JPS5873189A - Structure of hot air nozzle unit for automatic electronic part removing device - Google Patents

Structure of hot air nozzle unit for automatic electronic part removing device

Info

Publication number
JPS5873189A
JPS5873189A JP17259181A JP17259181A JPS5873189A JP S5873189 A JPS5873189 A JP S5873189A JP 17259181 A JP17259181 A JP 17259181A JP 17259181 A JP17259181 A JP 17259181A JP S5873189 A JPS5873189 A JP S5873189A
Authority
JP
Japan
Prior art keywords
nozzle
hot air
nozzle unit
air nozzle
work head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17259181A
Other languages
Japanese (ja)
Other versions
JPS644673B2 (en
Inventor
井草 延夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17259181A priority Critical patent/JPS5873189A/en
Publication of JPS5873189A publication Critical patent/JPS5873189A/en
Publication of JPS644673B2 publication Critical patent/JPS644673B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明プリント板パッケージ製造設備に係り特に除去す
べきフラットリード電子部品のプリント板からの自動取
外し装置の改良に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to printed board package manufacturing equipment, and particularly relates to an improvement in an automatic removal device for flat lead electronic components to be removed from printed boards.

電子装置のロジック回路を形成すべく装機工場において
実装せられる電子回路モジュールはプリント板パッケー
ジとして供給される。そして該回路モジュールを錘果檀
化するために該プリント板パッケージはu足状フラット
リードケーシングに収容された混成集積回路などの電子
部品を前記フラットリードと対応するように形成された
パターンパッド上へ醍密度に配設し、それぞれのフラッ
トリードとパターンパッドを半田付した構成を採る場合
が増えてきた。そして、このような構成のロジック回路
を有する電子装置のデバグや保守点検時に、前記電子部
品の相等童を選択取り替えする必要がしばしば起り、こ
の部品取替は従来微小半田ごてなどで半田付けを俗がし
て外すなどの手作業でなされていた。このような方法は
作業性に欠けると共にプリント板加熱による搭載電子部
品の熱棄損をもたらすことが多く装置の生産性と品質の
信頼性とを阻害するという欠点があった。そして、こ9
ような欠点に対処するため従来ド記のような構成の自動
装置が公知されていた。即ち該自動装置は、任意に制n
oJ能な真空吸着ノズルおよび該ノズルの外囲に配設さ
れたTLl性を有する熱風ノズルユニットおよび熱風発
生装!it等を具備してなるワークヘッドと、該ワーク
ヘッドを任意に基台の原点に直交して上下動せしめる手
段と、載置したプリント板上の所定の電子部品を該原点
に位置決め可能にした前記基台上のX−Yテーブルと、
前記ワークヘッドの各種作aぶ該X−Yテーブルの作動
を予じめプログラムされた所定のシーケンスサイクルで
連続制御する制御装置とを具備してなること。および!
1′tI記ワークヘッドには、該ワークヘッドを降下さ
せて吸着ノズルを予じめ前記X−Yテーブルで位置決め
された前記所定の電子部品の背面俵圧#1.ni+記熱
風ノズルユニットから所定の熱容嫌の熱風を指定時間前
記フラットリードの上面へ噴出させたのち、該ワークヘ
ッドを4鋤上昇せしめた際、該電子部品が吸着されtこ
まま持ち上がるかどうかを検出するセンサーをg備して
なり、かつ前記制御装置には当該電子部品の吸着を検出
しJコ場合は、次に取り外すべき部品のシーケンスサイ
クルに移り、当該部品の非吸着を検出した場合は所定の
限度時間迄前記寸動ピックアップサイクルが繰返される
機能を附加してなる構成であった。ところが、このよう
な自動装置においては、前記熱風ノズルユニットをフラ
ットリード電子部品のケーシングの種類毎に選択する必
要があり、該熱風ノズルユニットの受検の容易性が問題
となる。このために、当該ノズルユニットを前記ワーク
ヘッドに具備したー動作8a能チャックで容易に取付は
取外しができるよう標準化する必要があった。
Electronic circuit modules that are mounted in equipment factories to form logic circuits of electronic devices are supplied as printed board packages. Then, in order to convert the circuit module into a pyramid, the printed circuit board package places an electronic component such as a hybrid integrated circuit housed in a U-shaped flat lead casing onto a pattern pad formed to correspond to the flat lead. Increasingly, devices are arranged with high density, and the configuration in which each flat lead and pattern pad are soldered is increasing. When debugging or maintaining and inspecting an electronic device having a logic circuit with such a configuration, it is often necessary to select and replace equivalent parts of the electronic components, and conventionally, this part replacement was done by soldering with a micro-soldering iron or the like. It was done manually by removing it. Such a method lacks workability and often causes heat loss of mounted electronic components due to heating of the printed board, which impairs the productivity and quality reliability of the device. And this 9
In order to cope with such drawbacks, automatic devices having the configuration as described above have been known in the past. That is, the automatic device can be controlled at will.
A vacuum suction nozzle capable of oJ, a hot air nozzle unit with TLl properties arranged around the nozzle, and a hot air generator! A work head comprising an IT, etc., a means for vertically moving the work head arbitrarily orthogonal to the origin of the base, and a predetermined electronic component on a printed board placed thereon can be positioned at the origin. an X-Y table on the base;
and a control device that continuously controls various operations of the work head and the operation of the X-Y table in a pre-programmed predetermined sequence cycle. and!
1't I work head is lowered and the suction nozzle is placed on the back bale pressure #1. After blowing hot air with a predetermined heat capacity from the hot air nozzle unit onto the top surface of the flat lead for a specified time, when the work head is raised by 4 plows, whether the electronic component is attracted and lifted up by t. and if the control device detects the suction of the electronic component, it moves to the sequence cycle of the next component to be removed, and if the control device detects that the component is not suctioned. This was a configuration in which a function was added in which the inching pickup cycle was repeated until a predetermined time limit. However, in such an automatic device, it is necessary to select the hot air nozzle unit for each type of casing of the flat lead electronic component, and the ease with which the hot air nozzle unit can be inspected becomes a problem. For this reason, it was necessary to standardize the nozzle unit so that it can be easily attached and detached using the 8-operation chuck provided on the work head.

本発明はこのような条件を満足し得る太容菫ヒートキャ
パシティの熱風ノズルユニットの提供を目的としたもの
である。
The object of the present invention is to provide a hot air nozzle unit with a large violet heat capacity that can satisfy such conditions.

本発明は任意に制卸可能な真空設置ノズルおよ1び該ノ
ズルの外囲Iこ配役された互才性を有する熱風ノズルユ
ニットおよび熱風発止装置等を具備してなるワークヘッ
ドと、該ワークヘッドを任gに基台の原点に直交して上
T:動せしめる手段と、載置したプリント板上の所定の
電子部品を該原点fこ位置決め可能にした前記基台上の
x−Yテーブルと前記ワークヘッドの各種作動と該X−
Yテーブルの作動を予じめプログラムされた所定のシー
ケンスサイクルで連続制御する手段とを具備してなるプ
リント板からの電子部品自tIJJBy、外し装置にお
いて。前記熱風ノズルユニットは、フランジ上面の中央
に吸着ノズルを挿通し得るb通孔を、該貫通孔の外囲に
空気貯めキャビティを、ボス下面縁に締付は用テーパコ
ーナをそれぞれ形成してなる耐熱金#A#標準議円板と
、該基円板のボス下面に所定の電子部品のフラノ) +
)−ド領域を無駄なく覆うボックス形パイプノズルと、
該パイプノズルの′F端から所定寸法突出するよう前記
ボス下面へ対称lこ配役された少くとも1対のストッパ
ピンとで構成されてなることを特徴とするものである。
The present invention provides a work head comprising a vacuum installation nozzle that can be controlled arbitrarily, a hot air nozzle unit having a compatible hot air nozzle unit and a hot air starting device, and the like. means for moving the work head upward perpendicularly to the origin of the base; Various operations of the table and the work head and the X-
An apparatus for removing electronic components from a printed circuit board, comprising means for continuously controlling the operation of a Y-table in a pre-programmed predetermined sequence cycle. The hot air nozzle unit is a heat-resistant unit having a through hole through which a suction nozzle can be inserted in the center of the upper surface of the flange, an air storage cavity around the outer circumference of the through hole, and a tapered corner for tightening at the lower edge of the boss. Gold #A# standard board and flannel of specified electronic parts on the bottom surface of the boss of the base board) +
) - A box-shaped pipe nozzle that covers the area without waste,
The stopper pin is characterized by comprising at least one pair of stopper pins arranged symmetrically on the lower surface of the boss so as to protrude by a predetermined distance from the 'F end of the pipe nozzle.

