IT8648369A0 - SPOUT DEVICE FOR FEEDING A HEATED FLUID, FOR EXAMPLE AIR, TO PLACES OF ATTACHMENT/REMOVAL OF ELECTRONIC COMPONENTS ON PRINTED CIRCUIT PANELS - Google Patents

SPOUT DEVICE FOR FEEDING A HEATED FLUID, FOR EXAMPLE AIR, TO PLACES OF ATTACHMENT/REMOVAL OF ELECTRONIC COMPONENTS ON PRINTED CIRCUIT PANELS

Info

Publication number
IT8648369A0
IT8648369A0 IT8648369A IT4836986A IT8648369A0 IT 8648369 A0 IT8648369 A0 IT 8648369A0 IT 8648369 A IT8648369 A IT 8648369A IT 4836986 A IT4836986 A IT 4836986A IT 8648369 A0 IT8648369 A0 IT 8648369A0
Authority
IT
Italy
Prior art keywords
places
attachment
feeding
removal
printed circuit
Prior art date
Application number
IT8648369A
Other languages
Italian (it)
Other versions
IT1209978B (en
Inventor
Bradford W Coffman
William J Siegel
Original Assignee
Pace Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pace Inc filed Critical Pace Inc
Publication of IT8648369A0 publication Critical patent/IT8648369A0/en
Application granted granted Critical
Publication of IT1209978B publication Critical patent/IT1209978B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
IT8648369A 1985-10-23 1986-08-07 NOZZLE DEVICE FOR THE SUPPLY OF A HEATED FLUID, FOR EXAMPLE AIR, IN FIXING / REMOVAL PLACES OF ELECTRONIC COMPONENTS ON PANELS OF PRINTED CIRCUITS IT1209978B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US79044885A 1985-10-23 1985-10-23

Publications (2)

Publication Number Publication Date
IT8648369A0 true IT8648369A0 (en) 1986-08-07
IT1209978B IT1209978B (en) 1989-08-30

Family

ID=25150710

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8648369A IT1209978B (en) 1985-10-23 1986-08-07 NOZZLE DEVICE FOR THE SUPPLY OF A HEATED FLUID, FOR EXAMPLE AIR, IN FIXING / REMOVAL PLACES OF ELECTRONIC COMPONENTS ON PANELS OF PRINTED CIRCUITS

Country Status (6)

Country Link
JP (1) JPS62113497A (en)
CA (1) CA1293653C (en)
DE (1) DE3624728A1 (en)
FR (1) FR2589029B1 (en)
GB (1) GB2181981B (en)
IT (1) IT1209978B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4787548A (en) * 1987-07-27 1988-11-29 Pace Incorporated Nozzle structure for soldering and desoldering
ATE90247T1 (en) * 1987-08-31 1993-06-15 Siemens Ag SOLDERING HEAD FOR SOLDERING OR SOLDERING COMPONENTS BY HEATING BY HOT GAS, ESPECIALLY FOR SURFACE MOUNT COMPONENTS (SMD).
DE59001696D1 (en) * 1989-09-29 1993-07-15 Siemens Nixdorf Inf Syst SOLDERING DEVICE FOR SOLDERING COMPONENTS ON PCB.
DE9113986U1 (en) * 1991-11-11 1992-04-16 Zevac Auslötsysteme GmbH, 3548 Arolsen Soldering device for soldering and desoldering electrical components
JP2714520B2 (en) * 1992-08-28 1998-02-16 株式会社日立製作所 Mounting component mounting / dismounting device
DE4345109C2 (en) * 1993-12-28 2002-10-24 Finetech Ges Fuer Elektronik T Tool for soldering and desoldering solder joints of a socket of a multi-pole integrated circuit
DE4422341C2 (en) * 1994-06-27 1997-03-06 Martin Umwelt & Energietech Soldering device
CN108349775A (en) * 2015-10-30 2018-07-31 康宁股份有限公司 3D molding glass based articles and its manufacturing method and equipment
CN115365600B (en) * 2022-09-16 2023-09-15 李文雄 Welding and disassembling device and welding and disassembling method for circuit board chip

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3522407A (en) * 1968-03-05 1970-08-04 Argus Eng Co Heating method
US3718800A (en) * 1968-03-05 1973-02-27 Argus Eng Co Infrared heating apparatus
US4295596A (en) * 1979-12-19 1981-10-20 Western Electric Company, Inc. Methods and apparatus for bonding an article to a metallized substrate
JPS5873189A (en) * 1981-10-27 1983-05-02 富士通株式会社 Structure of hot air nozzle unit for automatic electronic part removing device
DE8334840U1 (en) * 1983-12-05 1984-03-22 Cooper Industries, Inc., 77210 Houston, Tex. SOLDERING DEVICE FOR FASTENING ELECTRICAL AND ELECTRONIC COMPONENTS ON PCB
GB2154921B (en) * 1984-02-24 1988-06-08 Pace Inc Device for attaching modular electronic components to or removing them from an insulative substrate
FR2573950B3 (en) * 1984-11-27 1987-06-19 Matra METHOD AND DEVICE FOR EXTRACTING WELDED ELECTRONIC COMPONENTS
JPS61141197A (en) * 1984-12-14 1986-06-28 富士通株式会社 Method and apparatus for removing flat lead type electronic component
JPS6285494A (en) * 1985-10-09 1987-04-18 株式会社日立製作所 Device for detaching part

Also Published As

Publication number Publication date
GB8618672D0 (en) 1986-09-10
IT1209978B (en) 1989-08-30
JPS62113497A (en) 1987-05-25
GB2181981B (en) 1989-11-08
FR2589029B1 (en) 1995-06-23
DE3624728A1 (en) 1987-04-23
FR2589029A1 (en) 1987-04-24
GB2181981A (en) 1987-05-07
CA1293653C (en) 1991-12-31

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19950725