SE0101312L - Cooling apparatus and method for forming such an apparatus - Google Patents

Cooling apparatus and method for forming such an apparatus

Info

Publication number
SE0101312L
SE0101312L SE0101312A SE0101312A SE0101312L SE 0101312 L SE0101312 L SE 0101312L SE 0101312 A SE0101312 A SE 0101312A SE 0101312 A SE0101312 A SE 0101312A SE 0101312 L SE0101312 L SE 0101312L
Authority
SE
Sweden
Prior art keywords
encapsulation
inner space
electronic devices
parts
cooling
Prior art date
Application number
SE0101312A
Other languages
Unknown language ( )
Swedish (sv)
Other versions
SE520661C2 (en
SE0101312D0 (en
Inventor
Haakan Ragnar Braennmark
Per Mattias Nyqvist
Original Assignee
Emerson Energy Systems Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Emerson Energy Systems Ab filed Critical Emerson Energy Systems Ab
Priority to SE0101312A priority Critical patent/SE520661C2/en
Publication of SE0101312D0 publication Critical patent/SE0101312D0/en
Priority to PCT/SE2002/000657 priority patent/WO2002085089A1/en
Publication of SE0101312L publication Critical patent/SE0101312L/en
Publication of SE520661C2 publication Critical patent/SE520661C2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/068—Hermetically-sealed casings having a pressure compensation device, e.g. membrane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to an apparatus for encapsulation and cooling elec-tronic devices, such as printed circuit boards (31). The apparatus comprises at least a first and a second encapsulation part (1, 3) to be assembled for creating an inner space (17) intended to accommodate the electronic devices. At least one of said first and second encapsulation (1, 3) parts is provided with means (27a-b, 29a-b) for supporting the electronic devices within the inner space (17) and means (37) is also provided for liquid-tight sealing of said first and second encapsulation parts (1, 3). At least one of said first and second encapsulation parts (1, 3) is deformable when an under-pressure is created in the inner space (17), whereby said supporting means (27a-b, 29a-b) is forced into clamping engagement with the electronic devices (31). The invention also relates to a method forming such an apparatus.
SE0101312A 2001-04-12 2001-04-12 Cooling apparatus and method for forming such an apparatus SE520661C2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SE0101312A SE520661C2 (en) 2001-04-12 2001-04-12 Cooling apparatus and method for forming such an apparatus
PCT/SE2002/000657 WO2002085089A1 (en) 2001-04-12 2002-04-03 Cooling apparatus and method for forming such an apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0101312A SE520661C2 (en) 2001-04-12 2001-04-12 Cooling apparatus and method for forming such an apparatus

Publications (3)

Publication Number Publication Date
SE0101312D0 SE0101312D0 (en) 2001-04-12
SE0101312L true SE0101312L (en) 2002-10-13
SE520661C2 SE520661C2 (en) 2003-08-05

Family

ID=20283775

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0101312A SE520661C2 (en) 2001-04-12 2001-04-12 Cooling apparatus and method for forming such an apparatus

Country Status (2)

Country Link
SE (1) SE520661C2 (en)
WO (1) WO2002085089A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010063158A1 (en) * 2010-12-15 2012-06-21 Robert Bosch Gmbh Control device and method for manufacturing a control device
DE102016107289A1 (en) * 2016-04-20 2017-10-26 Systematec Gmbh Drive arrangement, mounting arrangement and compressor device
JP6848417B2 (en) * 2016-12-19 2021-03-24 日本電気株式会社 Cooling system
CN108770303A (en) * 2018-06-25 2018-11-06 河南孚点电子科技有限公司 A kind of heat radiation chip and preparation method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707414A (en) * 1984-04-09 1987-11-17 General Dynamics, Pomona Division Electrostatic-free package
JPH0267791A (en) * 1988-09-02 1990-03-07 Riyoosan:Kk Cooling device for printed circuit board
US5247424A (en) * 1992-06-16 1993-09-21 International Business Machines Corporation Low temperature conduction module with gasket to provide a vacuum seal and electrical connections

Also Published As

Publication number Publication date
WO2002085089A1 (en) 2002-10-24
SE520661C2 (en) 2003-08-05
SE0101312D0 (en) 2001-04-12

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Legal Events

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