spri~g clips ~3 may correspond to ,hose shown at~ 78 in Figure 17 of co-pending application ' As discussed in the foregoing a~plication, one of the reasons for ma~ing the nozzle locator unit 176 movable with respect to tne heater unit is to facilitate accurate orientation of the component with respect io the heating unit. This is effected by the operator viewing the com-ponen~ through the nozzle (when the nozzle locator unitis separated from the heater unit) and adjusting the position of the component until it is s~metrically positioned within the lower opening of the nozzle: This is facili.ated in the foregoing co-pending application by making the perimeter of the nozzle's lower opening slightly greater than tnat of the component. This is further facilitated in the preferred embodiment of this invention due to the substantially vertical orientation of the side walls 64 of the nozzle with respect to board 39 whereby very accurate orientation can be effèct-ed either by the unaided eye or with a microscope.
The parallel sided nozzle of the present invention has further features including ease of manufacturing.
That is, it is easier to manufacture such a nozzle com-pared to the slanted wall nozzles of Fiaures 5 and 6.
Moreover, rectangular openings at the lower c-nd of the nozzle can be readily incorporated. To manufacture a nozzle with such an opening havina slan.ed walls is ouite difficult. ~loreover, the rectangular opening may be oriented either in ,he position shown in Figure 13 or in a position orthogonal thereto. Thus, difrerent orient-ations of rectangular co~ponents can be readily accom-modated. Preferably, when the lo-.~er opening is rectangular, the outer perimeter of flange 47 (Figure 3) of the nozzle is square. ~hus, any orienta.ion of a rectangular component is more readilv acco.l~mo ated by simply ro.ating the nozzle through 9oD (if necessary) before inserting it into spring clips 93 of seDarator 48.
The nozzles 52 are preferably fabricated from two senerally U-shaped members 52a and 52b (Figure 3) which are held together by a strap 53 typically spot ~elded to members 52a and 5~b. Preferably, .he strap terminates at a point 55 above the lower edge ~7 of tne nozzle. This point is above tne upper surface of the components and is typically 1/8" above the lower eage 57. ~hus, the nozzle may more readily be inserted bet~een closely spaced components on the board. That is, only the thickness of the sidewall 64 is inserted between the components due to the termination of strap ~3 at point 55.
In general, further characteristics the nozzle should have are low thermal conductivity, high temperature capability, and structural stability. A material such as stainless steel is suitable since it has the above characteristics even when made quite thin. In general, the nozzle wall thickness is preferably 5-25 mils where the thinner the wall, the better, the wall thickness being limited by structural stability. Wall thic~nesses other than those in the preferred range stated above may also be employed in suitable applications. If the wall may contact the solder as in the Figure 12 embodiment, the wall should also have the characteristics of non-solderability and be non-contaminating to the solder. ~gain, a material such as stainless steel fulfills this requirement.
O'her features of the nozzle will be described below with respect to Figures 12 and 13.
Figures 7 through 11 illustrate alternative embodiments of the baflle member 18. In Figure 7, the baffle member 18 is connected to vacuum tube 44 and has an upper surface 70 and downwardly depending side -13- 12936~
members 72 forming passageways 74 bet~een the sides 64 and the side member 72. Heated air is delivered towards the terminals 32 along the passage~ays 74 2S in~icated by the arrows 76.
Figure 8 snows an embodiment in which the baffle member 18 senerally corresponds to vacuum tube g4 such that the tube is configured so that it is closely over the up?er surface or the com?onent ?2. In this ~ay, the baIfle member serves both to deflect and mix heated air laterally prior to delivery LO the leads 32, while also serving to form a suction mem3er 78 connected to the vacuum conduit 44 for removing or installing the com-ponent. Moreover, the Figure 8 construction of the suction m~mber 78 may act as a heat shield for the component.
In Figure 9, the baffle member 18 has an external conical configuration, and in the embodiment illustrated in Figures 10 and 11, the baffle member 18 has an external upwardly curved surface. In Figure 10, the baffle member is spherical, and in Figure 11, the ba~fle member is parabolic, each of the baffles of Figures 9-11 being connected to the vacuum tube.
In the embodiments of Figures 7, 9, 10 and 11, the baffle member 18 encloses a substantial portion 73 of the space within the nozzle. This is a desirable feature as can be seen from a comparison with the embodiment of Figure 4. In Figure 4, the air within space 73 of the nozzle must be brought to solder melting temperature and thus there is a finite time ~elay be-fore this occurs. This delay is shortened or substantial-ly eliminated in the embodiments of Figures 7, 9, 10 and 11 since the air enclosed in space 73 need not be heated to solder melting temperature since it is not involved in the melting of the solder.
In general, any filler material such as pl~stic may be mounted on tube 94, for example, in the con-figuration of the baffle member of Figure 7 to avoid the necessity of heating the air within the nozzle.
12g3653 The embodiments discussed above are suitable for removing or installing components of any type, such as components ~hich are leadless (see numeral 80 in Figure 4), or J-leaded components (see numeral 82 in Figure 4). The embodiment illustrated in Figure 12, on the other hand, is particularly suited for installing or removing components having external leads, for example "gull wing" terminals, such as those shown schematically in Figure 12. In this particular embodiment, the side members 64 of the nozzle 52 are dimensioned such that hea~ed air contacts soldered regions 84 which are somewhat more remote from the sides of the component 66 than in the em-bodi~ents illustrated in Figure 4. With the arrangement shown in Figure 12, it is possible to melt the solder at the regions 84 and then to bring the sides of the nozzle 64 into contact with the molten solder in order to compress ,he solder and effect a complete seal. It is to be emphasized that al~hough the invention has been described ~:ith respect to components of the above type, there is no limitation as to the type of component which may be processed with the present invention. Thus, the components may also have leads of the reverse J-type, post ~or stilted) type, flat-pac type, etc.
In general, it can be seen that with the parallel sided nozzle of the present invention, not only is a constricted passageway (lormed between the nozzle sidewall and the side of the component) 67 (Figure 4) for the heated air provided air is pro-vided for leadless and J-leaded components but also the extent of the passageway is effectively increased with respect to slanted wall nozzles. As can be seen in Figure 4, the heated air has a substantially vertical component 68a as it passes the solder to be melted and a substantially hori~ontal component 68b as it passes beneath the lower edge of the sidewall. It is thought the vertical component 68a is more effective with lead-lecs and J-leaded cGmponents and t-he like ~hile the horizontal component 68b is more effecti~e with exten~ed lead components as in the Figure 12 embodiment and the like altho~gh there is no intent to be limited to a riar~-icular~theory of operation.
--` 129365:~
-`15--It should also be noted the embodiment of Figure 8 is also very suitable for use with extended lead components where region 84 of Figure 12 may be positioned, for example at 84a of Figure 8.
Figure 13 illustrates an embodiment of the invention which incorporates a locating means for locating a component wiihin the nozzle in order to facilitate accurate position-ing for installation on a printed circuit board. The locating means comprises at least one shaped corner 86 of the lower opening nozzle S2 where the shape of the corner may be radiused (or rounded), chopped off in a straight line (~eveled) or any other shape which will effect the various purposes discussed below. Each corner may be such that the component 22 can only touch the nozzle at the corners, and not on the sides of the component. Since many components have one or more corners chopped off for orientation purposes, it is possible to provide only one of the four corners with a shaped portion 86. However, it is equally possible to provide all four corners with a radiused portion and such an embodiment is shown in Figure 13. The component 22 slides freely into the nozzle 52, but the radiused portions 86 prevent the lead from touching the sides 64. In general, as long as the component can slide freely within the nozzle with or without shaping of the corners, even reflow can be insured. However, the shaped corner(s) described above will be an aid in effecting this condition. The component to be installed is held within the nozzle 52 by the vacuum conduit ~4 until placed onto the board prior to installation.
In this way, with the orientation of the component 22 fixed with respect to the nozzle 52, the only step which is required is to properly orient the printed circuit board with respect to the nozzle in order to achieve correct alignment of the terminals of the component 22 with the contacts on the printed circuit board. Note also the rounded corners prevent air flow at the corners. Since there are usually no terminals at the corners of a component, this directs more of the heated air to the sides of the component where the terminals are located.
~293653 An alternative possibility for locating com-ponents with respect to the nozzle 52 is to u~ilize the vacuum conduit 94. This would require adaptation of the vacuum conduit to make it non-rotational with respect to the nozzle, and this could be readily achievea by use of a suitable keying arrangement (not shown).
It has been found that components can be quickly and cleanly removed from a printed circuit board utiliz-ing the device of the present invention. The nozzle con iguration and baffle member give rise to uniform mixing and distribution of heated air about the terminals.
The spacing between the sides of the component and the inner surfaces of the nozzle provide substantially simultaneous melting of the solder at all of the terminals occurs witnout significant overheating of the component itself, the board or adjacent components.
The present in~ention re~ates to a ~evlce for delivering heated fluid, such as air, to the sides of a comDonent to melt solder at ,erminals disposed at the periphery of the component.
BhCKGROUND OF ~HE I~VEI~TION
Devices suitable lor use in remo~ing or installing modular electronic components from a substrate such as a printed circuit board include those which direct heated air at the terminals of the component from a source of heated air above the component to simultaneously melt the solder on each of the terminals. Examples of such devices are disclosed in U S. patents 4,295,596 and 4,366,925.
The devices in each of those two patents operate by direct-ing hot air onto .he terminals of a component; followed by removal of the component either mechanicall~ or by the application of suct-on.
A disadvantage associated with the prior devices is that heated air is not delivered uniiormly to the terminals, and this results in the generation of--hot spots in the region of the terminals and non-uniform melting or the solder. In light of this, removal of the components is often hindered due to the fact that the solder at one or more of the terminals is not melted when the solder at the remaining terminals is melted, and removal of the component under these circumstances is often accompanied by damage to the component, the leads and/or the printed circuit board.
It is therefore an object of the present invention to provide an improved device for delivering heated fluid -to the sides of the component to uniformly melt solder at terminals disposed at the periphery of the component to facilitate clean installation or removal of the com-ponent from a substrate.
~293653 In one aspect of the present invention there is provided an improved device of the above type incorporating a nozzle member and a baffle member disposed above or within the nozzle member for obtaining good distribution and mixing of heated air about the terminals in order to avoid the generation of hot spots and to ensure simultaneous melting of solder at all of the terminals to enable easy removal of the component from or installation of the component on a printed circuit board.
In a further aspect of this invention there is provided a constricted passageway to the heated fluid at the location of the terminals to facilitate rapid and effective heat transfer from the heated fluid to the solder to be melted at the terminals.
In another aspect of the present invention there is provided an improved nozzle suitable for use in conjunction with a device of the above type in the installing and removal of electronic components from circuits printed on a substrate.
SUMMARY OF THE INVENTION
Therefore, in accordance with the present invention, there is provided in combination, an electronic component, a substrate and a device for effectuating the removal or installation of the electronic component by the delivering of heated fluid along the sides of the electronic component to melt solder at terminals disposed at the periphery thereof, the device comprising means for generating a flow of the heated fluid and nozzle means removably mounted in association with the means for generating and the electronic component for receiving the flow of the heated fluid from the means for generating and for passing it along the sides of the electronic . , ' lZ93653 component while maintaining a pocket of cooler fluid above the electronic component; wherein the nozzle means consists of a tube having four side plates of a metallic material having a low thermal conductivity, high temperature capability and structural stability, the side plates being connected together into a rectangular parallelepiped having a hollow interior space completely spanning the distance between the plates;
wherein the electronic component is disposed within the interior space in a manner creating a means for evenly distributing the flow of heated fluid along side walls of the component by defining a constricted passageway between the each side plate and a respective side wall of the electronic component that has a width, between each respective side plate and side wall of the component, in a range of 5-50 mils; and wherein the nozzle means is oriented with the side plates extending normal to the substrate in a manner creating a means for controlling the transfer of heat to the terminas from the fluid flow exiting the nozzle means, by a lower edge of the side plates being spaced from the substrate by a distance within a range of 5-50 mils.
According to another embodiment of the invention, the nozzle means includes a locating means for locating a component within the nozzle in a particular predetermined orientation.
According to one embodiment, the locating means comprises a radiused portion disposed at at least three corners of the nozzle means.
In accordance with a second aspect of the present invention there is provided a method of effectuating the removal or installation of an electronic component on a substrate by the delivery of heated fluid along the sides of the electronic component to melt solder at terminals disposed at the periphery thereof comprising the steps of:
(A) providing a nozzle consisting of a tube having four side B
1Zg3~iS3 - 4a -plates, of a metallic material of low thermal conductivity, high temperature capability, and structural stability, connected together into a rectangular parallelepiped having a hollow interior space completely spanning the distance between the plates: (B) delivering a flow of heated fluid into the interior space; (C) disposing the electronic component within the interior space in a manner defining a constricted passageway, between each side plate and a respective side wall of the component, the passageway having a width, between the respective side plate and side walls of the electronic component, in a range of 5-50 mils for evenly distributing the flow of heated fluid along the side wall of the component while maintaining a pocket of cooler fluid above the component;
(D) orienting the nozzle with the side plates extending normal to the substrate and controlling the transfer of heat to the terminals, from the fluid flow exiting the nozzle, by spacing a lower edge of the side plates of the nozzle from the substrate at a distance within a range of 5-50 mils.
B
12~3653 BRlEF DESCRIPTION OF THE DRAWINGS
The invention of the present application will now be described in more detail with reference to preferred embodi-ments, given only by way of example, and with reference to the accompanying drawings, in which:
Figure 1 is a schematic side elevation of an earlier component removal/installation arrangement;
Figure 2 is a schematic side elevation of a component removal/installation device of the present invention;
Figure 3 is a perspective exploded view of a device of the present invention;
Figure 4 is an enlarged view of a portion of the device illustrated in Figure 2;
Figure 5 and 6 are schematic side elevations of alterna-tive embodiments of the present invention;
Figures 7 through 11 are alternative embodiments of baffle means usable in the device of the present invention;
Figure 12 is a schematic side elevation of a further embodiment of the device of the present invention; and Figure 13 is a plan view of a nozzle of the present invention showing a locating means.
DETAILED DESCRIPTION OF THE INVENTION
The component removal/installation device of the present invention is particularly suited for use in conjunction with the device described and claimed in copending Canadian patent application serial number 475,000 filed February 22, 1985.
~Pi 125~
In the following description, reference will be made to air as the fluid being heated. However, it will be ap-preciated that the invention is not limited to the use of air, and other fluids such as inert gases, including nitro-gen, argon and carbon dioxide, may be used, if desired.
Referring now to the drawings, Figure 1 shows schemati-cally, the component removal installation arrangement described in copending Canadian patent application serial number 511,073 filed June 6, 1986. The arrangement shown in Figure 1, and generally referenced 2, comprises a nozzle 4, a heated device 6 and an orifice plate 8 having a plurality of orifices 10 extending around the periphery of the orifice plate. The hea~er device 6 is separated from the orifice plate 8 to provide a plenum 12, and heated air, which is heated by the heater device 6, passes from the plenum 12 through the orifices 10 into the nozzle 4 and ultimately reaches the terminals 14 of the component 16 in order to effect melting of solder or the like at the terminals.
Turning to Figures 2 through 10, which illustrate embodiments of the cornponent removal/installation device of the present application, the orifice plate 8 illustrated in Figure 1 is replaced by a baffle member 18 for directing heated air entering above the baffle plate generally lateral-ly, as indicated by arrows 20 prior to delivery of heated air towards component 22. In the embodiment illustrated in Figure 2, air is heated by a heated device 24, and enters into region 26 above the baffle member 18 through entry port 28. In the region 26, the heated air is directed generally laterally as indicated by the arrow 20, and then descends towards the ~J~
~.c~
` ~7- lZ93653 .
compo,nent 22 as indicated by ,he arrows 30. This lateral deflection of heated air prior to delivery to~-ards the component 22 produces goo~ mixing and distribution of the air about terminals 32 of the co~,Donent 22, and thereby avoids the formation of hot spots and non-uniform melting of solder at the .erminals 32. A primary objec,ive of the device of the present inven.ion is to achieve simul.aneous or subs,antially si,nul.aneous melting of solder at the terminals 32 in order to enable ouick and clean re-moval of the conpor.ents from the printed circuit board 34, in order to minimize damage to the component 22, the terminals 32 and/or board 34. The uniform distribution and mixinq of heated air by the nozzle cevice of the present invention also facilitates clean and easy installation of a component onto a printed circuit board, and this zspect of operation of the device of the present application is discussed in more detail below.
Figure 3 shows an exploded perspective view of a preferred c~nstruction of the device of the present in-vention. The heater device 24 may be any suitable device for heating air, and is pref~-rably the heater device described and claimed in the above-mentioned co-pen~ing application serial number 74~,~0,. The heater device24 is connected to a spacer member 36 having an opening 38 through which heated air passes towards baffle member 18.
BaLfie member 18 may comprise a plate, preferably.by having elongated apertures 40 disposed about the edge of the baffle plate 18. A central aperture 42 is pro-vided for receiving a vacuum conduit 44 for removing a component from the printed circuit board 34 following melting of the solder at the terminals 32 or for holding a component prior to installation on the printed circuit board. The vacuum conduit 44 is connected to a source of vacuum (not shown), and is provided with a suction cup 46 (Figure 2) in order to ensure good attachment of the component 22 to the vacuum conduit 44.
The baffle member 18 is connected to a separator plate 48 having an opening 50 through which heated air passes following lateral deflection by the baffle member 18. The separator plate 48 is connected to nozzle 52 having a heated air delivery conduit 54 through which heated air passes towards the terminals 32 of the component 22. According to a preferred arrangement, the heated air delivery conduit 54 may be provided with spacer elements 56 in order to maintain the nozzle 52 at a desired distance above the upper surface 58 of the printed circuit board 34 so that heated air can exit through aperture 60 (Figure 4) after contacting and heating the solder at the terminals 32. In order to ensure good delivery of heated air from the heater device 24 through the baffle member 18 and the nozzle 52, a sealing member 62 is provided on an upper surface of the apertured separator plate 48. This sealing member can be of any suitable sealing material, for example an asbestos-containing material.
Figure 4 illustrates schematically the desired flow of heated air past the terminals 32 of the component 22. A constricted passageway for the heated air because the side members 64 of the heater air delivery conduit 54 are close to the sides 66 of the component 22 as well as to the upper surface 58 of the printed circuit board 34.
Preferably, in order to establish this effect, the walls 64 should be parallel (that is, substantially vertically oriented with respect to board 34). Moreover, the lower edge 65 of the nozzle should be disposed at least below the upper surface 67' of the component 22.
.
The ba fle me~ber 18 laterall~ disDerses and distribu~es the heated air to all s~ces of the com-ponent, and there is subs.antially no in,erference (such as tenas to occur with the apertures 10 ill~stra.ed in Fig~re 1) with the flo~ of heated air tow2rds the sides 66 of the component 2~. Thus, the he2ted air deli~ery con~uit 54 is confiaured so .hat nea.ed a.r pacses .ne ,erminals 32 as shown b~ .he arrow 68 to effect heat transfer from the heate~ air to tne solder a, the terminals 32. As discussed belo~, the termin2is 32 may be below the body of com?onent 22 or extend la.erally from the sidesof the comDonent 22.
Due to .he spacing of .he sidewall from the side of the component and the spacing of the lower edge of ihe nozzle from the board, melting of the solder of adjacent components is avoided. That is, most of the heat in the heated air is transfered to the solder to be melted. Thus, when it finally exits from under the lower edge of the nozzle, it mixes with the ambient air thus dropping its temperature. Further, the spacing of the lower edge from the board may preferably be such as to act as a control on the flow of the heated air as it passes the terminal and thus insure sufficient heat-is transferred to the solder to be melted. In general, the-spacing between the nozzle wall and the side of the component is preferably about 5-50 mils as is the spacing of the lower edge of the nozzle from the board where it should be understood spacings outside this range may also be employed. The ratio of the spacings will depend on the particular componentwhere in some instances the spacing of the wall from the side of the component will be greater than the spacing between the lower edge of the nozzle and the board while, in other instances, the reverse will be true, again depending on the particular component. In general, closeness of the sidewall to the component contributes to even reflow while closeness of the lower edge of the nozzle to the board contributes to air flow control.
- l o- 1293653 From the above discussion, it will be appreciated that ~he àesign of the aevice of the present invention is intended to provide uniform mixing OI h_ated air to-aether with even distribution of the heaied air between the ~ozzle and the sides of the comDonent in order to effec. simultaneous or subs.antially simul aneous mel.ing of tne solder at ihe t--_~inals of the component~
FiGu~es 5 end 6 show altern2.ive em~odiments for the shape of the nozzle 54. ~he parallel siced nozzle confiauration shown in Figures 2 through 9 is preferred, as stetçd above, but it is possible, according to the inventi.on, to utilize different nozzle shapes, such as the do~nw2rdly convercent configuration shown in Figure 5 or the downwardly divergent configuration shown in Figure 6.
In r.eferring to Figure 3, the hea~ed device 24, spacer memb,er 36, and baffle member 18 typicallv are connected ,o one another and form a portion of a hea.er unit such,zs heater unit 174(Figure 11) ~fvthe above mentioned co-pending app]ication~ ~ . Accoraingly, these members may be connected together via the apertures 39.
Moreover, the separator plate 48 and nozzle 52 may also be fixedly connected to baffle 18 via apertures 41. However, it is preferable that the separator plate and nozzle being moveable as a unit with respect to the above mentioned heater unit. Thus, separator plate 48 and nozzle 52 typically would be in-corporated in a nozzle locator unit such as u~i~ 176 (Figure 17) of co-pending application Cq~ G. where separator plate 48 and nozzle 52 of t~e present in-vention would respectively correspond to separator plate 180 and nozzle 178 of the above co-pending application.
~oreover, wnen the separator plate and nozzle are move-able as a unit with respect to the heater unit, it can be seen the sealing member 62 is effective to maintain a lluid seal when the nozzle l~cator unit is positiQned adjacent the heating unit.
lZ93653 ~ ot only is the nozzle locator unit including separator plate 48 and nozzle 52 moveable with respect to the heating unit but also the nozzle is typically re-moveable from the nozzle locator unit. Thus, different size nozzles may be employed to accommoda.e different size components. As shown in Figure 3, spring clips 43 may be disposed at opposite sides of separate plate ~8, tne clips having inwardly extending portions 45 for re-taining the flange 47 of nozzle 52 in place ~;hereby the nozzle is slideably inserted or removed in the direction of arrow A. The spri~g clips ~3 may correspond to ,hose shown at~ 78 in Figure 17 of co-pending application ' As discussed in the foregoing a~plication, one of the reasons for ma~ing the nozzle locator unit 176 movable with respect to tne heater unit is to facilitate accurate orientation of the component with respect io the heating unit. This is effected by the operator viewing the com-ponen~ through the nozzle (when the nozzle locator unitis separated from the heater unit) and adjusting the position of the component until it is s~metrically positioned within the lower opening of the nozzle: This is facili.ated in the foregoing co-pending application by making the perimeter of the nozzle's lower opening slightly greater than tnat of the component. This is further facilitated in the preferred embodiment of this invention due to the substantially vertical orientation of the side walls 64 of the nozzle with respect to board 39 whereby very accurate orientation can be effèct-ed either by the unaided eye or with a microscope.
The parallel sided nozzle of the present invention has further features including ease of manufacturing.
That is, it is easier to manufacture such a nozzle com-pared to the slanted wall nozzles of Fiaures 5 and 6.
Moreover, rectangular openings at the lower c-nd of the nozzle can be readily incorporated. To manufacture a nozzle with such an opening havina slan.ed walls is ouite difficult. ~loreover, the rectangular opening may be oriented either in ,he position shown in Figure 13 or in a position orthogonal thereto. Thus, difrerent orient-ations of rectangular co~ponents can be readily accom-modated. Preferably, when the lo-.~er opening is rectangular, the outer perimeter of flange 47 (Figure 3) of the nozzle is square. ~hus, any orienta.ion of a rectangular component is more readilv acco.l~mo ated by simply ro.ating the nozzle through 9oD (if necessary) before inserting it into spring clips 93 of seDarator 48.
The nozzles 52 are preferably fabricated from two senerally U-shaped members 52a and 52b (Figure 3) which are held together by a strap 53 typically spot ~elded to members 52a and 5~b. Preferably, .he strap terminates at a point 55 above the lower edge ~7 of tne nozzle. This point is above tne upper surface of the components and is typically 1/8" above the lower eage 57. ~hus, the nozzle may more readily be inserted bet~een closely spaced components on the board. That is, only the thickness of the sidewall 64 is inserted between the components due to the termination of strap ~3 at point 55.
In general, further characteristics the nozzle should have are low thermal conductivity, high temperature capability, and structural stability. A material such as stainless steel is suitable since it has the above characteristics even when made quite thin. In general, the nozzle wall thickness is preferably 5-25 mils where the thinner the wall, the better, the wall thickness being limited by structural stability. Wall thic~nesses other than those in the preferred range stated above may also be employed in suitable applications. If the wall may contact the solder as in the Figure 12 embodiment, the wall should also have the characteristics of non-solderability and be non-contaminating to the solder. ~gain, a material such as stainless steel fulfills this requirement.
O'her features of the nozzle will be described below with respect to Figures 12 and 13.
Figures 7 through 11 illustrate alternative embodiments of the baflle member 18. In Figure 7, the baffle member 18 is connected to vacuum tube 44 and has an upper surface 70 and downwardly depending side -13- 12936~
members 72 forming passageways 74 bet~een the sides 64 and the side member 72. Heated air is delivered towards the terminals 32 along the passage~ays 74 2S in~icated by the arrows 76.
Figure 8 snows an embodiment in which the baffle member 18 senerally corresponds to vacuum tube g4 such that the tube is configured so that it is closely over the up?er surface or the com?onent ?2. In this ~ay, the baIfle member serves both to deflect and mix heated air laterally prior to delivery LO the leads 32, while also serving to form a suction mem3er 78 connected to the vacuum conduit 44 for removing or installing the com-ponent. Moreover, the Figure 8 construction of the suction m~mber 78 may act as a heat shield for the component.
In Figure 9, the baffle member 18 has an external conical configuration, and in the embodiment illustrated in Figures 10 and 11, the baffle member 18 has an external upwardly curved surface. In Figure 10, the baffle member is spherical, and in Figure 11, the ba~fle member is parabolic, each of the baffles of Figures 9-11 being connected to the vacuum tube.
In the embodiments of Figures 7, 9, 10 and 11, the baffle member 18 encloses a substantial portion 73 of the space within the nozzle. This is a desirable feature as can be seen from a comparison with the embodiment of Figure 4. In Figure 4, the air within space 73 of the nozzle must be brought to solder melting temperature and thus there is a finite time ~elay be-fore this occurs. This delay is shortened or substantial-ly eliminated in the embodiments of Figures 7, 9, 10 and 11 since the air enclosed in space 73 need not be heated to solder melting temperature since it is not involved in the melting of the solder.
In general, any filler material such as pl~stic may be mounted on tube 94, for example, in the con-figuration of the baffle member of Figure 7 to avoid the necessity of heating the air within the nozzle.
12g3653 The embodiments discussed above are suitable for removing or installing components of any type, such as components ~hich are leadless (see numeral 80 in Figure 4), or J-leaded components (see numeral 82 in Figure 4). The embodiment illustrated in Figure 12, on the other hand, is particularly suited for installing or removing components having external leads, for example "gull wing" terminals, such as those shown schematically in Figure 12. In this particular embodiment, the side members 64 of the nozzle 52 are dimensioned such that hea~ed air contacts soldered regions 84 which are somewhat more remote from the sides of the component 66 than in the em-bodi~ents illustrated in Figure 4. With the arrangement shown in Figure 12, it is possible to melt the solder at the regions 84 and then to bring the sides of the nozzle 64 into contact with the molten solder in order to compress ,he solder and effect a complete seal. It is to be emphasized that al~hough the invention has been described ~:ith respect to components of the above type, there is no limitation as to the type of component which may be processed with the present invention. Thus, the components may also have leads of the reverse J-type, post ~or stilted) type, flat-pac type, etc.
In general, it can be seen that with the parallel sided nozzle of the present invention, not only is a constricted passageway (lormed between the nozzle sidewall and the side of the component) 67 (Figure 4) for the heated air provided air is pro-vided for leadless and J-leaded components but also the extent of the passageway is effectively increased with respect to slanted wall nozzles. As can be seen in Figure 4, the heated air has a substantially vertical component 68a as it passes the solder to be melted and a substantially hori~ontal component 68b as it passes beneath the lower edge of the sidewall. It is thought the vertical component 68a is more effective with lead-lecs and J-leaded cGmponents and t-he like ~hile the horizontal component 68b is more effecti~e with exten~ed lead components as in the Figure 12 embodiment and the like altho~gh there is no intent to be limited to a riar~-icular~theory of operation.
--` 129365:~
-`15--It should also be noted the embodiment of Figure 8 is also very suitable for use with extended lead components where region 84 of Figure 12 may be positioned, for example at 84a of Figure 8.
Figure 13 illustrates an embodiment of the invention which incorporates a locating means for locating a component wiihin the nozzle in order to facilitate accurate position-ing for installation on a printed circuit board. The locating means comprises at least one shaped corner 86 of the lower opening nozzle S2 where the shape of the corner may be radiused (or rounded), chopped off in a straight line (~eveled) or any other shape which will effect the various purposes discussed below. Each corner may be such that the component 22 can only touch the nozzle at the corners, and not on the sides of the component. Since many components have one or more corners chopped off for orientation purposes, it is possible to provide only one of the four corners with a shaped portion 86. However, it is equally possible to provide all four corners with a radiused portion and such an embodiment is shown in Figure 13. The component 22 slides freely into the nozzle 52, but the radiused portions 86 prevent the lead from touching the sides 64. In general, as long as the component can slide freely within the nozzle with or without shaping of the corners, even reflow can be insured. However, the shaped corner(s) described above will be an aid in effecting this condition. The component to be installed is held within the nozzle 52 by the vacuum conduit ~4 until placed onto the board prior to installation.
In this way, with the orientation of the component 22 fixed with respect to the nozzle 52, the only step which is required is to properly orient the printed circuit board with respect to the nozzle in order to achieve correct alignment of the terminals of the component 22 with the contacts on the printed circuit board. Note also the rounded corners prevent air flow at the corners. Since there are usually no terminals at the corners of a component, this directs more of the heated air to the sides of the component where the terminals are located.
~293653 An alternative possibility for locating com-ponents with respect to the nozzle 52 is to u~ilize the vacuum conduit 94. This would require adaptation of the vacuum conduit to make it non-rotational with respect to the nozzle, and this could be readily achievea by use of a suitable keying arrangement (not shown).
It has been found that components can be quickly and cleanly removed from a printed circuit board utiliz-ing the device of the present invention. The nozzle con iguration and baffle member give rise to uniform mixing and distribution of heated air about the terminals.
The spacing between the sides of the component and the inner surfaces of the nozzle provide substantially simultaneous melting of the solder at all of the terminals occurs witnout significant overheating of the component itself, the board or adjacent components.
