BRPI0416000B1 - METHOD FOR PRODUCING AN EVAPORATOR - Google Patents

Abstract

"method for producing an evaporator". One method for producing an evaporator includes orienting a vapor barrier wall, orienting a liquid barrier wall and positioning a wick between the vapor barrier wall. the vapor barrier wall is oriented such that a heat absorbing surface of the vapor barrier wall defines at least a portion of an external evaporator surface. The outer surface is configured to receive heat. The liquid barrier wall is oriented adjacent to the vapor barrier wall. The liquid barrier wall has a surface configured to confine liquid. A vapor removal channel is defined at an interface between the wick and the vapor barrier wall. A liquid flow channel is defined between the liquid barrier wall and the primary wick.

Description

“METHOD TO PRODUCE AN EVAPORATOR” REFERENCE TO RELATED REQUESTS

This order claims the benefit of US Provisional Order 60 / 514,670, filed on October 28, 2003. This order is a partial continuation of US Order 10 / 676,265, filed on October 2, 2003, which claimed priority for US Order 60 /415,424, filed on October 2, 2002. This order is also a partial continuation of US Order 10 / 694,387, filed on October 28, 2003, which claimed priority for Provisional Order US 60 / 421,737, filed on October 28 2002. This order is also a partial continuation of US Order 10 / 602.022, filed on June 24, 2003, which claims the benefit of US Provisional Order 60 / 391.006, filed on June 24, 2002 and is a partial continuation of US Application 09 / 896,561, filed on 6/29/01, which claims the benefit of US Provisional Order 60 / 215,588, filed on 6/30/2000. All of these requests are incorporated by reference here.

TECHNICAL FIELD

This description refers to heat transfer systems and methods of manufacturing heat transfer systems.

BACKGROUND OF THE INVENTION

Heat transfer systems are used to transport heat from one location (the heat source) to another location (the heat sink). Heat transfer systems can be used in terrestrial or extraterrestrial applications. For example, heat transfer systems can be integrated by satellite equipment, which operates within zero or low gravity environments. As another example, heat transfer systems can be used in electronic equipment, which often requires cooling during operation.

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Closed circuit heating tubes (LHPs) and capillary pumped closed circuits (CPLs) are passive two-phase heat transfer systems. Each includes an evaporator thermally coupled to the heat source, a thermally condenser 5 coupled to the heat sink, fluid flowing between the evaporator and the condenser, and a fluid reservoir for expanding the fluid. The fluid within the heat transfer system can be referred to as the working fluid. The evaporator includes a primary wick and a core that includes a fluid flow passage. The heat acquired by the evaporator is transported to and discharged by the condenser. These systems use capillary pressure developed in a fine pore lock inside the evaporator, to promote the circulation of the working fluid from the evaporator to the condenser and back to the evaporator. The primary distinguishing feature between an LHP and a CPL is the location of the circuit reservoir, which is used to store excess fluid displaced from the circuit during operation. In general, a CPL reservoir is located remotely from the evaporator, while an LHP reservoir is co-located with the evaporator.

SUMMARY

In a general aspect, a method for producing an evaporator includes orienting a vapor barrier wall and positioning a wick between the vapor barrier wall and the liquid barrier wall. The vapor barrier wall is oriented so that a heat absorbing surface of the vapor barrier wall defines at least a part of an outer surface of the evaporator. The outer surface is configured to receive heat. The liquid barrier wall is oriented adjacent the vapor barrier wall. The liquid barrier wall has a surface configured to contain liquid. At least one of orienting a vapor barrier wall, orienting a liquid barrier wall and positioning the wick includes defining a vapor removal channel at an interface between the wick and the vapor barrier wall. At least one of orienting a vapor barrier wall, orienting a liquid barrier wall and positioning the wick includes defining a liquid flow channel between the liquid barrier wall and the primary wick.

Implementations can include one or more of the following aspects. For example, the method may also include forming the vapor barrier wall and forming the liquid barrier wall. Forming the vapor barrier wall can include forming the vapor barrier wall in a planar shape and forming the liquid barrier wall can include forming the liquid barrier wall within a planar shape. Forming the vapor barrier wall can include forming the vapor barrier wall in an annular shape and forming the liquid barrier wall can include forming the liquid barrier wall in an annular shape.

