CA1088047A - Boiling heat transfer surface and method - Google Patents

Boiling heat transfer surface and method

Info

Publication number
CA1088047A
CA1088047A CA250,674A CA250674A CA1088047A CA 1088047 A CA1088047 A CA 1088047A CA 250674 A CA250674 A CA 250674A CA 1088047 A CA1088047 A CA 1088047A
Authority
CA
Canada
Prior art keywords
coating
tube
amps
promontories
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA250,674A
Other languages
English (en)
French (fr)
Inventor
Clarence E. Albertson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Borg Warner Corp
Original Assignee
Borg Warner Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Borg Warner Corp filed Critical Borg Warner Corp
Application granted granted Critical
Publication of CA1088047A publication Critical patent/CA1088047A/en
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
CA250,674A 1975-04-28 1976-04-21 Boiling heat transfer surface and method Expired CA1088047A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/572,376 US4018264A (en) 1975-04-28 1975-04-28 Boiling heat transfer surface and method
US572,376 1975-04-28

Publications (1)

Publication Number Publication Date
CA1088047A true CA1088047A (en) 1980-10-21

Family

ID=24287531

Family Applications (1)

Application Number Title Priority Date Filing Date
CA250,674A Expired CA1088047A (en) 1975-04-28 1976-04-21 Boiling heat transfer surface and method

Country Status (7)

Country Link
US (1) US4018264A (enExample)
JP (1) JPS51130953A (enExample)
AU (1) AU498419B2 (enExample)
CA (1) CA1088047A (enExample)
DE (1) DE2618668C3 (enExample)
FR (1) FR2309821A1 (enExample)
GB (1) GB1497489A (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4154294A (en) * 1976-09-09 1979-05-15 Union Carbide Corporation Enhanced condensation heat transfer device and method
US4154293A (en) * 1976-09-09 1979-05-15 Union Carbide Corporation Enhanced tube inner surface heat transfer device and method
US4216819A (en) * 1976-09-09 1980-08-12 Union Carbide Corporation Enhanced condensation heat transfer device and method
US4258783A (en) * 1977-11-01 1981-03-31 Borg-Warner Corporation Boiling heat transfer surface, method of preparing same and method of boiling
US4186063A (en) * 1977-11-01 1980-01-29 Borg-Warner Corporation Boiling heat transfer surface, method of preparing same and method of boiling
GB2084308B (en) * 1980-07-14 1983-11-30 Cryoplants Ltd Revapourising liquefied gas
US4552259A (en) * 1984-06-27 1985-11-12 Borg-Warner Corporation Resin-reinforced, nodular plated wet friction materials
FI86475C (fi) * 1985-11-27 1992-08-25 Mitsubishi Materials Corp Vaermeoeverfoeringsmaterial och dess framstaellningsfoerfarande.
JPS62127494A (ja) * 1985-11-27 1987-06-09 Mitsubishi Metal Corp 多孔質層の形成方法
US4846267A (en) * 1987-04-01 1989-07-11 The Boc Group, Inc. Enhanced heat transfer surfaces
US7073572B2 (en) * 2003-06-18 2006-07-11 Zahid Hussain Ayub Flooded evaporator with various kinds of tubes
CN102011171A (zh) * 2010-08-20 2011-04-13 张家港市新港星科技有限公司 电镀线的加热系统
US11209219B1 (en) * 2013-09-11 2021-12-28 National Technology & Engineering Solutions Of Sandia, Llc Circumferential flow foam heat exchanger
TWI527892B (zh) * 2014-05-06 2016-04-01 遠東科技大學 具有枝晶構造的熱傳單元、用途
US20170016131A1 (en) * 2015-07-15 2017-01-19 Far East University Growth method of dendritic crystal structure that provides directional heat transfer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3706127A (en) * 1970-04-27 1972-12-19 Ibm Method for forming heat sinks on semiconductor device chips
US3696861A (en) * 1970-05-18 1972-10-10 Trane Co Heat transfer surface having a high boiling heat transfer coefficient
US3768290A (en) * 1971-06-18 1973-10-30 Uop Inc Method of modifying a finned tube for boiling enhancement
US3906604A (en) * 1974-02-01 1975-09-23 Hitachi Cable Method of forming heat transmissive wall surface

Also Published As

Publication number Publication date
FR2309821B1 (enExample) 1982-05-21
DE2618668B2 (de) 1979-11-29
US4018264A (en) 1977-04-19
AU1290676A (en) 1977-10-20
DE2618668A1 (de) 1976-11-11
JPS51130953A (en) 1976-11-13
FR2309821A1 (fr) 1976-11-26
AU498419B2 (en) 1979-03-15
DE2618668C3 (de) 1980-07-31
GB1497489A (en) 1978-01-12

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Legal Events

Date Code Title Description
MKEX Expiry