Claims (22)
1. In combination, an electronic component, a substrate and a device for effectuating the removal or installation of said electronic component by the delivering of heated fluid along the sides of said electronic component to melt solder at terminals disposed at the periphery thereof, said device comprising means for generating a flow of said heated fluid and nozzle means removably mounted in association with said means for generating and said electronic component for receiving the flow of said heated fluid from the means for generating and for passing it along the sides of said electronic component while maintaining a pocket of cooler fluid above said electronic component;
wherein said nozzle means consists of a tube having four side plates of a metallic material having a low thermal conductivity, high temperature capability and structural stability, said side plates being connected together into a rectangular parallelepiped having a hollow interior space completely spanning the distance between said plates;
wherein said electronic component is disposed within said interior space in a manner creating a means for evenly distributing said flow of heated fluid along side walls of the component by defining a constricted passageway between the each side plate and a respective side wall of the electronic component that has a width, between each respective side plate and side wall of the component, in a range of 5-50 mils; and wherein said nozzle means is oriented with said side plates extending normal to said substrate in a manner creating a means for controlling the transfer of heat to said terminas from the fluid flow exiting said nozzle means, by a lower edge of the side plates being spaced from the substrate by a distance within a range of 5-50 mils.
wherein said nozzle means consists of a tube having four side plates of a metallic material having a low thermal conductivity, high temperature capability and structural stability, said side plates being connected together into a rectangular parallelepiped having a hollow interior space completely spanning the distance between said plates;
wherein said electronic component is disposed within said interior space in a manner creating a means for evenly distributing said flow of heated fluid along side walls of the component by defining a constricted passageway between the each side plate and a respective side wall of the electronic component that has a width, between each respective side plate and side wall of the component, in a range of 5-50 mils; and wherein said nozzle means is oriented with said side plates extending normal to said substrate in a manner creating a means for controlling the transfer of heat to said terminas from the fluid flow exiting said nozzle means, by a lower edge of the side plates being spaced from the substrate by a distance within a range of 5-50 mils.
2. A combination as in claim 1 including a baffle member disposed between said means for generating and said component for directing the heated fluid generally laterally toward said downwardly extending side plates and then through at least one extended opening prior to delivery of the heated fluid to the constricted passageway.
3. A combination according to claim 2, wherein said baffle member includes a vacuum suction means for removing said component from a substrate or holding a component during installation of a component on a substrate.
4. A combination according to claim 2, wherein said nozzle means includes locating means for locating said component in relation to said nozzle means.
5. A combination according to claim 4, wherein said locating means comprises at least one shaped portion at a corner of the lower opening of said nozzle means.
6. A combination as in claim 5 including a pair of hollow spacer means respectively disposed between (a) said means for generating and said baffle member and (b) said baffle member and said nozzle means.
7. A combination as in claim 1 where said nozzle means includes a flange connected to said side plates and extending around said upper opening.
8. A combination as in claim 7 where the nozzle means includes means for removably engaging said flange.
9. A combination as in claim 8 where said means for removably engaging said flange includes pair of spring clips.
10. A combination as in claim 7 where said flange is square.
11. A combination as in claim 1 where said combination includes a vacuum tube extending through said nozzle means, said tube applying vacuum to said component.
12. A combination as in claim 1 where said lower opening of said nozzle means is rectangular.
13. A combination as in claim 12 where said nozzle means includes a flange extending around the upper opening thereof, the outer perimeter of the flange being square in configuration whereby said nozzle means may be inserted into said device in either one of two orthogonal orientations to accommodate rectangular components having different orthogonal orientations with respect to each other on said substrate.
14. A combination as in claim 1 where said nozzle means includes spacer means disposed at the lower edge thereof to facilitate spacing of the nozzle means with respect to the substrate.
15. A combination as in claim 1 where said nozzle means includes rounded corners to substantially prevent the heated fluid from contacting the corners of the component.
16. A combination as in claim 1 where said nozzle means includes two mating, substantially U-shaped members and an elongated strap bonded to and connecting said members together, said strap extending along at least a portion of the line where the two members mate.
17. A combination as in claim 16 where said strap terminates at its lower end at a point above said component to facilitate the insertion of said nozzle means between closely spaced adjacent components.
18. A combination as in claim 17 where said lower end of said strap terminates about 1/8 inch above the lower edge of the nozzle.
19. A combination as in claim 1 where said component is of the leadless type.
20. A combination as in claim 1 where said component is of the J-leaded type.
21. A combination as in claim 1 where said component is of the gull-wing-leaded type.
22. A method of effectuating the removal or installation of an electronic component on a substrate by the delivery of heated fluid along the sides of the electronic component to melt solder at terminals disposed at the periphery thereof comprising the steps of:
(A) providing a nozzle consisting of a tube having four side plates, of a metallic material of low thermal conductivity, high temperature capability, and structural stability, connected together into a rectangular parallelepiped having a hollow interior space completely spanning the distance between said plates;
(B) delivering a flow of heated fluid into said interior space;
(C) disposing said electronic component within said interior space in a manner defining a constricted passageway, between each side plate and a respective side wall of the component, the passageway having a width, between the respective side plate and side walls of the electronic component, in a range of 5-50 mils for evenly distributing said flow of heated fluid along the side wall of the component while maintaining a pocket of cooler fluid above said component;
(D) orienting said nozzle with said side plates extending normal to the substrate and controlling the transfer of heat to said terminals, from the fluid flow exiting the said nozzle, by spacing a lower edge of the side plates of the nozzle from the substrate at a distance within a range of 5-50 mils.
(A) providing a nozzle consisting of a tube having four side plates, of a metallic material of low thermal conductivity, high temperature capability, and structural stability, connected together into a rectangular parallelepiped having a hollow interior space completely spanning the distance between said plates;
(B) delivering a flow of heated fluid into said interior space;
(C) disposing said electronic component within said interior space in a manner defining a constricted passageway, between each side plate and a respective side wall of the component, the passageway having a width, between the respective side plate and side walls of the electronic component, in a range of 5-50 mils for evenly distributing said flow of heated fluid along the side wall of the component while maintaining a pocket of cooler fluid above said component;
(D) orienting said nozzle with said side plates extending normal to the substrate and controlling the transfer of heat to said terminals, from the fluid flow exiting the said nozzle, by spacing a lower edge of the side plates of the nozzle from the substrate at a distance within a range of 5-50 mils.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US79044885A | 1985-10-23 | 1985-10-23 | |
| US790,448 | 1985-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1293653C true CA1293653C (en) | 1991-12-31 |
Family
ID=25150710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000512019A Expired - Fee Related CA1293653C (en) | 1985-10-23 | 1986-06-20 | Nozzle device |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS62113497A (en) |
| CA (1) | CA1293653C (en) |
| DE (1) | DE3624728A1 (en) |
| FR (1) | FR2589029B1 (en) |
| GB (1) | GB2181981B (en) |
| IT (1) | IT1209978B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4787548A (en) * | 1987-07-27 | 1988-11-29 | Pace Incorporated | Nozzle structure for soldering and desoldering |
| DE3881623D1 (en) * | 1987-08-31 | 1993-07-15 | Siemens Ag | Soldering head for soldering or unsoldering of components by means of heating by hot gas, especially for surface-mountable components (SMD). |
| ATE90248T1 (en) * | 1989-09-29 | 1993-06-15 | Siemens Nixdorf Inf Syst | SOLDERING DEVICE FOR SOLDERING COMPONENTS ON CIRCUIT BOARDS. |
| DE9113986U1 (en) * | 1991-11-11 | 1992-04-16 | Zevac Auslötsysteme GmbH, 3548 Arolsen | Soldering device for soldering and desoldering electrical components |
| JP2714520B2 (en) * | 1992-08-28 | 1998-02-16 | 株式会社日立製作所 | Mounting component mounting / dismounting device |
| DE4345109C2 (en) * | 1993-12-28 | 2002-10-24 | Finetech Ges Fuer Elektronik T | Tool for soldering and desoldering solder joints of a socket of a multi-pole integrated circuit |
| DE4422341C2 (en) * | 1994-06-27 | 1997-03-06 | Martin Umwelt & Energietech | Soldering device |
| US20170121210A1 (en) * | 2015-10-30 | 2017-05-04 | Corning Incorported | Method and apparatus for shaping a 3d glass-based article |
| CN115365600B (en) * | 2022-09-16 | 2023-09-15 | 李文雄 | Welding and disassembling device and welding and disassembling method for circuit board chip |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3718800A (en) * | 1968-03-05 | 1973-02-27 | Argus Eng Co | Infrared heating apparatus |
| US3522407A (en) * | 1968-03-05 | 1970-08-04 | Argus Eng Co | Heating method |
| US4295596A (en) * | 1979-12-19 | 1981-10-20 | Western Electric Company, Inc. | Methods and apparatus for bonding an article to a metallized substrate |
| JPS5873189A (en) * | 1981-10-27 | 1983-05-02 | 富士通株式会社 | Structure of hot air nozzle unit for automatic electronic part removing device |
| DE8334840U1 (en) * | 1983-12-05 | 1984-03-22 | Cooper Industries, Inc., 77210 Houston, Tex. | SOLDERING DEVICE FOR FASTENING ELECTRICAL AND ELECTRONIC COMPONENTS ON PCB |
| GB2154921B (en) * | 1984-02-24 | 1988-06-08 | Pace Inc | Device for attaching modular electronic components to or removing them from an insulative substrate |
| FR2573950B3 (en) * | 1984-11-27 | 1987-06-19 | Matra | METHOD AND DEVICE FOR EXTRACTING WELDED ELECTRONIC COMPONENTS |
| JPS61141197A (en) * | 1984-12-14 | 1986-06-28 | 富士通株式会社 | Method and apparatus for removing flat lead type electronic component |
| JPS6285494A (en) * | 1985-10-09 | 1987-04-18 | 株式会社日立製作所 | Device for detaching part |
-
1986
- 1986-06-20 CA CA000512019A patent/CA1293653C/en not_active Expired - Fee Related
- 1986-07-22 DE DE19863624728 patent/DE3624728A1/en not_active Ceased
- 1986-07-31 GB GB8618672A patent/GB2181981B/en not_active Expired
- 1986-08-07 IT IT8648369A patent/IT1209978B/en active
- 1986-09-03 JP JP61207643A patent/JPS62113497A/en active Pending
- 1986-10-20 FR FR8614537A patent/FR2589029B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| GB2181981A (en) | 1987-05-07 |
| FR2589029B1 (en) | 1995-06-23 |
| DE3624728A1 (en) | 1987-04-23 |
| GB2181981B (en) | 1989-11-08 |
| GB8618672D0 (en) | 1986-09-10 |
| FR2589029A1 (en) | 1987-04-24 |
| IT8648369A0 (en) | 1986-08-07 |
| IT1209978B (en) | 1989-08-30 |
| JPS62113497A (en) | 1987-05-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKLA | Lapsed |