Positioning the wick may include heat contracting the wick on the vapor barrier wall. Positioning the wick can include contracting the liquid barrier wall of the wick by heat.

Positioning may include positioning the wick between the vapor barrier wall and the liquid containment surface of the liquid barrier wall.

The method may also include orienting a sub-cooler adjacent to the liquid barrier wall. Orienting the sub-chiller may include heat-contracting the sub-chiller over the liquid barrier wall.

The method may include electrochemically attacking, machining or photochemically attacking the vapor removal channel within the vapor barrier wall. The method may include embedding the vapor removal channel within the wick.

The method may also include forming the vapor barrier wall by wrapping a vapor barrier material in a cylindrical shape and sealing the joining edges of the vapor barrier material. The method may include forming the liquid barrier wall by wrapping a liquid barrier material in a cylindrical shape and sealing the joining edges of the liquid barrier material.

Orienting the liquid barrier wall may include heat contracting the liquid barrier wall.

The method may include forming the liquid barrier wall and photochemically attacking the liquid flow channel within the liquid barrier wall.

In another general aspect, a method for producing an evaporator includes orienting a liquid barrier wall having an annular shape, orienting a vapor barrier wall having an annular shape coaxially with the liquid barrier wall and positioning a wick between the wall of the liquid barrier and the vapor barrier wall, the wick being coaxial with the liquid barrier wall.

Implementations can include one or more of the following aspects. For example, the method may include forming the vapor barrier wall and forming the liquid barrier wall.

Positioning the wick may include contracting the wick on the vapor barrier wall by heat. Positioning the wick may include heat contracting the liquid barrier wall on the wick. Positioning may include placing the wick between the vapor barrier wall and a liquid confinement surface of the liquid barrier wall.

The method may include orienting a sub-cooler adjacent to the liquid barrier wall. Orienting the sub-chiller may include heat shrinking the sub-chiller on the liquid barrier wall.

The method may include electrochemically attacking, machining or photochemically attacking the vapor removal channel within the vapor barrier wall. The method may include embedding the vapor removal channel within the wick.

The method may include forming the vapor barrier wall by wrapping a vapor barrier material in a cylindrical shape and sealing the joining edges of the vapor barrier material. The method may further include forming the liquid barrier wall by wrapping a liquid barrier material in a cylindrical shape and sealing the joining edges of the liquid barrier material.

Orienting the liquid barrier wall may include heat contracting the liquid barrier wall.

Other aspects and advantages will be evident from the description, drawings and claims.

DESCRIPTION OF THE DRAWINGS

Fig. 1 is a schematic diagram of a heat transport system.

Fig. 2 is a diagram of an implementation of the heat transport system, schematically shown by Fig. 1.

Fig. 3 is a flow chart of a procedure for transporting heat, employing a heat transport system.

Fig. 4 is a graph showing the temperature profiles of the various components of the heat transport system, during the process flow of Fig. 3.

Fig. 5A is a diagram of a three-hole main evaporator, shown inside the heat transport system of Fig. 1.

Fig. 5B is a cross-sectional view of the main evaporator, taken along 5B-5B of Fig. 5A.

Fig. 6 is a diagram of a four-hole main evaporator, which can be integrated into a heat transport system illustrated by Fig. 1.

Fig. 7 is a schematic diagram of an implementation of a heat transport system.

Figs. 8A, 8B, 9A and 9B are seen in perspective of applications employing a heat transport system. .

Fig. 8C is a cross-sectional view of a fluid line, taken along 8C-8C of Fig. 8A.

Figs. 8D and 9C are schematic diagrams of the implementations of the heat transport systems of Figs. 8A and 9A, respectively.

Fig. 10 is a cross-sectional view of a planar evaporator.

Fig. 11 is an axial cross-sectional view of an annular evaporator.

Fig. 12 is a radial cross section of the annular evaporator of Fig. 11.

Fig. 13 is an enlarged view of part of the radial cross-sectional view of the annular evaporator of Fig. 12.

Fig. 14A is a perspective view of the annular evaporator of Fig. 11.

