GB2120152B - Rapid soldering of wire to terminal pads - Google Patents

Rapid soldering of wire to terminal pads

Info

Publication number
GB2120152B
GB2120152B GB08312010A GB8312010A GB2120152B GB 2120152 B GB2120152 B GB 2120152B GB 08312010 A GB08312010 A GB 08312010A GB 8312010 A GB8312010 A GB 8312010A GB 2120152 B GB2120152 B GB 2120152B
Authority
GB
United Kingdom
Prior art keywords
wire
terminal pads
rapid soldering
soldering
rapid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08312010A
Other languages
English (en)
Other versions
GB8312010D0 (en
GB2120152A (en
Inventor
Ronald Morino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of GB8312010D0 publication Critical patent/GB8312010D0/en
Publication of GB2120152A publication Critical patent/GB2120152A/en
Application granted granted Critical
Publication of GB2120152B publication Critical patent/GB2120152B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0949—Pad close to a hole, not surrounding the hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
GB08312010A 1982-05-10 1983-05-03 Rapid soldering of wire to terminal pads Expired GB2120152B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US37665882A 1982-05-10 1982-05-10

Publications (3)

Publication Number Publication Date
GB8312010D0 GB8312010D0 (en) 1983-06-08
GB2120152A GB2120152A (en) 1983-11-30
GB2120152B true GB2120152B (en) 1986-06-04

Family

ID=23485924

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08312010A Expired GB2120152B (en) 1982-05-10 1983-05-03 Rapid soldering of wire to terminal pads

Country Status (11)

Country Link
JP (1) JPS5916289A (enrdf_load_stackoverflow)
AU (1) AU1436083A (enrdf_load_stackoverflow)
BR (1) BR8302421A (enrdf_load_stackoverflow)
CA (1) CA1202377A (enrdf_load_stackoverflow)
CH (1) CH659204A5 (enrdf_load_stackoverflow)
DE (1) DE3313456C2 (enrdf_load_stackoverflow)
FR (1) FR2526624B1 (enrdf_load_stackoverflow)
GB (1) GB2120152B (enrdf_load_stackoverflow)
NL (1) NL8301585A (enrdf_load_stackoverflow)
SE (1) SE450098B (enrdf_load_stackoverflow)
ZA (1) ZA833330B (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63144864A (ja) * 1986-12-08 1988-06-17 Matsushita Electric Ind Co Ltd 基板加熱装置
DE3722729A1 (de) * 1987-07-09 1989-01-19 Productech Gmbh Geheizter stempel
DE3828621A1 (de) * 1988-08-23 1990-03-01 Productech Gmbh Vorrichtung zum herstellen eines definierten spaltes zwischen werkzeug und teilen beim impulsloeten
US4987678A (en) * 1989-03-21 1991-01-29 Harris Corporation Apparatus for installing wire in grid support structure
EP0468267B1 (de) * 1990-07-23 1994-04-13 Siemens Nixdorf Informationssysteme Aktiengesellschaft Verlegewerkzeug zum Verlegen einer Änderungsverdrahtung bei Leiterplatten, sowie Verfahren zum Verlegen der Änderungsverdrahtung
DE102010006879A1 (de) * 2010-02-04 2011-08-04 Sunfilm AG, 01900 Verfahren zur Kontaktierung eines Fotovoltaikmoduls
DE102017114771B4 (de) 2017-06-29 2022-01-27 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorrichtung zur Herstellung einer Drahtverbindung sowie Bauelementanordnung mit Drahtverbindung
WO2025146580A1 (en) * 2024-01-04 2025-07-10 Biosense Webster (Israel) Ltd. Soldering wires of electrodes to tin domes and pads in a multielectrode catheter

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1164437A (en) * 1966-05-27 1969-09-17 Plessey Co Ltd Improvements relating to Soldering
US3673681A (en) * 1969-04-01 1972-07-04 Inforex Electrical circuit board wiring
US3650450A (en) * 1969-11-24 1972-03-21 Wells Electronics Means for forming electrical joints between intermediate parts of an elongated conductor and selected conductive element on an electrical assembly
US3960309A (en) * 1974-07-31 1976-06-01 International Business Machines Corporation Fine wire twisted pair routing and connecting system
FR2304247A1 (fr) * 1975-03-12 1976-10-08 Commissariat Energie Atomique Procede et dispositif d'interconnexion de composants electroniques
JPS5915937Y2 (ja) * 1979-09-12 1984-05-11 陽介 二宮 テ−ブル

Also Published As

Publication number Publication date
CH659204A5 (de) 1987-01-15
SE8302679D0 (sv) 1983-05-10
JPS5916289A (ja) 1984-01-27
SE8302679L (sv) 1983-11-11
BR8302421A (pt) 1984-01-10
FR2526624B1 (fr) 1986-05-02
GB8312010D0 (en) 1983-06-08
GB2120152A (en) 1983-11-30
SE450098B (sv) 1987-06-09
FR2526624A1 (fr) 1983-11-10
NL8301585A (nl) 1983-12-01
CA1202377A (en) 1986-03-25
DE3313456C2 (de) 1984-02-16
ZA833330B (en) 1984-06-27
DE3313456A1 (de) 1983-11-17
AU1436083A (en) 1983-11-17
JPH0145957B2 (enrdf_load_stackoverflow) 1989-10-05

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930503