IT8648369A0 - SPOUT DEVICE FOR FEEDING A HEATED FLUID, FOR EXAMPLE AIR, TO PLACES OF ATTACHMENT/REMOVAL OF ELECTRONIC COMPONENTS ON PRINTED CIRCUIT PANELS - Google Patents

SPOUT DEVICE FOR FEEDING A HEATED FLUID, FOR EXAMPLE AIR, TO PLACES OF ATTACHMENT/REMOVAL OF ELECTRONIC COMPONENTS ON PRINTED CIRCUIT PANELS

Info

Publication number
IT8648369A0
IT8648369A0 IT8648369A IT4836986A IT8648369A0 IT 8648369 A0 IT8648369 A0 IT 8648369A0 IT 8648369 A IT8648369 A IT 8648369A IT 4836986 A IT4836986 A IT 4836986A IT 8648369 A0 IT8648369 A0 IT 8648369A0
Authority
IT
Italy
Prior art keywords
places
attachment
feeding
removal
printed circuit
Prior art date
Application number
IT8648369A
Other languages
Italian (it)
Other versions
IT1209978B (en
Inventor
Bradford W Coffman
William J Siegel
Original Assignee
Pace Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pace Inc filed Critical Pace Inc
Publication of IT8648369A0 publication Critical patent/IT8648369A0/en
Application granted granted Critical
Publication of IT1209978B publication Critical patent/IT1209978B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
IT8648369A 1985-10-23 1986-08-07 NOZZLE DEVICE FOR THE SUPPLY OF A HEATED FLUID, FOR EXAMPLE AIR, IN FIXING / REMOVAL PLACES OF ELECTRONIC COMPONENTS ON PANELS OF PRINTED CIRCUITS IT1209978B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US79044885A 1985-10-23 1985-10-23

Publications (2)

Publication Number Publication Date
IT8648369A0 true IT8648369A0 (en) 1986-08-07
IT1209978B IT1209978B (en) 1989-08-30

Family

ID=25150710

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8648369A IT1209978B (en) 1985-10-23 1986-08-07 NOZZLE DEVICE FOR THE SUPPLY OF A HEATED FLUID, FOR EXAMPLE AIR, IN FIXING / REMOVAL PLACES OF ELECTRONIC COMPONENTS ON PANELS OF PRINTED CIRCUITS

Country Status (6)

Country Link
JP (1) JPS62113497A (en)
CA (1) CA1293653C (en)
DE (1) DE3624728A1 (en)
FR (1) FR2589029B1 (en)
GB (1) GB2181981B (en)
IT (1) IT1209978B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4787548A (en) * 1987-07-27 1988-11-29 Pace Incorporated Nozzle structure for soldering and desoldering
ATE90247T1 (en) * 1987-08-31 1993-06-15 Siemens Ag SOLDERING HEAD FOR SOLDERING OR SOLDERING COMPONENTS BY HEATING BY HOT GAS, ESPECIALLY FOR SURFACE MOUNT COMPONENTS (SMD).
DE59001696D1 (en) * 1989-09-29 1993-07-15 Siemens Nixdorf Inf Syst SOLDERING DEVICE FOR SOLDERING COMPONENTS ON PCB.
DE9113986U1 (en) * 1991-11-11 1992-04-16 Zevac Ausloetsysteme Gmbh, 3548 Arolsen, De
JP2714520B2 (en) * 1992-08-28 1998-02-16 株式会社日立製作所 Mounting component mounting / dismounting device
DE4345109C2 (en) * 1993-12-28 2002-10-24 Finetech Ges Fuer Elektronik T Tool for soldering and desoldering solder joints of a socket of a multi-pole integrated circuit
DE4422341C2 (en) * 1994-06-27 1997-03-06 Martin Umwelt & Energietech Soldering device
JP2018535914A (en) * 2015-10-30 2018-12-06 コーニング インコーポレイテッド 3D-shaped glass article, method and apparatus for manufacturing the same
CN115365600B (en) * 2022-09-16 2023-09-15 李文雄 Welding and disassembling device and welding and disassembling method for circuit board chip

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3522407A (en) * 1968-03-05 1970-08-04 Argus Eng Co Heating method
US3718800A (en) * 1968-03-05 1973-02-27 Argus Eng Co Infrared heating apparatus
US4295596A (en) * 1979-12-19 1981-10-20 Western Electric Company, Inc. Methods and apparatus for bonding an article to a metallized substrate
JPS5873189A (en) * 1981-10-27 1983-05-02 富士通株式会社 Structure of hot air nozzle unit for automatic electronic part removing device
DE8334840U1 (en) * 1983-12-05 1984-03-22 Cooper Industries, Inc., 77210 Houston, Tex. SOLDERING DEVICE FOR FASTENING ELECTRICAL AND ELECTRONIC COMPONENTS ON PCB
GB2154921B (en) * 1984-02-24 1988-06-08 Pace Inc Device for attaching modular electronic components to or removing them from an insulative substrate
FR2573950B3 (en) * 1984-11-27 1987-06-19 Matra METHOD AND DEVICE FOR EXTRACTING WELDED ELECTRONIC COMPONENTS
JPS61141197A (en) * 1984-12-14 1986-06-28 富士通株式会社 Method and apparatus for removing flat lead type electronic component
JPS6285494A (en) * 1985-10-09 1987-04-18 株式会社日立製作所 Device for detaching part

Also Published As

Publication number Publication date
JPS62113497A (en) 1987-05-25
IT1209978B (en) 1989-08-30
DE3624728A1 (en) 1987-04-23
GB2181981B (en) 1989-11-08
FR2589029B1 (en) 1995-06-23
CA1293653C (en) 1991-12-31
FR2589029A1 (en) 1987-04-24
GB8618672D0 (en) 1986-09-10
GB2181981A (en) 1987-05-07

Similar Documents

Publication Publication Date Title
IT8648105A0 (en) DEVICE FOR HEATING A FLUID, FOR EXAMPLE THE SURROUNDING AIR IN THE PROCEDURES OF ATTACHMENT/DETACHMENT OF ELECTRONIC COMPONENTS ON PRINTED CIRCUIT PANELS
DE3672493D1 (en) CARRIER FOR PRINTED CIRCUIT BOARDS.
GB8610732D0 (en) Soldering printed circuit panels
GB8605572D0 (en) Mounting electronic parts onto printed wiring board
IT8648369A0 (en) SPOUT DEVICE FOR FEEDING A HEATED FLUID, FOR EXAMPLE AIR, TO PLACES OF ATTACHMENT/REMOVAL OF ELECTRONIC COMPONENTS ON PRINTED CIRCUIT PANELS
IT8509438A0 (en) METHOD TO ENSURE THE COOLING OF ELECTRONIC COMPONENTS FIXED ON A MULTILAYER FOR PRINTED CIRCUITS AND MULTILAYER MADE ACCORDING TO SAID METHOD
GB2169751B (en) An electronic circuit module
GB8500906D0 (en) Printed circuit boards
GB2183189B (en) Printed circuit boards
IT8221780A0 (en) MACHINE FOR APPLYING ELECTRONIC COMPONENTS TO PRINTED CIRCUIT PANELS.
IT8221781A0 (en) MACHINE FOR SUBSEQUENTLY APPLYING ELECTRONIC COMPONENTS TO PRINTED CIRCUIT PANELS.
AU94489S (en) An electronic print board
IT8521248A0 (en) PROCEDURE AND EQUIPMENT FOR SOLDERING ELECTRONIC COMPONENTS TO PRINTED CIRCUITS PLATES.
GB8603291D0 (en) Fixing printed circuit board on worktable
EP0231646A3 (en) Electronic print board apparatus
GB2186745B (en) An electronic device adhesively bonded to a circuit board
DE3650719T2 (en) Cooling modules for electronic circuit devices
JPS57133696A (en) Device for mounting chip part on printed circuit board
JPS57141995A (en) Circuit device using printed circuit board
JPS57148388A (en) Heat sink printed circuit board
GB8511861D0 (en) Printed circuit boards
DE3650687T2 (en) Cooling modules for electronic circuit devices
JPS57162398A (en) Printed circuit board electronic device
IT8053247V0 (en) POWER SUPPLY AND THERMAL DISSIPATION SYSTEM FOR ELECTRONIC COMPONENTS MOUNTED ON PRINTED CIRCUIT PLATES
IT8663362V0 (en) MEETING DEVICE TO ANALYZE A CIRCUIT PRINTED ON TWO SIDES.

Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19950725