CA1153128A - Circuits electriques - Google Patents

Circuits electriques

Info

Publication number
CA1153128A
CA1153128A CA000375824A CA375824A CA1153128A CA 1153128 A CA1153128 A CA 1153128A CA 000375824 A CA000375824 A CA 000375824A CA 375824 A CA375824 A CA 375824A CA 1153128 A CA1153128 A CA 1153128A
Authority
CA
Canada
Prior art keywords
aluminium
layer
circuit assembly
thin
highly conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000375824A
Other languages
English (en)
Inventor
Jonathan L. Evans
John M. Morrison
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ferranti International PLC
Original Assignee
Ferranti PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferranti PLC filed Critical Ferranti PLC
Application granted granted Critical
Publication of CA1153128A publication Critical patent/CA1153128A/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/016Thin-film circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124Aluminium (Al) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48455Details of wedge bonds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01014Silicon [Si]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01019Potassium [K]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01046Palladium [Pd]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01057Lanthanum [La]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/0132Binary Alloys
    • H01L2924/01327Intermediate phases, i.e. intermetallics compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CA000375824A 1980-04-22 1981-04-21 Circuits electriques Expired CA1153128A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8013163 1980-04-22
GB80.13163 1980-04-22

Publications (1)

Publication Number Publication Date
CA1153128A true CA1153128A (fr) 1983-08-30

Family

ID=10512920

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000375824A Expired CA1153128A (fr) 1980-04-22 1981-04-21 Circuits electriques

Country Status (4)

Country Link
CA (1) CA1153128A (fr)
DE (1) DE3115856A1 (fr)
FR (1) FR2481006A1 (fr)
NL (1) NL8101979A (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3704200A1 (de) * 1987-02-11 1988-08-25 Bbc Brown Boveri & Cie Verfahren zur herstellung einer verbindung zwischen einem bonddraht und einer kontaktflaeche bei hybriden dickschicht-schaltkreisen
JP2755594B2 (ja) * 1988-03-30 1998-05-20 株式会社 東芝 セラミックス回路基板
KR930011143A (ko) * 1991-11-14 1993-06-23 김광호 반도체장치 및 그 제조방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4035526A (en) * 1975-08-20 1977-07-12 General Motors Corporation Evaporated solderable multilayer contact for silicon semiconductor
DE2631810C3 (de) * 1976-07-15 1979-03-15 Deutsche Itt Industries Gmbh, 7800 Freiburg Planares Halbleiterbauelement
DD135339A3 (de) * 1977-03-07 1979-05-02 Juergen Henneberger Bondfaehiges schichtsystem in duennfilmtechnik fuer hybridschaltkreise

Also Published As

Publication number Publication date
NL8101979A (nl) 1981-11-16
FR2481006A1 (fr) 1981-10-23
DE3115856A1 (de) 1982-01-21

Similar Documents

Publication Publication Date Title
US3952404A (en) Beam lead formation method
EP0253691B1 (fr) Procédé de montage d'un dé en silicium
US3881884A (en) Method for the formation of corrosion resistant electronic interconnections
US4023725A (en) Semiconductor device manufacture
JP2763034B2 (ja) 半導体チップ・パッケージ
EP2224479B1 (fr) substrat composite métal-céramique et son procédé de fabrication
US4005288A (en) Photodetector mounting and connecting
EP0460785B1 (fr) Dispositif semi-conducteur comprenant un refroidisseur
EP1939929B1 (fr) Dissipateur thermique utilisant une couche de brasure et procédé de fabrication d'un tel dissipateur thermique
US4516149A (en) Semiconductor device having ribbon electrode structure and method for fabricating the same
CA1153128A (fr) Circuits electriques
US7746213B2 (en) Device and method for manufacturing the same
JPS62199043A (ja) 薄膜回路及びその製造法
GB2074793A (en) Thin film circuit assembly
EP0068091B1 (fr) Procédé pour connecter une puce semiconductrice à un substrat et une telle connexion
US3484933A (en) Face bonding technique
US4089991A (en) Process for applying electrical conductors for Dewar flask
GB2079539A (en) Electrical circuit assemblies
JPH10208906A (ja) 温度センサ
JPS6013044A (ja) ハンダ付け可能な固着薄層
US3702787A (en) Method of forming ohmic contact for semiconducting devices
US3992774A (en) Method for fabricating lead through for Dewar flask
JP3231984B2 (ja) 半導体素子収納用パッケージ及びその製造方法
JPH0760882B2 (ja) ろう付け方法
JP3279846B2 (ja) 半導体装置の製造方法

Legal Events

Date Code Title Description
MKEX Expiry