GB2110719B - Sputtering apparatus - Google Patents

Sputtering apparatus

Info

Publication number
GB2110719B
GB2110719B GB08231830A GB8231830A GB2110719B GB 2110719 B GB2110719 B GB 2110719B GB 08231830 A GB08231830 A GB 08231830A GB 8231830 A GB8231830 A GB 8231830A GB 2110719 B GB2110719 B GB 2110719B
Authority
GB
United Kingdom
Prior art keywords
sputtering apparatus
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08231830A
Other versions
GB2110719A (en
Inventor
Haruhiro Kobayashi
Hidefumi Funaki
Takehiro Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP19236081A external-priority patent/JPS5893872A/en
Priority claimed from JP57102260A external-priority patent/JPS58221275A/en
Application filed by Anelva Corp filed Critical Anelva Corp
Publication of GB2110719A publication Critical patent/GB2110719A/en
Application granted granted Critical
Publication of GB2110719B publication Critical patent/GB2110719B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
GB08231830A 1981-11-30 1982-11-08 Sputtering apparatus Expired GB2110719B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP19236081A JPS5893872A (en) 1981-11-30 1981-11-30 Sputtering device
JP57102260A JPS58221275A (en) 1982-06-16 1982-06-16 Sputtering device

Publications (2)

Publication Number Publication Date
GB2110719A GB2110719A (en) 1983-06-22
GB2110719B true GB2110719B (en) 1985-10-30

Family

ID=26442974

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08231830A Expired GB2110719B (en) 1981-11-30 1982-11-08 Sputtering apparatus

Country Status (3)

Country Link
DE (1) DE3244691C3 (en)
FR (1) FR2517330B1 (en)
GB (1) GB2110719B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4515675A (en) * 1983-07-06 1985-05-07 Leybold-Heraeus Gmbh Magnetron cathode for cathodic evaportion apparatus
EP0144838B1 (en) * 1983-12-05 1989-10-11 Leybold Aktiengesellschaft Magnetron cathode for the sputtering of ferromagnetic targets
DE3442206A1 (en) * 1983-12-05 1985-07-11 Leybold-Heraeus GmbH, 5000 Köln Magnetron cathode for atomising ferromagnetic targets
DE3429988A1 (en) * 1983-12-05 1985-06-13 Leybold-Heraeus GmbH, 5000 Köln Magnetron cathode for sputtering ferromagnetic targets
CH664303A5 (en) * 1985-04-03 1988-02-29 Balzers Hochvakuum HOLDING DEVICE FOR TARGETS FOR CATHODE SPRAYING.
DE19648390A1 (en) * 1995-09-27 1998-05-28 Leybold Materials Gmbh Target for the sputter cathode of a vacuum coating plant
DE19535894A1 (en) * 1995-09-27 1997-04-03 Leybold Materials Gmbh Target for the sputter cathode of a vacuum coating system and process for its production
DE19735469A1 (en) * 1997-08-16 1999-02-18 Leybold Materials Gmbh Target for a sputter cathode
AU9410498A (en) * 1997-11-26 1999-06-17 Vapor Technologies, Inc. Apparatus for sputtering or arc evaporation
US6569294B1 (en) * 1999-07-15 2003-05-27 Seagate Technology Llc Sputtering target assembly and method for depositing a thickness gradient layer with narrow transition zone
WO2001022464A1 (en) * 1999-09-21 2001-03-29 Sli Lichtsysteme Gmbh Support material

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4094761A (en) * 1977-07-25 1978-06-13 Motorola, Inc. Magnetion sputtering of ferromagnetic material
JPS5534689A (en) * 1978-09-04 1980-03-11 Anelva Corp Sputtering device
JPS5554570A (en) * 1978-10-16 1980-04-21 Anelva Corp Sputtering apparatus for magnetic thin film formation
JPS5580221A (en) * 1978-12-13 1980-06-17 Mitsubishi Electric Corp Key switch
GB2051877B (en) * 1979-04-09 1983-03-02 Vac Tec Syst Magnetically enhanced sputtering device and method
JPS5616671A (en) * 1979-07-17 1981-02-17 Fujitsu Ltd Sputtering apparatus
US4299678A (en) * 1979-07-23 1981-11-10 Spin Physics, Inc. Magnetic target plate for use in magnetron sputtering of magnetic films
JPS5952957B2 (en) * 1980-06-16 1984-12-22 日電アネルバ株式会社 Cathode part of magnetron type sputtering equipment
JPH01293463A (en) * 1988-05-20 1989-11-27 Sharp Corp Character processor

Also Published As

Publication number Publication date
FR2517330A1 (en) 1983-06-03
DE3244691A1 (en) 1983-06-23
FR2517330B1 (en) 1985-06-28
DE3244691C2 (en) 1991-05-29
GB2110719A (en) 1983-06-22
DE3244691C3 (en) 1997-04-03

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19961108