Fig. 14B is an enlarged cross-sectional view of part of the annular evaporator of Fig. 14B.

Fig. 14D is a cross-sectional view of the annular evaporator of Fig. 14B, taken along line 14D-14D.

Figs. 14E and 14F are enlarged views of parts of the annular evaporator of Fig. 14D.

Fig. 14G is a cut-away perspective view of the annular evaporator of Fig. 14A.

Fig. 14H is a cut-away perspective view of the annular evaporator of Fig. 14G.

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Fig. 15Η is a detailed plan view of the vapor barrier wall formed in a wrap ring component of the annular evaporator of Fig. 14A.

Fig. 15B is a cross-sectional view of the wall of. 5 vapor barrier of Fig. 15A, taken along line 15B-15B.

Fig. 16A is a perspective view of a primary wick of the annular evaporator of Fig. 14A.

Fig. 16B is a top view of the primary wick of Fig. 16 A.

Fig. 16C is a cross-sectional view of the primary wick of Fig. 16B, taken along line 16C-16C.

Fig. 16D is an enlarged view of part of the primary wick of Fig. 16C.

Fig. 17A is a perspective view of a liquid barrier wall 15 formed within an annular ring of the annular evaporator of Fig. 14A.

Fig. 17B is a top view of the vapor barrier wall of Fig. 17A.

Fig. 17C is a cross-sectional view of the vapor barrier wall of Fig. 17B, taken along line 17C-17C.

Fig. 17D is an enlarged view of part of the vapor barrier wall of Fig. 17C.

Fig. 1SA is a perspective view of a ring separating the liquid barrier wall of Fig. 17A from the vapor barrier wall of Fig. 15 A.

Fig. 18B is a top view of Fig. 18A.

Fig. 18C is a cross-sectional view of the ring in Fig. 18B, taken along line 18C-18C.

Fig. 18D is an enlarged view of part of the ring of Fig.

18C.

Fig. 19A is a perspective view of a ring of the annular evaporator of Fig. 14A.

Fig. 19B is a top view of the ring of Fig. 19A.

. 5 Fig. 19C is a cross-sectional view of the ring of Fig.

19B, taken over 19C-19C.

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Fig. 19D is an enlarged view of part of the ring of Fig. 19C.

Fig. 20 is a perspective view of a cyclic heat exchange system 10, which can be cooled using a heat transfer system.

Fig. 21 is a cross-sectional view of a cyclic heat exchange system, such as the cyclic heat exchange system of Fig. 20.

Fig. 22 is a side view of a cyclic heat exchange system 15, such as the cyclic heat exchange system of Fig. 20.

Fig. 23 is a schematic diagram of a first implementation of a thermodynamic system including a cyclic heat exchange system and a heat transfer system.

Fig. 24 is a schematic diagram of a second implementation of a thermodynamic system, including a cyclic heat exchange system and a heat transfer system.

Fig. 25 is a schematic diagram of a heat transfer system employing an evaporator designed in accordance with the principles of Figs. 10-13.

Fig. 26 is a functional exploded view of the heat transfer system of Fig. 25.

Fig. 27 is a detailed partial cross-sectional view of an evaporator used in the heat transfer system of Fig. 25.

Fig. 28 is a perspective view of a heat exchanger used in the heat transfer system of Fig. 25.

Fig. 29 is a temperature graph of a heat source from a cyclic heat exchange system versus a surface area of an interface between the heat transfer system and the heat source of the. 5 cyclic heat exchange system.

Fig. 30 is a top plan view of a heat transfer system packaged around part of a cyclic heat exchange system.

Fig. 31 is an elevation view in partial cross-section 10 (taken along line 31-31) of the heat transfer system packaged around the part of the cyclic heat exchange system of Fig. 30.

Fig. 32 is an elevation view in partial cross section (taken in detail 3200) of the interface between the heat transfer system 15 and the cyclic heat exchange system of Fig. 30.

Fig. 33 is a top perspective view of a heat transfer system mounted on a cyclic heat exchange system.

Fig. 34 is a bottom perspective view of the heat transfer system mounted on the cyclic heat exchange system of Fig. 33.

