ES2144209T3 - IMPROVED WELDING METHOD BY OVEN REFLUX. - Google Patents
IMPROVED WELDING METHOD BY OVEN REFLUX.Info
- Publication number
- ES2144209T3 ES2144209T3 ES96305757T ES96305757T ES2144209T3 ES 2144209 T3 ES2144209 T3 ES 2144209T3 ES 96305757 T ES96305757 T ES 96305757T ES 96305757 T ES96305757 T ES 96305757T ES 2144209 T3 ES2144209 T3 ES 2144209T3
- Authority
- ES
- Spain
- Prior art keywords
- printed circuit
- corrective
- openings
- circuit board
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/087—Using a reactive gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
METODO DE SOLDADURA POR REFLUJO EFICAZMENTE DE UNO O MAS DISPOSITIVOS (11) PARA UNA TARJETA DE CIRCUITO IMPRESO (12) CON UN HORNO DE CALENTAMIENTO POR CONVECCION (13), CADA DISPOSITIVO (11) TIENE UNA PLURALIDAD DE PATILLAS DE CONEXION ELECTRONICA PARA FIJACION EN LA PLACA (15) QUE ESTAN PARA SER SOLDADAS DENTRO DE LAS APERTURAS DE UNION RESPECTIVAS (17) DE LA TARJETA DE CIRCUITO IMPRESO (12) PARA CONEXION ELECTRONICA, EL METODO COMPRENDE: (I)COLOCACION DE UNA PASTA DE SOLDAR EN CADA UN A DE LAS ABERTURAS (17); (II) ENSAMBLAJE DEL DISPOSITIVO (11) EN LA TARJETA DE CIRCUITO IMPRESO (12) POR POSICIONAMIENTO DE LA PLACA (28) DEL DISPOSITIVO (11) A LO LARGO, PERO ESPACIADOS EN RELACION, LA TARJETA DE CIRCUITO IMPRESO (12) PARA DEFINIR UN ESPACIO PLANO (30) ENTRE ELLOS, CON LAS PATILLAS (15) INTRODUCIENDOSE EN LAS ABERTURAS (17) Y DENTRO DE LA PASTA DE SOLDAR PARA FORMAR ASI UN CONJUNTO; Y (III)PASAR EL CONJUNTO POR EL HORNO DE CALENTAMIENTO POR CONVECCION (13) DURAMENTE DURANTE UN PERIODO DE TIMEPOR PARA DERRETIR LA PASTA DE SOLDAR Y FORMAR UNA CONEXION VALIDA HASTA QUITARLO DEL CALENTAMIENTO CORRECTIVO, DICHO PASO ES SACADO POR EL USO DE CARACTERISTICAS DE LOCALIZACION DEL CALENTAMIENTO CORRECTIVO QUE GUIA EL FLUJO DE CALOR CORRECTIVO ENTRE LA PLACA Y LA TARJETA PARA MEJORAR EL CALENTAMIENTO CORRECTIVO DE LA PASTA DE SOLDAR DESDE AMBOS LADOS DE LA TARJETA.METHOD OF EFFECTIVELY REFLUX WELDING OF ONE OR MORE DEVICES (11) FOR A PRINTED CIRCUIT BOARD (12) WITH A CONVECTION HEATING OVEN (13), EACH DEVICE (11) HAS A PLURALITY OF ELECTRONIC CONNECTION PINS FOR ATTACHMENT THE PLATE (15) THAT IS TO BE WELDED WITHIN THE RESPECTIVE UNION OPENINGS (17) OF THE PRINTED CIRCUIT CARD (12) FOR ELECTRONIC CONNECTION, THE METHOD INCLUDES: (I) PLACEMENT OF A WELDING PASTE IN EACH ONE OF THE OPENINGS (17); (II) ASSEMBLY OF THE DEVICE (11) IN THE PRINTED CIRCUIT BOARD (12) BY POSITIONING OF THE PLATE (28) OF THE DEVICE (11) ALONG, BUT SPACED IN RELATION, THE PRINTED CIRCUIT BOARD (12) TO DEFINE A FLAT SPACE (30) BETWEEN THEM, WITH THE PINS (15) INTRODUCING THEMSELVES IN THE OPENINGS (17) AND WITHIN THE WELDING PASTE TO FORM A JOINT; AND (III) PASS THE ASSEMBLY THROUGH THE CONVECTION HEATING OVEN (13) DURINGLY DURING A TIMEPOR PERIOD TO MELT THE WELDING PASTE AND FORM A VALID CONNECTION UNTIL REMOVING IT FROM THE CORRECTIVE HEATING, SUCH A STEP IS TAKEN OUT OF THE USE OF CHARACTERISTIC LOCATION OF CORRECTIVE HEATING THAT GUIDES THE CORRECTIVE HEAT FLOW BETWEEN THE PLATE AND THE CARD TO IMPROVE THE CORRECTIVE HEATING OF THE WELDING PASTE FROM BOTH SIDES OF THE CARD.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/522,890 US5577657A (en) | 1995-09-01 | 1995-09-01 | Method of improved oven reflow soldering |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2144209T3 true ES2144209T3 (en) | 2000-06-01 |
Family
ID=24082796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES96305757T Expired - Lifetime ES2144209T3 (en) | 1995-09-01 | 1996-08-05 | IMPROVED WELDING METHOD BY OVEN REFLUX. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5577657A (en) |
EP (1) | EP0762812B1 (en) |
JP (1) | JPH09130034A (en) |
DE (1) | DE69607545T2 (en) |
ES (1) | ES2144209T3 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6139336A (en) * | 1996-11-14 | 2000-10-31 | Berg Technology, Inc. | High density connector having a ball type of contact surface |
US6267288B1 (en) * | 1999-10-18 | 2001-07-31 | Henry Chung | Pallet for combined surface mount and wave solder manufacture of printed ciruits |
US6642485B2 (en) * | 2001-12-03 | 2003-11-04 | Visteon Global Technologies, Inc. | System and method for mounting electronic components onto flexible substrates |
US6794616B1 (en) * | 2003-04-09 | 2004-09-21 | Visteon Global Technologies, Inc. | Solder reflow oven |
US9216469B2 (en) * | 2013-10-18 | 2015-12-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Indirect printing bumping method for solder ball deposition |
CN108336624B (en) * | 2018-03-22 | 2024-01-26 | 深圳捷创电子科技有限公司 | Welding process of connector |
CN116685077B (en) * | 2023-07-28 | 2023-11-14 | 深圳市首航新能源股份有限公司 | Method for manufacturing circuit board and circuit board |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3926360A (en) * | 1974-05-28 | 1975-12-16 | Burroughs Corp | Method of attaching a flexible printed circuit board to a rigid printed circuit board |
FR2578099B1 (en) * | 1985-02-26 | 1987-12-04 | Eurofarad | MONOLITHIC SUBSTRATE FOR ELECTRONIC POWER COMPONENT, AND METHOD FOR THE PRODUCTION THEREOF |
JPH0773790B2 (en) * | 1985-10-11 | 1995-08-09 | ソニー株式会社 | Reflow soldering equipment |
US4771929A (en) * | 1987-02-20 | 1988-09-20 | Hollis Automation, Inc. | Focused convection reflow soldering method and apparatus |
JPH0763839B2 (en) * | 1989-10-06 | 1995-07-12 | 日立テクノエンジニアリング株式会社 | Reflow soldering equipment |
US5309545A (en) * | 1990-08-27 | 1994-05-03 | Sierra Research And Technology, Inc. | Combined radiative and convective rework system |
US5129573A (en) * | 1991-10-25 | 1992-07-14 | Compaq Computer Corporation | Method for attaching through-hole devices to a circuit board using solder paste |
US5263599A (en) * | 1992-03-03 | 1993-11-23 | Sklar Jeffrey S | Infant nursing device |
US5419481A (en) * | 1993-09-21 | 1995-05-30 | Air-Vac Engineering Company, Inc. | Process and apparatus for attaching/deataching land grid array components |
-
1995
- 1995-09-01 US US08/522,890 patent/US5577657A/en not_active Expired - Fee Related
-
1996
- 1996-08-01 JP JP8203900A patent/JPH09130034A/en active Pending
- 1996-08-05 DE DE69607545T patent/DE69607545T2/en not_active Expired - Fee Related
- 1996-08-05 EP EP96305757A patent/EP0762812B1/en not_active Expired - Lifetime
- 1996-08-05 ES ES96305757T patent/ES2144209T3/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69607545D1 (en) | 2000-05-11 |
DE69607545T2 (en) | 2000-08-24 |
EP0762812A3 (en) | 1998-03-11 |
US5577657A (en) | 1996-11-26 |
JPH09130034A (en) | 1997-05-16 |
EP0762812A2 (en) | 1997-03-12 |
EP0762812B1 (en) | 2000-04-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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