CA1095620A - Two-device memory cell - Google Patents

Two-device memory cell

Info

Publication number
CA1095620A
CA1095620A CA278,853A CA278853A CA1095620A CA 1095620 A CA1095620 A CA 1095620A CA 278853 A CA278853 A CA 278853A CA 1095620 A CA1095620 A CA 1095620A
Authority
CA
Canada
Prior art keywords
bit
memory array
storage device
pair
sense
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA278,853A
Other languages
English (en)
French (fr)
Inventor
Ekkehard F. Miersch
Dominic P. Spampinato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of CA1095620A publication Critical patent/CA1095620A/en
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409Read-write [R-W] circuits 
    • G11C11/4097Bit-line organisation, e.g. bit-line layout, folded bit lines
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/403Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
    • G11C11/404Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with one charge-transfer gate, e.g. MOS transistor, per cell
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409Read-write [R-W] circuits 
    • G11C11/4091Sense or sense/refresh amplifiers, or associated sense circuitry, e.g. for coupled bit-line precharging, equalising or isolating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Dram (AREA)
  • Static Random-Access Memory (AREA)
  • Read Only Memory (AREA)
CA278,853A 1976-06-17 1977-05-20 Two-device memory cell Expired CA1095620A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US697,188 1976-06-17
US05/697,188 US4103342A (en) 1976-06-17 1976-06-17 Two-device memory cell with single floating capacitor

Publications (1)

Publication Number Publication Date
CA1095620A true CA1095620A (en) 1981-02-10

Family

ID=24800170

Family Applications (1)

Application Number Title Priority Date Filing Date
CA278,853A Expired CA1095620A (en) 1976-06-17 1977-05-20 Two-device memory cell

Country Status (8)

Country Link
US (1) US4103342A (Direct)
JP (1) JPS52154314A (Direct)
CA (1) CA1095620A (Direct)
DE (1) DE2725613C2 (Direct)
FR (1) FR2355358A1 (Direct)
GB (1) GB1523094A (Direct)
IT (1) IT1115344B (Direct)
NL (1) NL7704931A (Direct)

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DE2740113A1 (de) * 1977-09-06 1979-03-15 Siemens Ag Monolithisch integrierter halbleiterspeicher
US4160275A (en) * 1978-04-03 1979-07-03 International Business Machines Corporation Accessing arrangement for memories with small cells
JPS5634179A (en) * 1979-08-24 1981-04-06 Mitsubishi Electric Corp Control circuit for memory unit
US4413330A (en) * 1981-06-30 1983-11-01 International Business Machines Corporation Apparatus for the reduction of the short-channel effect in a single-polysilicon, one-device FET dynamic RAM array
GB2144937B (en) * 1981-08-05 1986-02-19 Gen Instrument Corp A storage cell suitable for use in a storage cell logic array
JPS6116099A (ja) * 1984-06-29 1986-01-24 Sharp Corp ダイナミック型半導体記憶装置
FR2595160A1 (fr) * 1986-02-28 1987-09-04 Eurotechnique Sa Cellule memoire couplee et memoire dynamique comportant une telle cellule
US4888733A (en) * 1988-09-12 1989-12-19 Ramtron Corporation Non-volatile memory cell and sensing method
JPH02168492A (ja) * 1988-12-21 1990-06-28 Nec Corp ダイナミックramのメモリセル
US5293563A (en) * 1988-12-29 1994-03-08 Sharp Kabushiki Kaisha Multi-level memory cell with increased read-out margin
US5219779A (en) * 1989-05-11 1993-06-15 Sharp Kabushiki Kaisha Memory cell for dynamic random access memory
JP2719237B2 (ja) * 1990-12-20 1998-02-25 シャープ株式会社 ダイナミック型半導体記憶装置
US5363327A (en) * 1993-01-19 1994-11-08 International Business Machines Corporation Buried-sidewall-strap two transistor one capacitor trench cell
KR0146075B1 (ko) * 1995-05-25 1998-11-02 문정환 반도체 메모리 셀
WO2003052829A1 (fr) * 2001-12-14 2003-06-26 Hitachi, Ltd. Dispositif semi-conducteur et procede de fabrication correspondant
US6888187B2 (en) 2002-08-26 2005-05-03 International Business Machines Corporation DRAM cell with enhanced SER immunity
US7164595B1 (en) * 2005-08-25 2007-01-16 Micron Technology, Inc. Device and method for using dynamic cell plate sensing in a DRAM memory cell
CN109690680B (zh) 2016-08-31 2023-07-21 美光科技公司 包含二晶体管一电容器的存储器及用于存取所述存储器的设备与方法
EP3507806B1 (en) 2016-08-31 2022-01-19 Micron Technology, Inc. Apparatuses and methods including ferroelectric memory and for accessing ferroelectric memory
WO2018044454A1 (en) 2016-08-31 2018-03-08 Micron Technology, Inc. Memory cells and memory arrays
SG11201901168UA (en) 2016-08-31 2019-03-28 Micron Technology Inc Apparatuses and methods including ferroelectric memory and for operating ferroelectric memory
US10355002B2 (en) * 2016-08-31 2019-07-16 Micron Technology, Inc. Memory cells, methods of forming an array of two transistor-one capacitor memory cells, and methods used in fabricating integrated circuitry
CN109219883B (zh) 2016-08-31 2023-03-21 美光科技公司 存储器胞元和存储器阵列
US10056386B2 (en) 2016-08-31 2018-08-21 Micron Technology, Inc. Memory cells and memory arrays
CN109155312B (zh) 2016-08-31 2023-05-02 美光科技公司 存储器单元及存储器阵列
WO2018044458A1 (en) 2016-08-31 2018-03-08 Micron Technology, Inc. Memory arrays
JP6980006B2 (ja) 2016-08-31 2021-12-15 マイクロン テクノロジー,インク. 強誘電体メモリセル
CN109196584B (zh) 2016-08-31 2022-07-19 美光科技公司 感测放大器构造
CN110192280A (zh) 2017-01-12 2019-08-30 美光科技公司 存储器单元、双晶体管单电容器存储器单元阵列、形成双晶体管单电容器存储器单元阵列的方法及用于制造集成电路的方法
US10867675B2 (en) 2017-07-13 2020-12-15 Micron Technology, Inc. Apparatuses and methods for memory including ferroelectric memory cells and dielectric memory cells
US10083973B1 (en) * 2017-08-09 2018-09-25 Micron Technology, Inc. Apparatuses and methods for reading memory cells
EP3676835A4 (en) 2017-08-29 2020-08-19 Micron Technology, Inc. MEMORY CIRCUITS

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4420093Y1 (Direct) * 1966-04-27 1969-08-28
US3463992A (en) * 1966-06-13 1969-08-26 Gen Electric Electrical capacitor systems having long-term storage characteristics
US3585185A (en) * 1968-05-13 1971-06-15 Wyandotte Chemicals Corp Ester-containing polyols
DE2431079C3 (de) * 1974-06-28 1979-12-13 Ibm Deutschland Gmbh, 7000 Stuttgart Dynamischer Halbleiterspeicher mit Zwei-Transistor-Speicherelementen
US3938109A (en) * 1975-02-19 1976-02-10 Intel Corporation High speed ECL compatible MOS-Ram

Also Published As

Publication number Publication date
DE2725613A1 (de) 1977-12-29
FR2355358B1 (Direct) 1979-03-09
JPS5733632B2 (Direct) 1982-07-17
FR2355358A1 (fr) 1978-01-13
GB1523094A (en) 1978-08-31
US4103342A (en) 1978-07-25
JPS52154314A (en) 1977-12-22
NL7704931A (nl) 1977-12-20
IT1115344B (it) 1986-02-03
DE2725613C2 (de) 1984-05-24

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