BRPI1015480A2 - composição curável, uso de uma composição curável, método para a fabricação de um equipamento de isolamento elétrico, e, uso do produto curado. - Google Patents

composição curável, uso de uma composição curável, método para a fabricação de um equipamento de isolamento elétrico, e, uso do produto curado.

Info

Publication number
BRPI1015480A2
BRPI1015480A2 BRPI1015480A BRPI1015480A BRPI1015480A2 BR PI1015480 A2 BRPI1015480 A2 BR PI1015480A2 BR PI1015480 A BRPI1015480 A BR PI1015480A BR PI1015480 A BRPI1015480 A BR PI1015480A BR PI1015480 A2 BRPI1015480 A2 BR PI1015480A2
Authority
BR
Brazil
Prior art keywords
curable composition
manufacture
cured product
electrical insulation
insulation equipment
Prior art date
Application number
BRPI1015480A
Other languages
English (en)
Inventor
Christian Beisele
Daniel Bear
Josef Grindling
Original Assignee
Huntsman Adv Mat Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Adv Mat Switzerland filed Critical Huntsman Adv Mat Switzerland
Publication of BRPI1015480A2 publication Critical patent/BRPI1015480A2/pt
Publication of BRPI1015480B1 publication Critical patent/BRPI1015480B1/pt
Publication of BRPI1015480B8 publication Critical patent/BRPI1015480B8/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B13/00—Arrangement of switchgear in which switches are enclosed in, or structurally associated with, a casing, e.g. cubicle

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
BRPI1015480A 2009-04-02 2010-02-24 composição curável, produto curado, e, método para a fabricação de um componente de equipamento de isolamento elétrico BRPI1015480B8 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP09157142 2009-04-02
PCT/EP2010/052317 WO2010112272A1 (en) 2009-04-02 2010-02-24 Direct overmolding

Publications (3)

Publication Number Publication Date
BRPI1015480A2 true BRPI1015480A2 (pt) 2016-04-26
BRPI1015480B1 BRPI1015480B1 (pt) 2019-12-31
BRPI1015480B8 BRPI1015480B8 (pt) 2020-01-14

Family

ID=40602664

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1015480A BRPI1015480B8 (pt) 2009-04-02 2010-02-24 composição curável, produto curado, e, método para a fabricação de um componente de equipamento de isolamento elétrico

Country Status (13)

Country Link
US (1) US8999433B2 (pt)
EP (1) EP2414444B1 (pt)
JP (1) JP5756082B2 (pt)
KR (1) KR20120042714A (pt)
CN (1) CN102388096B (pt)
AU (1) AU2010230455B2 (pt)
BR (1) BRPI1015480B8 (pt)
ES (1) ES2411462T3 (pt)
PL (1) PL2414444T3 (pt)
RU (1) RU2528845C2 (pt)
SI (1) SI2414444T1 (pt)
TW (1) TWI537298B (pt)
WO (1) WO2010112272A1 (pt)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103059268B (zh) * 2011-10-19 2016-06-08 上海雷博司电气股份有限公司 一种电器绝缘件用环氧树脂材料
EP2863395A4 (en) * 2012-06-13 2016-03-23 Hitachi Ltd INSULATING MATERIAL AND HIGH VOLTAGE DEVICE USING THE SAME
EP2873687B1 (en) * 2013-11-13 2018-06-06 GVK Coating Technology Oy A polymer composition and a method for its preparation
US10011699B2 (en) 2014-08-29 2018-07-03 3M Innovative Properties Company Inductively curable composition
WO2016150724A1 (en) * 2015-03-26 2016-09-29 Huntsman Advanced Materials (Switzerland) Gmbh A thermosetting epoxy resin composition for the preparation of outdoor articles, and the articles obtained therefrom
PL3310838T3 (pl) * 2015-06-16 2022-01-10 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Kompozycja żywicy epoksydowej
RU2598861C1 (ru) * 2015-09-28 2016-09-27 Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) Электроизоляционный заливочный компаунд
US10279519B2 (en) * 2015-12-30 2019-05-07 The United States Of America, As Represented By The Secretary Of The Navy Mold assembly and method of molding a component
EP3430630A1 (en) 2016-03-15 2019-01-23 Huntsman Advanced Materials Licensing (Switzerland) GmbH A process for the preparation of insulation systems for electrical engineering, the articles obtained therefrom and the use thereof
RU2652251C1 (ru) * 2017-08-14 2018-04-25 Акционерное общество "Научно-исследовательский институт полимерных материалов" Эпоксидный состав для исправления дефектов технологической оснастки
CN111433874B (zh) * 2017-12-11 2022-04-12 三菱电机株式会社 消弧用绝缘材料成型体及断路器
US20230229081A1 (en) 2020-06-22 2023-07-20 Huntsman Advanced Materials Licensing (Switzerland)GmbH A photocurable composition
CN116685617A (zh) 2020-12-22 2023-09-01 亨斯迈先进材料许可(瑞士)有限公司 可固化的两部分树脂体系
WO2024083741A1 (en) 2022-10-18 2024-04-25 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Method to avoid cracks in encapsulation of sharp-edged inserts

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JPS5819136B2 (ja) * 1979-03-06 1983-04-16 日東電工株式会社 半導体封止用エポキシ樹脂組成物
US4287115A (en) * 1979-11-13 1981-09-01 The Dow Chemical Company Filler mixtures and thermoset resins containing same
US4632798A (en) * 1983-07-27 1986-12-30 Celanese Corporation Encapsulation of electronic components with anisotropic thermoplastic polymers
US5370921A (en) * 1991-07-11 1994-12-06 The Dexter Corporation Lightning strike composite and process
EP0633286A1 (de) * 1993-07-09 1995-01-11 Ciba-Geigy Ag Härtbare, Füllstoffe enthaltende Epoxidharzzusammensetzung
JPH104270A (ja) * 1996-06-18 1998-01-06 Sumitomo Bakelite Co Ltd 多層プリント配線板の製造方法
HU217112B (hu) 1997-01-21 1999-11-29 Furukawa Electric Institute Of Technology Epoxi-szilikon hibrid gyanta alapú villamos szigetelőkompozíciók
DE50014006D1 (de) 1999-03-16 2007-03-15 Huntsman Adv Mat Switzerland Härtbare zusammensetzung mit besonderer eigenschaftskombination
JP3845534B2 (ja) * 1999-12-01 2006-11-15 株式会社東芝 スイッチギヤ
JP3489025B2 (ja) * 2000-01-14 2004-01-19 大塚化学ホールディングス株式会社 エポキシ樹脂組成物及びそれを用いた電子部品
JP4319332B2 (ja) 2000-06-29 2009-08-26 株式会社東芝 電気絶縁材料およびその製造方法
JP2003068174A (ja) * 2001-08-24 2003-03-07 Mitsubishi Electric Corp 真空バルブ
JP2003203546A (ja) * 2002-01-09 2003-07-18 Toshiba Corp モールド真空開閉器
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CN100578686C (zh) * 2003-04-08 2010-01-06 Abb技术股份公司 制造用于低压、中压和高压技术开关设备的模制件的方法
EP1519389A1 (en) * 2003-09-18 2005-03-30 Rohm And Haas Company Electrically insulative powder coatings and compositions and methods for making them
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JP2008189827A (ja) * 2007-02-06 2008-08-21 Shin Etsu Chem Co Ltd 熱硬化性エポキシ樹脂組成物及び半導体装置
KR20110043738A (ko) * 2008-09-19 2011-04-27 에이비비 리써치 리미티드 에폭시 수지 조성물
JP5182512B2 (ja) * 2008-12-15 2013-04-17 日亜化学工業株式会社 熱硬化性エポキシ樹脂組成物及び半導体装置
EP2454308A1 (en) * 2009-07-14 2012-05-23 ABB Research Ltd. Epoxy resin composition

Also Published As

Publication number Publication date
US8999433B2 (en) 2015-04-07
BRPI1015480B1 (pt) 2019-12-31
KR20120042714A (ko) 2012-05-03
JP2012522854A (ja) 2012-09-27
CN102388096A (zh) 2012-03-21
WO2010112272A1 (en) 2010-10-07
EP2414444A1 (en) 2012-02-08
TW201037003A (en) 2010-10-16
EP2414444B1 (en) 2013-04-17
US20120022184A1 (en) 2012-01-26
RU2011144365A (ru) 2013-05-10
AU2010230455B2 (en) 2015-05-07
ES2411462T3 (es) 2013-07-05
JP5756082B2 (ja) 2015-07-29
CN102388096B (zh) 2014-07-09
RU2528845C2 (ru) 2014-09-20
PL2414444T3 (pl) 2013-09-30
AU2010230455A1 (en) 2011-09-15
BRPI1015480B8 (pt) 2020-01-14
TWI537298B (zh) 2016-06-11
SI2414444T1 (sl) 2013-08-30

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Legal Events

Date Code Title Description
B25A Requested transfer of rights approved

Owner name: HUNTSMAN ADVANCED MATERIALS LICENSING (SWITZERLAND

B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 24/02/2010, OBSERVADAS AS CONDICOES LEGAIS.

B16C Correction of notification of the grant [chapter 16.3 patent gazette]

Free format text: REF. RPI 2556 DE 31/12/2019 QUANTO AO INVENTOR.