BRPI0416519A - composição oligomérica lìquida, produto polimerizado curado, método para fabricar e para usar uma composição oligomérica lìquida, e, substrato - Google Patents

composição oligomérica lìquida, produto polimerizado curado, método para fabricar e para usar uma composição oligomérica lìquida, e, substrato

Info

Publication number
BRPI0416519A
BRPI0416519A BRPI0416519-5A BRPI0416519A BRPI0416519A BR PI0416519 A BRPI0416519 A BR PI0416519A BR PI0416519 A BRPI0416519 A BR PI0416519A BR PI0416519 A BRPI0416519 A BR PI0416519A
Authority
BR
Brazil
Prior art keywords
oligomeric composition
liquid oligomeric
liquid
substrate
composition
Prior art date
Application number
BRPI0416519-5A
Other languages
English (en)
Portuguese (pt)
Inventor
Laurence G Dammann
Robert B Fechter
Sridevi Narayan-Sarathy
Original Assignee
Ashland Licensing & Intellectu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/712,044 external-priority patent/US7041749B2/en
Application filed by Ashland Licensing & Intellectu filed Critical Ashland Licensing & Intellectu
Publication of BRPI0416519A publication Critical patent/BRPI0416519A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G16/00—Condensation polymers of aldehydes or ketones with monomers not provided for in the groups C08G4/00 - C08G14/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/103—Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/10—Definition of the polymer structure
    • C08G2261/13—Morphological aspects
    • C08G2261/135—Cross-linked structures
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/33—Monomer units or repeat units incorporating structural elements in the main chain incorporating non-aromatic structural elements in the main chain
    • C08G2261/334—Monomer units or repeat units incorporating structural elements in the main chain incorporating non-aromatic structural elements in the main chain containing heteroatoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/70—Post-treatment
    • C08G2261/76—Post-treatment crosslinking

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
BRPI0416519-5A 2003-11-14 2004-11-12 composição oligomérica lìquida, produto polimerizado curado, método para fabricar e para usar uma composição oligomérica lìquida, e, substrato BRPI0416519A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/712,044 US7041749B2 (en) 2002-12-17 2003-11-14 Dual cure reaction products of self-photoinitiating multifunction acrylates with cycloaliphatic epoxy compounds
PCT/US2004/037807 WO2005048866A2 (fr) 2003-11-14 2004-11-12 Produits reactionnels a double durcissement a base d'acrylates multifonctionnels a photo-initiation spontanee comprenant des composes epoxydiques cycloaliphatiques

Publications (1)

Publication Number Publication Date
BRPI0416519A true BRPI0416519A (pt) 2007-03-06

Family

ID=34619849

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0416519-5A BRPI0416519A (pt) 2003-11-14 2004-11-12 composição oligomérica lìquida, produto polimerizado curado, método para fabricar e para usar uma composição oligomérica lìquida, e, substrato

Country Status (7)

Country Link
EP (1) EP1685193A4 (fr)
JP (1) JP2007511641A (fr)
KR (1) KR20070097294A (fr)
CN (1) CN1910234A (fr)
BR (1) BRPI0416519A (fr)
CA (1) CA2545998A1 (fr)
WO (1) WO2005048866A2 (fr)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4888766B2 (ja) * 2006-07-11 2012-02-29 日東電工株式会社 多官能化合物の製造方法
GB0700960D0 (en) * 2007-01-18 2007-02-28 3M Innovative Properties Co High strength epoxy adhesive and uses thereof
CN102159534B (zh) 2008-07-23 2014-05-07 3M创新有限公司 反应性液体改性剂
WO2010011710A2 (fr) 2008-07-23 2010-01-28 3M Innovative Properties Company Adhésifs structurels à base d'époxy en deux parties
JP5676444B2 (ja) 2008-07-23 2015-02-25 スリーエム イノベイティブ プロパティズ カンパニー 二液型エポキシ系構造接着剤
CN102311520A (zh) * 2011-08-05 2012-01-11 大连方盛塑料有限公司 一种热塑性塑料
KR102131463B1 (ko) 2011-10-07 2020-07-08 알넥스 네덜란드 비. 브이. 가교성 조성물
ES2802811T3 (es) * 2012-03-05 2021-01-21 Archer Daniels Midland Co Uso de microemulsiones como sistemas de administración
JP6183642B2 (ja) 2012-08-10 2017-08-23 株式会社リコー 活性光線硬化組成物、並びにこれを用いた活性光線硬化型インクジェット印刷用インク組成物及び活性光線硬化型接着剤組成物
EP2984133B1 (fr) 2013-04-08 2018-03-28 Allnex Netherlands B.V. Composition réticulable par réaction d'addition de michael réelle (rma)
WO2016050398A1 (fr) * 2014-10-01 2016-04-07 Basf Se Procédé pour faire durcir des compositions durcissables
WO2016166334A1 (fr) 2015-04-17 2016-10-20 Nuplex Resins B.V. Procédé de production d'une composition réticulable
AU2016247589B2 (en) 2015-04-17 2020-10-29 Allnex Netherlands B.V. Floor coating compositions
JP2018514614A (ja) * 2015-04-17 2018-06-07 オールネックス・ネザーランズ・ビー．ブイ．Ａｌｌｎｅｘ Ｎｅｔｈｅｒｌａｎｄｓ Ｂ．Ｖ． 真マイケル付加架橋性組成物のための接着促進剤
RU2721703C2 (ru) 2015-04-17 2020-05-21 Аллнекс Незерландс Б.В. Rma-сшиваемые композиции и rma-сшиваемые смолы для получения покрытий, легко поддающихся очистке
EP3115381A1 (fr) * 2015-07-10 2017-01-11 Université de Haute Alsace Système de polymérisation par addition de michael à double clic et photopolymérisation
CN105082669B (zh) * 2015-09-23 2016-09-28 李会录 一种环氧玻纤布覆铜板的生产方法
RU2725037C2 (ru) * 2016-02-26 2020-06-29 Амкор Флексибль Селеста Сас Гибкие упаковочные субстраты, содержащие термостойкие отпечатки
KR102065717B1 (ko) * 2016-12-26 2020-01-13 주식회사 엘지화학 편광자 보호 필름, 이를 포함하는 편광판, 상기 편광판을 포함하는 액정 디스플레이 장치, 및 편광자 보호 필름용 코팅 조성물
CN108641550A (zh) * 2018-05-25 2018-10-12 广州惠利电子材料有限公司 一种阳离子uv固化绝缘保护胶及其制备方法和应用
US20220056171A1 (en) * 2018-12-18 2022-02-24 Arxada Ag Isocyanate Free Binder
CN112552483B (zh) * 2020-11-16 2023-06-30 新丰见微化工实业有限公司 一种自感光环氧甲基丙烯酸酯树脂及其合成方法
WO2024064659A1 (fr) * 2022-09-20 2024-03-28 Ppg Industries Ohio, Inc. Système de revêtement multicouches

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* Cited by examiner, † Cited by third party
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US5218018A (en) * 1989-12-29 1993-06-08 Kansai Paint Co., Ltd. Hydroxyl and carboxyl groups-containing resin with alicyclic polyepoxide
JPH0748472A (ja) * 1993-08-06 1995-02-21 Mitsubishi Rayon Co Ltd 架橋剤
DE69407921T2 (de) * 1993-10-22 1998-04-30 Eastman Chem Co Auf Polyolester der 2-Acetylglutarsäure basierte Vernetzungsmittel
AU672337B2 (en) * 1993-10-27 1996-09-26 Nippon Paint Co., Ltd. Curable resin composition for coating uses
US6025410A (en) * 1997-09-19 2000-02-15 Ashland Inc. Liquid oligomers containing acrylate unsaturation
US5945489A (en) * 1997-09-19 1999-08-31 Ashland, Inc. Liquid oligomers containing unsaturation
JPH1192546A (ja) * 1997-09-22 1999-04-06 Toyo Ink Mfg Co Ltd 硬化性樹脂組成物
GB2332202A (en) * 1997-12-09 1999-06-16 Courtaulds Coatings Curable epoxy resin compositions
CA2378938A1 (fr) * 2001-03-27 2002-09-27 Takashi Irie Revetement thermodurcissable, et methode de formation de pellicule protectrice avec ce revetement
TWI329105B (en) * 2002-02-01 2010-08-21 Rigel Pharmaceuticals Inc 2,4-pyrimidinediamine compounds and their uses
US6706414B1 (en) * 2002-09-26 2004-03-16 Ashland Inc. Liquid uncrosslinked Michael addition oligomers prepared in the presence of a catalyst having both an epoxy moiety and a quaternary salt
JP2005041923A (ja) * 2003-07-23 2005-02-17 Dainippon Ink & Chem Inc 紫外線硬化型組成物
US7169825B2 (en) * 2003-07-29 2007-01-30 Ashland Licensing And Intellectual Property Llc Dual cure reaction products of self-photoinitiating multifunctional acrylates with thiols and synthetic methods

Also Published As

Publication number Publication date
EP1685193A4 (fr) 2006-12-13
JP2007511641A (ja) 2007-05-10
EP1685193A2 (fr) 2006-08-02
WO2005048866A2 (fr) 2005-06-02
WO2005048866A3 (fr) 2005-09-15
KR20070097294A (ko) 2007-10-04
CA2545998A1 (fr) 2005-06-02
CN1910234A (zh) 2007-02-07

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 6A E 7A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2158 DE 15/05/2012.