SE0101312L - Kylapparat samt förfarande för att bilda en sådan apparat - Google Patents
Kylapparat samt förfarande för att bilda en sådan apparatInfo
- Publication number
- SE0101312L SE0101312L SE0101312A SE0101312A SE0101312L SE 0101312 L SE0101312 L SE 0101312L SE 0101312 A SE0101312 A SE 0101312A SE 0101312 A SE0101312 A SE 0101312A SE 0101312 L SE0101312 L SE 0101312L
- Authority
- SE
- Sweden
- Prior art keywords
- encapsulation
- inner space
- electronic devices
- parts
- cooling
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/068—Hermetically-sealed casings having a pressure compensation device, e.g. membrane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
- H05K7/142—Spacers not being card guides
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0101312A SE520661C2 (sv) | 2001-04-12 | 2001-04-12 | Kylapparat samt förfarande för att bilda en sådan apparat |
PCT/SE2002/000657 WO2002085089A1 (en) | 2001-04-12 | 2002-04-03 | Cooling apparatus and method for forming such an apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0101312A SE520661C2 (sv) | 2001-04-12 | 2001-04-12 | Kylapparat samt förfarande för att bilda en sådan apparat |
Publications (3)
Publication Number | Publication Date |
---|---|
SE0101312D0 SE0101312D0 (sv) | 2001-04-12 |
SE0101312L true SE0101312L (sv) | 2002-10-13 |
SE520661C2 SE520661C2 (sv) | 2003-08-05 |
Family
ID=20283775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0101312A SE520661C2 (sv) | 2001-04-12 | 2001-04-12 | Kylapparat samt förfarande för att bilda en sådan apparat |
Country Status (2)
Country | Link |
---|---|
SE (1) | SE520661C2 (sv) |
WO (1) | WO2002085089A1 (sv) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010063158A1 (de) * | 2010-12-15 | 2012-06-21 | Robert Bosch Gmbh | Steuergerät und Verfahren zum Herstellen eines Steuergeräts |
DE102016107289A1 (de) * | 2016-04-20 | 2017-10-26 | Systematec Gmbh | Ansteueranordnung, Befestigungsanordnung und Kompressorvorrichtung |
JP6848417B2 (ja) * | 2016-12-19 | 2021-03-24 | 日本電気株式会社 | 冷却装置 |
CN108770303A (zh) * | 2018-06-25 | 2018-11-06 | 河南孚点电子科技有限公司 | 一种散热芯片及其制备方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4707414A (en) * | 1984-04-09 | 1987-11-17 | General Dynamics, Pomona Division | Electrostatic-free package |
JPH0267791A (ja) * | 1988-09-02 | 1990-03-07 | Riyoosan:Kk | プリント基板用冷却装置 |
US5247424A (en) * | 1992-06-16 | 1993-09-21 | International Business Machines Corporation | Low temperature conduction module with gasket to provide a vacuum seal and electrical connections |
-
2001
- 2001-04-12 SE SE0101312A patent/SE520661C2/sv not_active IP Right Cessation
-
2002
- 2002-04-03 WO PCT/SE2002/000657 patent/WO2002085089A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
SE520661C2 (sv) | 2003-08-05 |
SE0101312D0 (sv) | 2001-04-12 |
WO2002085089A1 (en) | 2002-10-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |