CA1057823A - Method for the noncontacting measurement of the electrical conductivity of a lamella - Google Patents
Method for the noncontacting measurement of the electrical conductivity of a lamellaInfo
- Publication number
- CA1057823A CA1057823A CA256,881A CA256881A CA1057823A CA 1057823 A CA1057823 A CA 1057823A CA 256881 A CA256881 A CA 256881A CA 1057823 A CA1057823 A CA 1057823A
- Authority
- CA
- Canada
- Prior art keywords
- lamella
- measurement
- conductivity
- approximately
- inductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005259 measurement Methods 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 34
- 241000446313 Lamella Species 0.000 title claims abstract description 26
- 239000004065 semiconductor Substances 0.000 claims abstract description 15
- 235000012431 wafers Nutrition 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 239000003990 capacitor Substances 0.000 claims description 4
- 230000010355 oscillation Effects 0.000 abstract description 14
- 239000000969 carrier Substances 0.000 abstract description 4
- 230000001939 inductive effect Effects 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 abstract description 2
- 230000035945 sensitivity Effects 0.000 abstract description 2
- 230000003534 oscillatory effect Effects 0.000 abstract 1
- 239000000523 sample Substances 0.000 description 28
- 238000012545 processing Methods 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000000691 measurement method Methods 0.000 description 5
- 238000012544 monitoring process Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000002500 effect on skin Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000012552 review Methods 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/023—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance where the material is placed in the field of a coil
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Health & Medical Sciences (AREA)
- Electrochemistry (AREA)
- Pathology (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/606,365 US4000458A (en) | 1975-08-21 | 1975-08-21 | Method for the noncontacting measurement of the electrical conductivity of a lamella |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1057823A true CA1057823A (en) | 1979-07-03 |
Family
ID=24427675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA256,881A Expired CA1057823A (en) | 1975-08-21 | 1976-07-13 | Method for the noncontacting measurement of the electrical conductivity of a lamella |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US4000458A (enExample) |
| JP (1) | JPS5319874A (enExample) |
| BE (1) | BE845220A (enExample) |
| CA (1) | CA1057823A (enExample) |
| DE (1) | DE2636999C3 (enExample) |
| ES (1) | ES450860A1 (enExample) |
| FR (1) | FR2321702A1 (enExample) |
| GB (1) | GB1552948A (enExample) |
| IT (1) | IT1071415B (enExample) |
| NL (1) | NL168051B (enExample) |
| SE (1) | SE410901B (enExample) |
Families Citing this family (74)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CS202665B1 (cs) * | 1975-10-01 | 1981-01-30 | Milos Jurca | Zařízení pro měření specifického odporu vodivých a polovodivých materiálů |
| US4144488A (en) * | 1977-12-22 | 1979-03-13 | The United States Of America As Represented By The Secretary Of The Navy | Investigation of near-surface electronic properties in semiconductors by electron beam scanning |
| US4142145A (en) * | 1977-12-22 | 1979-02-27 | The United States Of America As Represented By The Secretary Of The Navy | Method for determining conduction-band edge and electron affinity in semiconductors |
| US4353029A (en) * | 1978-02-13 | 1982-10-05 | Ade Corporation | Self inverting gauging system |
| EP0007408A1 (fr) * | 1978-07-14 | 1980-02-06 | International Business Machines Corporation | Appareil de mesure sans contact de la résistance de feuille des matériaux |
| DE2845401C2 (de) * | 1978-10-18 | 1980-10-02 | Gao Gesellschaft Fuer Automation Und Organisation Mbh, 8000 Muenchen | Bedrucktes Wertpapier mit Echtheitsmerkmalen und Verfahren zur Prüfung seineT Echtheit |
| US4286215A (en) * | 1979-05-18 | 1981-08-25 | Bell Telephone Laboratories, Incorporated | Method and apparatus for the contactless monitoring carrier lifetime in semiconductor materials |
| US4779739A (en) * | 1981-12-04 | 1988-10-25 | Gte Products Corporation | Method and apparatus for conductive film detection |
| US4842147A (en) * | 1981-12-04 | 1989-06-27 | Gte Products Corporation | Method and apparatus for conductive film detection |
| US4428782A (en) | 1982-07-23 | 1984-01-31 | The Electricity Council | Production of aluminium alloy strip |
| US4797614A (en) * | 1984-11-02 | 1989-01-10 | Sierracin Corporation | Apparatus and method for measuring conductance including a temperature controlled resonant tank circuit with shielding |
| JPS6228674A (ja) * | 1985-07-30 | 1987-02-06 | Shinetsu Eng Kk | 半導体ウエ−ハの導電率の非接触測定方法およびその装置 |
| US5015952A (en) * | 1988-04-13 | 1991-05-14 | University Of California | Apparatus for characterizing conductivity of materials by measuring the effect of induced shielding currents therein |
| DE3815011A1 (de) * | 1988-04-30 | 1989-11-16 | Leybold Ag | Einrichtung zum zerstoerungsfreien messen des ohmschen widerstands duenner schichten |
| DE3815010A1 (de) * | 1988-04-30 | 1989-11-09 | Leybold Ag | Schaltungsanordnung fuer den kombinierten einsatz einer induktiven und einer kapazitiven einrichtung fuer die zerstoerungsfreie messung des ohmschen wiederstands duenner schichten |
| DE3815009A1 (de) * | 1988-04-30 | 1989-11-09 | Leybold Ag | Einrichtung und verfahren zum zerstoerungsfreien messen des ohmschen widerstands duenner schichten nach dem wirbelstrom-prinzip |
| JPH0389331A (ja) * | 1989-09-01 | 1991-04-15 | Asahi Optical Co Ltd | カメラのシャッタ装置 |
| US5394084A (en) * | 1991-12-23 | 1995-02-28 | The Boeing Company | Method and apparatus for reducing errors in eddy-current conductivity measurements due to lift-off by interpolating between a plurality of reference conductivity measurements |
| DE4231392A1 (de) * | 1992-09-19 | 1994-03-24 | Daimler Benz Ag | Verfahren zur Bestimmung der elektronischen Eigenschaften von Halbleiterschichtstrukturen |
| US5552704A (en) * | 1993-06-25 | 1996-09-03 | Tencor Instruments | Eddy current test method and apparatus for measuring conductance by determining intersection of lift-off and selected curves |
| US5434505A (en) * | 1993-07-30 | 1995-07-18 | Litton Systems, Inc. | Method and apparatus for low temperature HEMT-like material testing |
| US5466614A (en) * | 1993-09-20 | 1995-11-14 | At&T Global Information Solutions Company | Structure and method for remotely measuring process data |
| US5528142A (en) * | 1995-06-19 | 1996-06-18 | Feickert; Carl A. | Resonant eddy analysis- a contactless, inductive method for deriving quantitative information about the conductivity and permeability of a test sample |
| US6448795B1 (en) * | 1999-02-12 | 2002-09-10 | Alexei Ermakov | Three coil apparatus for inductive measurements of conductance |
| US6476604B1 (en) * | 1999-04-12 | 2002-11-05 | Chartered Semiconductor Manufacturing Ltd. | Method and apparatus for identifying high metal content on a semiconductor surface |
| US7069101B1 (en) | 1999-07-29 | 2006-06-27 | Applied Materials, Inc. | Computer integrated manufacturing techniques |
| US6640151B1 (en) | 1999-12-22 | 2003-10-28 | Applied Materials, Inc. | Multi-tool control system, method and medium |
| US6708074B1 (en) | 2000-08-11 | 2004-03-16 | Applied Materials, Inc. | Generic interface builder |
| US7188142B2 (en) | 2000-11-30 | 2007-03-06 | Applied Materials, Inc. | Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility |
| US7047099B2 (en) | 2001-06-19 | 2006-05-16 | Applied Materials Inc. | Integrating tool, module, and fab level control |
| US7698012B2 (en) | 2001-06-19 | 2010-04-13 | Applied Materials, Inc. | Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
| US7160739B2 (en) | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| US6913938B2 (en) | 2001-06-19 | 2005-07-05 | Applied Materials, Inc. | Feedback control of plasma-enhanced chemical vapor deposition processes |
| US7101799B2 (en) | 2001-06-19 | 2006-09-05 | Applied Materials, Inc. | Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
| US7201936B2 (en) | 2001-06-19 | 2007-04-10 | Applied Materials, Inc. | Method of feedback control of sub-atmospheric chemical vapor deposition processes |
| US6910947B2 (en) | 2001-06-19 | 2005-06-28 | Applied Materials, Inc. | Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| US7337019B2 (en) | 2001-07-16 | 2008-02-26 | Applied Materials, Inc. | Integration of fault detection with run-to-run control |
| US6984198B2 (en) | 2001-08-14 | 2006-01-10 | Applied Materials, Inc. | Experiment management system, method and medium |
| US7225047B2 (en) | 2002-03-19 | 2007-05-29 | Applied Materials, Inc. | Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements |
| US20030199112A1 (en) | 2002-03-22 | 2003-10-23 | Applied Materials, Inc. | Copper wiring module control |
| DE10231989B3 (de) * | 2002-07-15 | 2004-04-08 | Wurdack, Stefan, Dr. | Vorrichtung und Verfahren zum Bestimmen eines Flächenwiderstands von Proben |
| US6999836B2 (en) | 2002-08-01 | 2006-02-14 | Applied Materials, Inc. | Method, system, and medium for handling misrepresentative metrology data within an advanced process control system |
| AU2003290932A1 (en) | 2002-11-15 | 2004-06-15 | Applied Materials, Inc. | Method, system and medium for controlling manufacture process having multivariate input parameters |
| US7333871B2 (en) | 2003-01-21 | 2008-02-19 | Applied Materials, Inc. | Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools |
| US7205228B2 (en) | 2003-06-03 | 2007-04-17 | Applied Materials, Inc. | Selective metal encapsulation schemes |
| US7112960B2 (en) * | 2003-07-31 | 2006-09-26 | Applied Materials, Inc. | Eddy current system for in-situ profile measurement |
| US7354332B2 (en) | 2003-08-04 | 2008-04-08 | Applied Materials, Inc. | Technique for process-qualifying a semiconductor manufacturing tool using metrology data |
| US7005851B2 (en) * | 2003-09-30 | 2006-02-28 | General Electric Company | Methods and apparatus for inspection utilizing pulsed eddy current |
| US7356377B2 (en) | 2004-01-29 | 2008-04-08 | Applied Materials, Inc. | System, method, and medium for monitoring performance of an advanced process control system |
| US7096085B2 (en) | 2004-05-28 | 2006-08-22 | Applied Materials | Process control by distinguishing a white noise component of a process variance |
| US6961626B1 (en) | 2004-05-28 | 2005-11-01 | Applied Materials, Inc | Dynamic offset and feedback threshold |
| DE102006056174A1 (de) * | 2006-11-27 | 2008-05-29 | Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG | Induktiver Leitfähigkeitssensor |
| US7898280B2 (en) * | 2008-09-08 | 2011-03-01 | Emil Kamieniecki | Electrical characterization of semiconductor materials |
| JP5615831B2 (ja) * | 2008-11-14 | 2014-10-29 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 縁部分解能強化渦電流センサ |
| RU2442178C2 (ru) * | 2009-06-29 | 2012-02-10 | Учреждение Российской академии наук Институт радиотехники и электроники им. В.А. Котельникова РАН | Способ определения частоты узкополосного сигнала |
| US20110169520A1 (en) * | 2010-01-14 | 2011-07-14 | Mks Instruments, Inc. | Apparatus for measuring minority carrier lifetime and method for using the same |
| RU2421742C1 (ru) * | 2010-01-27 | 2011-06-20 | Закрытое Акционерное Общество "ТЕЛЕКОМ-СТВ" | Устройство для бесконтактного измерения удельного сопротивления кремниевого сырья |
| TW201201957A (en) * | 2010-01-29 | 2012-01-16 | Applied Materials Inc | High sensitivity real time profile control eddy current monitoring system |
| US20110189856A1 (en) * | 2010-01-29 | 2011-08-04 | Kun Xu | High Sensitivity Real Time Profile Control Eddy Current Monitoring System |
| RU2424532C1 (ru) * | 2010-03-12 | 2011-07-20 | Государственное образовательное учреждение высшего профессионального образования Читинский государственный университет (ЧитГУ) | Способ учета электрической энергии |
| RU2420749C1 (ru) * | 2010-04-06 | 2011-06-10 | Закрытое Акционерное Общество "ТЕЛЕКОМ-СТВ" | Устройство для бесконтактного измерения удельного сопротивления полупроводниковых материалов |
| US9023667B2 (en) | 2011-04-27 | 2015-05-05 | Applied Materials, Inc. | High sensitivity eddy current monitoring system |
| DE102012207341B4 (de) * | 2012-05-03 | 2025-12-11 | Rohde & Schwarz GmbH & Co. Kommanditgesellschaft | Ultrabreitbandige Messbrücke |
| US9335151B2 (en) | 2012-10-26 | 2016-05-10 | Applied Materials, Inc. | Film measurement |
| US10234261B2 (en) | 2013-06-12 | 2019-03-19 | Applied Materials, Inc. | Fast and continuous eddy-current metrology of a conductive film |
| US9911664B2 (en) | 2014-06-23 | 2018-03-06 | Applied Materials, Inc. | Substrate features for inductive monitoring of conductive trench depth |
| US9754846B2 (en) | 2014-06-23 | 2017-09-05 | Applied Materials, Inc. | Inductive monitoring of conductive trench depth |
| TW201822953A (zh) | 2016-09-16 | 2018-07-01 | 美商應用材料股份有限公司 | 基於溝槽深度的電磁感應監控進行的過拋光 |
| US10391610B2 (en) | 2016-10-21 | 2019-08-27 | Applied Materials, Inc. | Core configuration for in-situ electromagnetic induction monitoring system |
| US11004708B2 (en) | 2016-10-28 | 2021-05-11 | Applied Materials, Inc. | Core configuration with alternating posts for in-situ electromagnetic induction monitoring system |
| US11231392B2 (en) | 2016-12-27 | 2022-01-25 | Industrial Technology Research Institute | Detecting device and method thereof |
| EP3824804A1 (en) * | 2019-11-25 | 2021-05-26 | Koninklijke Philips N.V. | Inductive sensing system and method |
| CN114113789B (zh) * | 2021-11-25 | 2023-07-21 | 天津大学 | 一种高频下测量金属薄膜电导率的装置及方法 |
| CN114791447B (zh) * | 2022-05-05 | 2024-01-12 | 杭州汇健科技有限公司 | 一种多通道气体传感器 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3234461A (en) * | 1960-12-05 | 1966-02-08 | Texas Instruments Inc | Resistivity-measuring device including solid inductive sensor |
| US3152303A (en) * | 1962-06-11 | 1964-10-06 | United Aircraft Corp | Electrodeless radio frequency conductivity probe for fluids |
| US3544893A (en) * | 1968-08-05 | 1970-12-01 | Anatoly Ivanovich Savin | Apparatus for noncontact measurement of semiconductor resistivity including a toroidal inductive coil with a gap |
| US3646436A (en) * | 1969-12-22 | 1972-02-29 | Gte Laboratories Inc | Apparatus and method for measuring electrical resistance employing constant output voltage technique |
| DE2115437C3 (de) * | 1971-03-30 | 1978-04-27 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur berührungslosen Leitfähigkeitsmessung |
| JPS5228388B2 (enExample) * | 1971-12-16 | 1977-07-26 |
-
1975
- 1975-08-21 US US05/606,365 patent/US4000458A/en not_active Expired - Lifetime
-
1976
- 1976-07-13 CA CA256,881A patent/CA1057823A/en not_active Expired
- 1976-08-10 SE SE7608925A patent/SE410901B/xx unknown
- 1976-08-16 FR FR7624912A patent/FR2321702A1/fr active Granted
- 1976-08-16 BE BE169834A patent/BE845220A/xx not_active IP Right Cessation
- 1976-08-17 NL NL7609128.A patent/NL168051B/xx not_active IP Right Cessation
- 1976-08-17 DE DE2636999A patent/DE2636999C3/de not_active Expired
- 1976-08-19 JP JP9826976A patent/JPS5319874A/ja active Granted
- 1976-08-20 IT IT69068/76A patent/IT1071415B/it active
- 1976-08-20 GB GB34741/76A patent/GB1552948A/en not_active Expired
- 1976-08-20 ES ES450860A patent/ES450860A1/es not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| SE7608925L (sv) | 1977-02-22 |
| DE2636999A1 (de) | 1977-03-17 |
| DE2636999B2 (de) | 1978-03-30 |
| GB1552948A (en) | 1979-09-19 |
| NL168051B (nl) | 1981-09-16 |
| US4000458A (en) | 1976-12-28 |
| BE845220A (fr) | 1976-12-16 |
| NL7609128A (nl) | 1977-02-23 |
| FR2321702B1 (enExample) | 1981-09-18 |
| JPS5319874A (en) | 1978-02-23 |
| JPS5520550B2 (enExample) | 1980-06-03 |
| ES450860A1 (es) | 1977-08-16 |
| DE2636999C3 (de) | 1982-03-18 |
| IT1071415B (it) | 1985-04-10 |
| SE410901B (sv) | 1979-11-12 |
| FR2321702A1 (fr) | 1977-03-18 |
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