以F本発明の好適な実@lこついて図面を6照して詳細
に説明する。第1図、第2図、第8図は本発明のボック
ス形熱風ノズルユニットの上から見た平面図、側断面図
、−ドから見た平面図であってlはボス部2、フランジ
部8、ストレーナ4′、押え板5からなる標準基円板、
6はボックス形ノズル、7はストッパビンを示したもの
である。
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. 1, 2, and 8 are a plan view of the box-shaped hot air nozzle unit of the present invention as seen from above, a side sectional view, and a plan view as seen from the side. 8. Standard base disk consisting of strainer 4' and presser plate 5;
6 is a box-shaped nozzle, and 7 is a stopper bin.

図において、標準基円板1はノズルの種類にかかわらず
外形姿寸法を一定にした耐熱金一部材でボス部2の端面
縁に締付は用所定角度のテーパニーコーナ21が形成さ
れている。そしてフランジ面の中央に点線で示した吸着
ノズルaを挿通じイ尋る(第2図写照)貫通孔31と該
■通孔の外囲に環板状エヤストレイナ−4を同形め放射
状通気孔付き押え板5で着座せしめ得る凹座82を具備
した環状キャビティ88が形成されてなり、ストレーナ
4と押え金5を具備した形で標準化されたものである。
In the figure, a standard base plate 1 is a heat-resistant metal member whose external dimensions are constant regardless of the type of nozzle, and a tapered knee corner 21 at a predetermined angle for tightening is formed on the end surface edge of a boss portion 2. . Then, insert the suction nozzle a shown by the dotted line into the center of the flange surface (see Fig. 2).A circular plate-shaped air strainer 4 is installed in the same shape around the through hole 31 and the through hole with radial ventilation holes. An annular cavity 88 having a concave seat 82 on which a presser plate 5 can be seated is formed, and the strainer 4 and presser foot 5 are standardized.

そして該“標試円板1はボス部2のテーパコーナにフィ
ツトする自在受は金を具備した図小しない締付機構によ
って吸着ノズルの外囲に熱風グされ、前記吸着ノズルa
が標準基円板の中心を貝通すると共に前記熱風吐出口と
前記環状キャビティが連通されることになる。本発明の
大容電ヒートキャパシティのボックス形熱風ノズルはこ
のような構成の標#i基円板1のホモl四へ電子部品の
品種に対応し、例えば第2図に示すようなは子部品すを
収容可能で、かつプリント板Cに半田1.jけされた該
rdf部品のフラットリードgdの領域を無駄なく覆う
サイズの直筒状ボックス形ノズル6を殖立すると共(こ
該ノズル6のTh1lfと前記キャビティ33とを連通
せしめる通気孔22を形成し、さらに吸着ノズルaで電
子部品すの背面を吸着させた際ノズル6の端面と半田付
は面との間に所定のギャップを保持するための、該ノズ
ルの丈より僅に長い1対のストッパービン7を対称に当
該ノズルの外側に碩1γしたものである。
Then, the standard test disk 1 is hot-aired around the outer circumference of the suction nozzle by means of a not-in-small tightening mechanism equipped with metal, and the free holder that fits into the tapered corner of the boss portion 2 is heated.
passes through the center of the standard base disk, and the hot air outlet and the annular cavity are communicated with each other. The box-shaped hot air nozzle with a large electric heat capacity of the present invention corresponds to the type of electronic component to the homolog number 1 of the base plate 1 having such a configuration, for example, the type shown in FIG. 2. It is possible to accommodate parts and solder 1. to the printed board C. A straight cylindrical box-shaped nozzle 6 of a size that covers the area of the flat lead gd of the cut RDF component without waste is established (a ventilation hole 22 is formed to communicate Th1lf of the nozzle 6 with the cavity 33). Furthermore, in order to maintain a predetermined gap between the end surface of the nozzle 6 and the soldering surface when the back surface of the electronic component is suctioned with the suction nozzle a, a pair of wires slightly longer than the length of the nozzle are used. The stopper bottle 7 is symmetrically placed 1γ on the outside of the nozzle.

このような構成のボックス形熱風ノズルは標準塙円板に
マウントされているために電子部品種類に対応した該ノ
ズルユニットの取替えが極めて容性の同上と能率の向上
にを与することができる。
Since the box-shaped hot air nozzle having such a configuration is mounted on a standard round board, replacing the nozzle unit in accordance with the type of electronic component can greatly improve capacity and efficiency.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図、第8図は本発明のボックス形熱風ノズ
ルユニットの上方平面図、側断面図、1〜方平面図を示
す。 図において、■は標準基円板、2はボス部、8はフラン
ジ部、4はストレーナ、5は押え板、6はボックス形ノ
ズル、7はストッパピンを示したものである。 代理人弁理士 松 岡 宏四部
1, 2, and 8 show a top plan view, a side sectional view, and a top plan view of the box-shaped hot air nozzle unit of the present invention. In the figure, ■ is a standard base disk, 2 is a boss portion, 8 is a flange portion, 4 is a strainer, 5 is a holding plate, 6 is a box-shaped nozzle, and 7 is a stopper pin. Representative Patent Attorney Hiroshi Matsuoka

Claims (1)

【特許請求の範囲】[Claims] プリント板のパターンパッドにフラットリードを半田付
けした複数の電子部品を該プリント板から選択して取外
すべく、任意に制御可能な真空吸着ノズルおよび該ノズ
ルの外囲に配設された互4咬性を有する熱風ノズルユニ
ットおよび熱風発生装置等を具備してなるワークヘッド
と、該ワークヘッドを任意に基台の原点に直交して上下
動せしめかつ前記電子部品の吸着を検出する手段と、載
置したプリント板上の所定の電子部品を該原点に位置決
め可能にした前記基台上のX−Yテーブルと前記ワーク
ヘッドの各種作動と該X−yテーブルの作・助を予じめ
プログラムされた所定のシーケンスサイクルで連続制御
する手段とを具備してなるプリント板からのIIIF部
品自動取外し装置において、前記熱風ノズルユニットは
、フランジ上面の中央に吸着ノズルを挿通し得る貫通孔
を、該貫通孔の外囲に′I気貯めキャビティを、ボス下
面縁に締付は用テーバコーナをそれぞれ形成してなる耐
熱金属製標準基円板と、該基円板のボス下面に前記キャ
ビティとの間に連通孔を設けて止着した、所定の電子部
品のフラットリード領域を無、駄なく覆うボックス形パ
イプノズルと、該パイプノズルのド端から所定寸法突出
するよう目1Icll:l!ボス下面へ対称に配設され
た少くとも1対のストッパビンとで構成されてなること
を特徴とする電子部品自動取外し装置の熱風ノズルユニ
ットの構造。
In order to selectively remove a plurality of electronic components having flat leads soldered to pattern pads of a printed board from the printed board, a vacuum suction nozzle that can be controlled arbitrarily and a reciprocal four-biting nozzle arranged around the nozzle are used. a work head comprising a hot air nozzle unit and a hot air generator, etc.; means for arbitrarily moving the work head vertically perpendicular to the origin of the base and detecting suction of the electronic component; Various operations of the X-Y table on the base and the work head, which made it possible to position a predetermined electronic component on the printed circuit board at the origin, and the creation and assistance of the X-Y table were programmed in advance. In the apparatus for automatically removing IIIF components from a printed board, the hot air nozzle unit has a through hole through which a suction nozzle can be inserted in the center of the upper surface of the flange. A standard base plate made of a heat-resistant metal having an air storage cavity formed on the outer circumference and a taber corner for tightening on the lower edge of the boss, and the cavity on the lower face of the boss of the base plate communicate with each other. A box-shaped pipe nozzle that completely covers the flat lead area of a predetermined electronic component, which is fixed with a hole, and a box-shaped pipe nozzle that protrudes by a predetermined distance from the end of the pipe nozzle. A structure of a hot air nozzle unit for an automatic electronic parts removal device, characterized in that it is composed of at least one pair of stopper bins arranged symmetrically on the lower surface of a boss.
JP17259181A 1981-10-27 1981-10-27 Structure of hot air nozzle unit for automatic electronic part removing device Granted JPS5873189A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17259181A JPS5873189A (en) 1981-10-27 1981-10-27 Structure of hot air nozzle unit for automatic electronic part removing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17259181A JPS5873189A (en) 1981-10-27 1981-10-27 Structure of hot air nozzle unit for automatic electronic part removing device

Publications (2)

Publication Number Publication Date
JPS5873189A true JPS5873189A (en) 1983-05-02
JPS644673B2 JPS644673B2 (en) 1989-01-26

Family

ID=15944681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17259181A Granted JPS5873189A (en) 1981-10-27 1981-10-27 Structure of hot air nozzle unit for automatic electronic part removing device

Country Status (1)

Country Link
JP (1) JPS5873189A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS625680U (en) * 1985-06-26 1987-01-14
JPS62113497A (en) * 1985-10-23 1987-05-25 ペ−ス インコ−ポレ−テツド Apparatus for removing and mounting devices from and on printed circuit board or the like and nozzle for the same
JPS62271496A (en) * 1986-02-13 1987-11-25 デイジタル イクイプメント コ−ポレ−シヨン Repair station for surface mounting technology and method ofrepairing circuit board employing surface mounting technology

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01263095A (en) * 1988-04-14 1989-10-19 Fumio Nonomura Prepaid card, prepaid card device and prepaid card system
JPH0526464U (en) * 1991-09-17 1993-04-06 寿 岩田 Card with used display

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS625680U (en) * 1985-06-26 1987-01-14
JPS62113497A (en) * 1985-10-23 1987-05-25 ペ−ス インコ−ポレ−テツド Apparatus for removing and mounting devices from and on printed circuit board or the like and nozzle for the same
JPS62271496A (en) * 1986-02-13 1987-11-25 デイジタル イクイプメント コ−ポレ−シヨン Repair station for surface mounting technology and method ofrepairing circuit board employing surface mounting technology
JPH0453118B2 (en) * 1986-02-13 1992-08-25 Digital Equipment Corp

Also Published As

Publication number Publication date
JPS644673B2 (en) 1989-01-26

Similar Documents

Publication Publication Date Title
US5394609A (en) Method and apparatus for manufacture of printed circuit cards
JP4458447B2 (en) Electronic component test holding device, electronic component test device, and electronic component test method
US4066204A (en) Process and device for unsoldering semiconductor modules in the flip-chip technique
US20030088973A1 (en) Method and apparatus for automatically positioning electronic dice within component packages
KR100254323B1 (en) Soldering method and apparatus for tcp integrated circuits
KR100231152B1 (en) Mounting method for mounting ic on pcb
US6111420A (en) Fine alignment IC handler and method for assembling the same
JPS5873189A (en) Structure of hot air nozzle unit for automatic electronic part removing device
US6138892A (en) Method for mounting an integrated circuit from a tape carrier package on a printed circuit board
US7069647B2 (en) Method for populating a substrate with electronic components
JPS5874096A (en) Structure of hot air nozzle unit for automatic electronic part removing device
KR100283744B1 (en) Method for Integrated Circuit Layout
JP2865646B1 (en) Metal ball arrangement device and arrangement method
US3911569A (en) Method and apparatus for bonding miniature semiconductor pill-type components to a circuit board
JP3254459B2 (en) Micro solder supply method and micro solder supply device
JP2633631B2 (en) Electronic component mounting equipment
JPS6312417A (en) Method and device for taping electronic part
JPS6339118B2 (en)
JPH0435090A (en) Cream solder printer
JPS5873190A (en) Work head structure for automatic electronic part removing device
JPH09162239A (en) Method for mounting semiconductor package and jig for mounting semiconductor package
KR100333143B1 (en) Semiconductor Package Manufacturing Method
JPH08162754A (en) Automatic correction system for defective soldering
JPH06216197A (en) Flip-chip bonding apparatus
JP4092231B2 (en) Solder printing jig and solder printing method