CA1202377A - Short-pulse soldering system - Google Patents
Short-pulse soldering systemInfo
- Publication number
- CA1202377A CA1202377A CA000427813A CA427813A CA1202377A CA 1202377 A CA1202377 A CA 1202377A CA 000427813 A CA000427813 A CA 000427813A CA 427813 A CA427813 A CA 427813A CA 1202377 A CA1202377 A CA 1202377A
- Authority
- CA
- Canada
- Prior art keywords
- solder
- soldering tool
- temperature
- soldering
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 150
- 229910000679 solder Inorganic materials 0.000 claims abstract description 126
- 238000000034 method Methods 0.000 claims description 38
- 238000009413 insulation Methods 0.000 claims description 31
- 230000008018 melting Effects 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 13
- 230000006866 deterioration Effects 0.000 claims description 10
- 238000013508 migration Methods 0.000 claims description 8
- 230000005012 migration Effects 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 230000008016 vaporization Effects 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000007711 solidification Methods 0.000 claims description 5
- 230000008023 solidification Effects 0.000 claims description 5
- 230000005496 eutectics Effects 0.000 claims description 2
- 238000009834 vaporization Methods 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000001052 transient effect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000001208 nuclear magnetic resonance pulse sequence Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 241000272470 Circus Species 0.000 description 1
- 241000283014 Dama Species 0.000 description 1
- VAYOSLLFUXYJDT-RDTXWAMCSA-N Lysergic acid diethylamide Chemical compound C1=CC(C=2[C@H](N(C)C[C@@H](C=2)C(=O)N(CC)CC)C2)=C3C2=CNC3=C1 VAYOSLLFUXYJDT-RDTXWAMCSA-N 0.000 description 1
- 241000282337 Nasua nasua Species 0.000 description 1
- 102000004207 Neuropilin-1 Human genes 0.000 description 1
- 108090000772 Neuropilin-1 Proteins 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 229940000425 combination drug Drugs 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- JNSGIVNNHKGGRU-JYRVWZFOSA-N diethoxyphosphinothioyl (2z)-2-(2-amino-1,3-thiazol-4-yl)-2-methoxyiminoacetate Chemical compound CCOP(=S)(OCC)OC(=O)C(=N/OC)\C1=CSC(N)=N1 JNSGIVNNHKGGRU-JYRVWZFOSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- BALXUFOVQVENIU-KXNXZCPBSA-N pseudoephedrine hydrochloride Chemical compound [H+].[Cl-].CN[C@@H](C)[C@@H](O)C1=CC=CC=C1 BALXUFOVQVENIU-KXNXZCPBSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/06—Wiring by machine
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0949—Pad close to a hole, not surrounding the hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37665882A | 1982-05-10 | 1982-05-10 | |
| US376,658 | 1982-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1202377A true CA1202377A (en) | 1986-03-25 |
Family
ID=23485924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000427813A Expired CA1202377A (en) | 1982-05-10 | 1983-05-10 | Short-pulse soldering system |
Country Status (11)
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63144864A (ja) * | 1986-12-08 | 1988-06-17 | Matsushita Electric Ind Co Ltd | 基板加熱装置 |
| DE3722729A1 (de) * | 1987-07-09 | 1989-01-19 | Productech Gmbh | Geheizter stempel |
| DE3828621A1 (de) * | 1988-08-23 | 1990-03-01 | Productech Gmbh | Vorrichtung zum herstellen eines definierten spaltes zwischen werkzeug und teilen beim impulsloeten |
| US4987678A (en) * | 1989-03-21 | 1991-01-29 | Harris Corporation | Apparatus for installing wire in grid support structure |
| ATE104499T1 (de) * | 1990-07-23 | 1994-04-15 | Siemens Nixdorf Inf Syst | Verlegewerkzeug zum verlegen einer aenderungsverdrahtung bei leiterplatten, sowie verfahren zum verlegen der aenderungsverdrahtung. |
| DE102010006879A1 (de) * | 2010-02-04 | 2011-08-04 | Sunfilm AG, 01900 | Verfahren zur Kontaktierung eines Fotovoltaikmoduls |
| DE102017114771B4 (de) | 2017-06-29 | 2022-01-27 | Pac Tech - Packaging Technologies Gmbh | Verfahren und Vorrichtung zur Herstellung einer Drahtverbindung sowie Bauelementanordnung mit Drahtverbindung |
| WO2025146580A1 (en) * | 2024-01-04 | 2025-07-10 | Biosense Webster (Israel) Ltd. | Soldering wires of electrodes to tin domes and pads in a multielectrode catheter |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1164437A (en) * | 1966-05-27 | 1969-09-17 | Plessey Co Ltd | Improvements relating to Soldering |
| US3673681A (en) * | 1969-04-01 | 1972-07-04 | Inforex | Electrical circuit board wiring |
| US3650450A (en) * | 1969-11-24 | 1972-03-21 | Wells Electronics | Means for forming electrical joints between intermediate parts of an elongated conductor and selected conductive element on an electrical assembly |
| US3960309A (en) * | 1974-07-31 | 1976-06-01 | International Business Machines Corporation | Fine wire twisted pair routing and connecting system |
| FR2304247A1 (fr) * | 1975-03-12 | 1976-10-08 | Commissariat Energie Atomique | Procede et dispositif d'interconnexion de composants electroniques |
| JPS5915937Y2 (ja) * | 1979-09-12 | 1984-05-11 | 陽介 二宮 | テ−ブル |
-
1983
- 1983-04-11 DE DE3313456A patent/DE3313456C2/de not_active Expired
- 1983-05-03 GB GB08312010A patent/GB2120152B/en not_active Expired
- 1983-05-04 NL NL8301585A patent/NL8301585A/nl not_active Application Discontinuation
- 1983-05-09 AU AU14360/83A patent/AU1436083A/en not_active Abandoned
- 1983-05-09 CH CH2532/83A patent/CH659204A5/de not_active IP Right Cessation
- 1983-05-09 BR BR8302421A patent/BR8302421A/pt unknown
- 1983-05-10 SE SE8302679A patent/SE450098B/sv not_active IP Right Cessation
- 1983-05-10 ZA ZA833330A patent/ZA833330B/xx unknown
- 1983-05-10 JP JP58083442A patent/JPS5916289A/ja active Granted
- 1983-05-10 FR FR8307762A patent/FR2526624B1/fr not_active Expired
- 1983-05-10 CA CA000427813A patent/CA1202377A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2526624A1 (fr) | 1983-11-10 |
| JPS5916289A (ja) | 1984-01-27 |
| SE8302679L (sv) | 1983-11-11 |
| GB2120152A (en) | 1983-11-30 |
| SE8302679D0 (sv) | 1983-05-10 |
| CH659204A5 (de) | 1987-01-15 |
| BR8302421A (pt) | 1984-01-10 |
| GB2120152B (en) | 1986-06-04 |
| DE3313456C2 (de) | 1984-02-16 |
| ZA833330B (en) | 1984-06-27 |
| DE3313456A1 (de) | 1983-11-17 |
| GB8312010D0 (en) | 1983-06-08 |
| SE450098B (sv) | 1987-06-09 |
| AU1436083A (en) | 1983-11-17 |
| NL8301585A (nl) | 1983-12-01 |
| FR2526624B1 (fr) | 1986-05-02 |
| JPH0145957B2 (enrdf_load_stackoverflow) | 1989-10-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5032703A (en) | Self regulating temperature heater carrier strip | |
| US4050621A (en) | Method and apparatus for soldering electric terminals to double-sided circuit boards | |
| US5939969A (en) | Preformed thermal fuse | |
| CA1264360A (en) | Self-heating, self-soldering bus bar | |
| CA1202377A (en) | Short-pulse soldering system | |
| US3813023A (en) | Desoldering device | |
| KR100384796B1 (ko) | 도체를 접착시키기 위한 장치 및 방법 | |
| JPS6015160B2 (ja) | 電気回路を形成する方法およびその装置 | |
| US3944777A (en) | Method for joining resistive and conductive materials | |
| US4484054A (en) | Short pulse soldering system | |
| US4771932A (en) | Method for soldering and desoldering electronic components | |
| US20150264808A1 (en) | Solder Attachment of Electrical Components | |
| US5126527A (en) | High temperature solder device for flat cables | |
| US3485934A (en) | Circuit board | |
| US3519778A (en) | Method and apparatus for joining electrical conductors | |
| US3444347A (en) | Method for solder reflow connection of insulated conductors | |
| US3418422A (en) | Attachment of integrated circuit leads to printed circuit boards | |
| JP3211580B2 (ja) | はんだ付け装置 | |
| JP3709036B2 (ja) | 弱耐熱性電子部品の実装方法 | |
| JPS60240389A (ja) | スポツト溶接方法 | |
| JPS6056472A (ja) | メタルコンセントのハンダ付け方法 | |
| US4580027A (en) | Soldering device and method of soldering | |
| JPH01186269A (ja) | 半田付け装置 | |
| JPH0230142Y2 (enrdf_load_stackoverflow) | ||
| Urban | Proper Selection of Tip Style and Tip Temperature for PCB Connections |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |