CA1153733A - Magnetically enhanced sputtering device including means for sputtering magnetically permeable targets - Google Patents
Magnetically enhanced sputtering device including means for sputtering magnetically permeable targetsInfo
- Publication number
- CA1153733A CA1153733A CA000349015A CA349015A CA1153733A CA 1153733 A CA1153733 A CA 1153733A CA 000349015 A CA000349015 A CA 000349015A CA 349015 A CA349015 A CA 349015A CA 1153733 A CA1153733 A CA 1153733A
- Authority
- CA
- Canada
- Prior art keywords
- sputtering
- magnet means
- sputtering surface
- cathode
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 116
- 230000005291 magnetic effect Effects 0.000 claims abstract description 66
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 10
- 230000004907 flux Effects 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 9
- 230000005684 electric field Effects 0.000 claims description 9
- 210000002381 plasma Anatomy 0.000 description 28
- 150000002500 ions Chemical class 0.000 description 10
- 230000035699 permeability Effects 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- NSMXQKNUPPXBRG-SECBINFHSA-N (R)-lisofylline Chemical compound O=C1N(CCCC[C@H](O)C)C(=O)N(C)C2=C1N(C)C=N2 NSMXQKNUPPXBRG-SECBINFHSA-N 0.000 description 1
- 241000272470 Circus Species 0.000 description 1
- 240000000233 Melia azedarach Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 235000015107 ale Nutrition 0.000 description 1
- 229910000828 alnico Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- CEJLBZWIKQJOAT-UHFFFAOYSA-N dichloroisocyanuric acid Chemical compound ClN1C(=O)NC(=O)N(Cl)C1=O CEJLBZWIKQJOAT-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000002674 ointment Substances 0.000 description 1
- 230000003389 potentiating effect Effects 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3452—Magnet distribution
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Coating By Spraying Or Casting (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US2843479A | 1979-04-09 | 1979-04-09 | |
| US28,434 | 1979-04-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1153733A true CA1153733A (en) | 1983-09-13 |
Family
ID=21843423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000349015A Expired CA1153733A (en) | 1979-04-09 | 1980-04-01 | Magnetically enhanced sputtering device including means for sputtering magnetically permeable targets |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS593546B2 (OSRAM) |
| CA (1) | CA1153733A (OSRAM) |
| DE (1) | DE3012935C2 (OSRAM) |
| FR (1) | FR2454178A1 (OSRAM) |
| GB (1) | GB2051877B (OSRAM) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4457825A (en) * | 1980-05-16 | 1984-07-03 | Varian Associates, Inc. | Sputter target for use in a sputter coating source |
| CH649578A5 (de) * | 1981-03-27 | 1985-05-31 | Ulvac Corp | Hochgeschwindigkeits-kathoden-zerstaeubungsvorrichtung. |
| GB2096177B (en) * | 1981-04-07 | 1985-07-17 | Fournier Paul R | Improved integrated sputtering apparatus and method |
| GB2110719B (en) * | 1981-11-30 | 1985-10-30 | Anelva Corp | Sputtering apparatus |
| JPS58130277A (ja) * | 1982-01-27 | 1983-08-03 | Clarion Co Ltd | マグネトロンスパツタ装置 |
| US4391697A (en) * | 1982-08-16 | 1983-07-05 | Vac-Tec Systems, Inc. | High rate magnetron sputtering of high permeability materials |
| JPS5989769A (ja) * | 1982-11-15 | 1984-05-24 | Hitachi Ltd | プレ−ナマグネトロン型スパツタ電極 |
| US4581118A (en) * | 1983-01-26 | 1986-04-08 | Materials Research Corporation | Shaped field magnetron electrode |
| US4515675A (en) * | 1983-07-06 | 1985-05-07 | Leybold-Heraeus Gmbh | Magnetron cathode for cathodic evaportion apparatus |
| DE3429988A1 (de) * | 1983-12-05 | 1985-06-13 | Leybold-Heraeus GmbH, 5000 Köln | Magnetronkatode zum zerstaeuben ferromagnetischer targets |
| CH659484A5 (de) * | 1984-04-19 | 1987-01-30 | Balzers Hochvakuum | Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung. |
| JPH0633454B2 (ja) * | 1984-11-20 | 1994-05-02 | 松下電器産業株式会社 | スパツタリング装置 |
| US4657619A (en) * | 1985-11-29 | 1987-04-14 | Donnell Kevin P O | Diverter magnet arrangement for plasma processing system |
| JPS62153365U (OSRAM) * | 1987-02-12 | 1987-09-29 | ||
| GB2209769A (en) * | 1987-09-16 | 1989-05-24 | Ion Tech Ltd | Sputter coating |
| JPH0219462A (ja) * | 1988-07-06 | 1990-01-23 | Ube Ind Ltd | マグネトロンスパッタリング方法及びその装置 |
| JP5869560B2 (ja) * | 2011-04-26 | 2016-02-24 | 株式会社アルバック | カソードユニット |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3878085A (en) * | 1973-07-05 | 1975-04-15 | Sloan Technology Corp | Cathode sputtering apparatus |
| US3956093A (en) * | 1974-12-16 | 1976-05-11 | Airco, Inc. | Planar magnetron sputtering method and apparatus |
| CH611938A5 (OSRAM) * | 1976-05-19 | 1979-06-29 | Battelle Memorial Institute | |
| NL7607473A (nl) * | 1976-07-07 | 1978-01-10 | Philips Nv | Verstuifinrichting en werkwijze voor het ver- stuiven met een dergelijke inrichting. |
| US4094761A (en) * | 1977-07-25 | 1978-06-13 | Motorola, Inc. | Magnetion sputtering of ferromagnetic material |
-
1980
- 1980-03-27 GB GB8010244A patent/GB2051877B/en not_active Expired
- 1980-04-01 CA CA000349015A patent/CA1153733A/en not_active Expired
- 1980-04-02 DE DE19803012935 patent/DE3012935C2/de not_active Expired
- 1980-04-08 JP JP4614480A patent/JPS593546B2/ja not_active Expired
- 1980-04-08 FR FR8007827A patent/FR2454178A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55148770A (en) | 1980-11-19 |
| JPS593546B2 (ja) | 1984-01-24 |
| FR2454178A1 (fr) | 1980-11-07 |
| DE3012935C2 (de) | 1983-04-14 |
| GB2051877A (en) | 1981-01-21 |
| FR2454178B1 (OSRAM) | 1983-11-25 |
| GB2051877B (en) | 1983-03-02 |
| DE3012935A1 (de) | 1980-10-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |