BRPI0924849A2 - dispositivo de dissipação de calor e módulo de frequência de rádio com o mesmo - Google Patents

dispositivo de dissipação de calor e módulo de frequência de rádio com o mesmo

Info

Publication number
BRPI0924849A2
BRPI0924849A2 BRPI0924849A BRPI0924849A BRPI0924849A2 BR PI0924849 A2 BRPI0924849 A2 BR PI0924849A2 BR PI0924849 A BRPI0924849 A BR PI0924849A BR PI0924849 A BRPI0924849 A BR PI0924849A BR PI0924849 A2 BRPI0924849 A2 BR PI0924849A2
Authority
BR
Brazil
Prior art keywords
same
heat dissipation
radio frequency
frequency module
dissipation device
Prior art date
Application number
BRPI0924849A
Other languages
English (en)
Inventor
Chen Hongliang
Shi Jian
Feng Taqing
Hong Yuping
Li Zhijian
Original Assignee
Huawei Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Tech Co Ltd filed Critical Huawei Tech Co Ltd
Publication of BRPI0924849A2 publication Critical patent/BRPI0924849A2/pt
Publication of BRPI0924849B1 publication Critical patent/BRPI0924849B1/pt

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Pipeline Systems (AREA)
BRPI0924849A 2009-06-17 2009-06-17 dispositivo de dissipação de calor e módulo de frequência de rádio com o mesmo BRPI0924849B1 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2009/072318 WO2010145074A1 (zh) 2009-06-17 2009-06-17 散热装置和具有散热装置的射频模块

Publications (2)

Publication Number Publication Date
BRPI0924849A2 true BRPI0924849A2 (pt) 2018-10-16
BRPI0924849B1 BRPI0924849B1 (pt) 2019-12-31

Family

ID=43355679

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0924849A BRPI0924849B1 (pt) 2009-06-17 2009-06-17 dispositivo de dissipação de calor e módulo de frequência de rádio com o mesmo

Country Status (5)

Country Link
US (1) US8792240B2 (pt)
EP (1) EP2431701B1 (pt)
CN (1) CN102317732A (pt)
BR (1) BRPI0924849B1 (pt)
WO (1) WO2010145074A1 (pt)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2433480B1 (en) * 2009-05-18 2013-05-01 Huawei Technologies Co., Ltd. Heat spreading device and method therefore
CN102528409B (zh) * 2012-01-05 2014-07-16 华为技术有限公司 重力环路热管散热器、冷凝器及制备方法
GB2498373B (en) * 2012-01-12 2016-08-31 ECONOTHERM UK Ltd Heat exchanger
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
WO2013169774A2 (en) 2012-05-07 2013-11-14 Phononic Devices, Inc. Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
US9337123B2 (en) 2012-07-11 2016-05-10 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal structure for integrated circuit package
EP2703763A1 (en) * 2012-09-03 2014-03-05 ABB Technology AG Evaporator with integrated pre-heater for power electronics cooling
US9013874B2 (en) * 2012-09-12 2015-04-21 Sk Hynix Memory Solutions Inc. Heat dissipation device
US10269676B2 (en) 2012-10-04 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Thermally enhanced package-on-package (PoP)
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
US9593871B2 (en) 2014-07-21 2017-03-14 Phononic Devices, Inc. Systems and methods for operating a thermoelectric module to increase efficiency
CN104133535A (zh) * 2014-07-29 2014-11-05 王杰 Pc主机群液体冷却散热系统
KR101712928B1 (ko) 2014-11-12 2017-03-09 삼성전자주식회사 반도체 패키지
US9578791B1 (en) * 2015-08-17 2017-02-21 Asia Vital Components Co., Ltd. Internal frame structure with heat isolation effect and electronic apparatus with the internal frame structure
US9813082B2 (en) * 2015-10-08 2017-11-07 Futurewei Technologies, Inc. Heat spreader with thermally coductive foam core
CN109565945B (zh) * 2017-03-02 2020-07-28 华为技术有限公司 导热部件和移动终端
CN111578392A (zh) * 2020-04-27 2020-08-25 青岛海尔空调器有限总公司 散热器和空调室外机
CN111578391A (zh) * 2020-04-27 2020-08-25 青岛海尔空调器有限总公司 散热器和空调室外机
JP2023537376A (ja) * 2020-08-07 2023-08-31 華為技術有限公司 ラジエータ、ラジエータの製造方法、及び遠隔無線ユニット

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4087893A (en) * 1974-11-08 1978-05-09 Nippon Gakki Seizo Kabushiki Kaisha Process for producing a heat pipe
GB1597469A (en) * 1977-12-14 1981-09-09 Jackson P A Cooling of a shelter containing a heat source
JPS5936827B2 (ja) * 1979-01-12 1984-09-06 日本電信電話株式会社 集積回路素子の冷却装置
JPS5877278A (ja) 1981-10-31 1983-05-10 松下電工株式会社 アデイテイブ用基材
JPS5877278U (ja) * 1981-11-20 1983-05-25 株式会社 新井組 縦フイン付ヒ−トパイプ
US5087888A (en) * 1990-07-26 1992-02-11 Motorola, Inc. Light weight power amplifier assembled with no hand soldering or screws
US5161090A (en) * 1991-12-13 1992-11-03 Hewlett-Packard Company Heat pipe-electrical interconnect integration for chip modules
US5199165A (en) * 1991-12-13 1993-04-06 Hewlett-Packard Company Heat pipe-electrical interconnect integration method for chip modules
US5253702A (en) * 1992-01-14 1993-10-19 Sun Microsystems, Inc. Integral heat pipe, heat exchanger, and clamping plate
CN2269639Y (zh) 1995-05-09 1997-12-03 郭明 大功率半导体器件的冷却装置
JPH1137678A (ja) * 1997-07-22 1999-02-12 Showa Alum Corp ヒートパイプ式放熱器
TW331586B (en) 1997-08-22 1998-05-11 Biing-Jiun Hwang Network-type heat pipe device
FR2773941B1 (fr) * 1998-01-19 2000-04-21 Ferraz Echangeur di-phasique pour au moins un composant electronique de puissance
US6163073A (en) * 1998-04-17 2000-12-19 International Business Machines Corporation Integrated heatsink and heatpipe
JP2001221584A (ja) * 2000-02-10 2001-08-17 Mitsubishi Electric Corp ループ型ヒートパイプ
US6382309B1 (en) * 2000-05-16 2002-05-07 Swales Aerospace Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction
US6473963B1 (en) * 2000-09-06 2002-11-05 Visteon Global Tech., Inc. Method of making electrical circuit board
US6490159B1 (en) * 2000-09-06 2002-12-03 Visteon Global Tech., Inc. Electrical circuit board and method for making the same
US6437981B1 (en) * 2000-11-30 2002-08-20 Harris Corporation Thermally enhanced microcircuit package and method of forming same
ES2187280B1 (es) * 2001-06-28 2004-08-16 Lear Automotive (Eeds) Spain, S.L. Placa de circuito impreso con substrato metalico aislado con sistema de refrigeracion integrado.
US6452798B1 (en) * 2001-09-12 2002-09-17 Harris Corporation Electronic module including a cooling substrate having a fluid cooling circuit therein and related methods
KR100505279B1 (ko) * 2003-05-31 2005-07-29 아이큐리랩 홀딩스 리미티드 드라이 아웃이 방지된 박판형 냉각장치
TW591984B (en) * 2003-07-04 2004-06-11 Sentelic Corp Micro-circulating flow channel system and its manufacturing method
JP2005078966A (ja) * 2003-09-01 2005-03-24 Seiko Epson Corp 光源装置、光源装置の製造方法、投射型表示装置
US20050056036A1 (en) * 2003-09-17 2005-03-17 Superconductor Technologies, Inc. Integrated cryogenic receiver front-end
JP2005201539A (ja) 2004-01-15 2005-07-28 Fujine Sangyo:Kk 熱サイフォン型熱移動体
US7342788B2 (en) * 2004-03-12 2008-03-11 Powerwave Technologies, Inc. RF power amplifier assembly with heat pipe enhanced pallet
JP4714434B2 (ja) * 2004-07-20 2011-06-29 古河スカイ株式会社 ヒートパイプヒートシンク
US7215547B2 (en) * 2004-08-16 2007-05-08 Delphi Technologies, Inc. Integrated cooling system for electronic devices
US7848624B1 (en) * 2004-10-25 2010-12-07 Alliant Techsystems Inc. Evaporator for use in a heat transfer system
CN2784853Y (zh) * 2004-12-29 2006-05-31 鸿富锦精密工业(深圳)有限公司 热管
CN1845322A (zh) * 2005-04-07 2006-10-11 神基科技股份有限公司 一种散热导管结构及其制作方法
US7352580B2 (en) * 2006-02-14 2008-04-01 Hua-Hsin Tsai CPU cooler
TWI325047B (en) * 2006-09-29 2010-05-21 Delta Electronics Inc Heat pipe and manufacturing method thereof
JP2008269353A (ja) * 2007-04-20 2008-11-06 Toshiba Corp 電子機器
JP4892403B2 (ja) * 2007-05-15 2012-03-07 昭和電工株式会社 ヒートパイプ式放熱装置
TWI413887B (zh) * 2008-01-07 2013-11-01 Compal Electronics Inc 熱管結構
CN101270961A (zh) * 2008-05-15 2008-09-24 中山大学 一种环路热管冷凝器
CN101655328A (zh) * 2008-08-19 2010-02-24 何昆耀 平板式回路热导装置及其制造方法
KR101070842B1 (ko) * 2009-06-11 2011-10-06 주식회사 자온지 방열장치 및 이를 구비한 전자장치
TWI381144B (zh) * 2009-07-31 2013-01-01 燒結式熱管、其製造方法以及其溝槽導管的製造方法

Also Published As

Publication number Publication date
US20120087090A1 (en) 2012-04-12
US8792240B2 (en) 2014-07-29
BRPI0924849B1 (pt) 2019-12-31
EP2431701A1 (en) 2012-03-21
CN102317732A (zh) 2012-01-11
WO2010145074A1 (zh) 2010-12-23
EP2431701A4 (en) 2012-04-04
EP2431701B1 (en) 2017-04-26

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according art. 34 industrial property law
B06T Formal requirements before examination
B09A Decision: intention to grant
B16A Patent or certificate of addition of invention granted

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 31/12/2019, OBSERVADAS AS CONDICOES LEGAIS.