Fig. 35 is a partial cross-sectional view of an interface between an evaporator from a heat transfer system and a cyclic heat exchange system, in which the evaporator is clamped to the cyclic heat exchange system.

Fig. 36 is a side view of a clamp used to secure the evaporator to the cyclic heat exchange system of Fig. 35.

Fig. 37 is a partial cross-sectional view of an interface between an evaporator in a heat transfer system and a cyclic heat exchange system, in which the interface is formed by an interference fit between the evaporator and the system. of cyclic heat exchange.

Fig. 38 is a partial cross-sectional view of an interface between an evaporator from a heat transfer system and a cyclic heat exchange system, where the interface is formed by molding the evaporator entirely with the exchange system. of cyclic heat.

Fig. 39 is a top plan view of a condenser in a heat transfer system.

Fig. 40 is a partial cross-sectional view, taken along line 40-40 of the condenser in Fig. 39.

Figs. 41-43 are detailed cross-sectional views of a capacitor having a laminated construction.

Fig. 44 is a detailed cross-sectional view of a capacitor having an extruded construction.

Fig. 45 is a detailed cross-sectional perspective view of a condenser having an extruded construction.

Fig. 46 is a cross-sectional view on one side of a heat transfer system packaged around a cyclic heat exchange system.

Fig. 47 is a perspective view of a thermodynamic system that includes a cyclic heat exchange system and a heat transfer system.

Fig. 48 is a schematic diagram of a part of the heat transfer system of Fig. 47.

Fig. 49 is a perspective view of part of the heat transfer system of Fig. 47.

Fig. 50 is a side perspective view of the thermodynamic system of Fig. 47.

Fig. 51 is a schematic diagram of a part of the thermodynamic system of Fig. 47.

Fig. 52 is a perspective view of the thermodynamic system of Fig. 47.

Fig. 53A is a perspective view of a wick subassembly, which is part of an evaporator of the heat transfer system of Fig. 47.

Fig. 53B is a perspective view of a part of the wick subassembly of Fig. 53A.

Fig. 53C is a perspective view of a liquid barrier wall, which is part of the evaporator of the heat transfer system of Fig. 47.

Fig. 53D is a perspective view of a sub-chiller, which is part of the evaporator of the heat transfer system of Fig. 47.

Fig. 53E is a perspective view of the evaporator of the heat transfer system of Fig. 47.

Fig. 54 is a flow chart of a procedure for manufacturing the thermodynamic system of Fig. 47, including a procedure for manufacturing the heat transport system of Fig. 47.

Fig. 55 is a flow chart of a procedure for preparing the wick subassembly of Figs. 53A and B.

Fig. 56A - 56B are seen in perspective showing steps in the procedure of Fig. 55.

Fig. 57 is a flow chart of a procedure for preparing the liquid barrier wall of Fig. 53C.

Figs. 58A-58E are seen in perspective showing steps in the procedure in Fig. 57.

Fig. 59 is a flow chart of a procedure for preparing an external subassembly of the evaporator of the heat transfer system of Fig. 47.

Figs. 60A - 60B are seen in perspective showing the steps of the procedure in Fig. 59.

Fig. 61 is a flowchart of a procedure for joining the external subassembly with the evaporator wick subassembly of the heat transfer system of Fig. 47.

Fig. 62A - 62E are seen in perspective showing steps of the procedure in Fig. 61..

Fig. 63 is a flow chart of a procedure for completing an evaporator body formed during the procedure of Fig. 61.

Fig. 64A is a side cross-sectional view of the evaporator body, showing the steps of the procedure in Fig. 63.

Fig. 65 is a flow chart of a procedure for coupling the finished evaporator, during the procedure of Fig. 63, to the cyclic heat exchange system of Fig. 47.

Figs. 66A and 66B are seen in perspective showing steps in the procedure in Fig. 65.

Same reference symbols in the various drawings indicate similar elements.

DETAILED DESCRIPTION

As discussed above, in a closed circuit heating pipe (LHP) system the reservoir is co-located with the evaporator, the reservoir being thermally and hydraulically connected with the reservoir, through a conduit similar to the heating pipe. In this way, the liquid from the reservoir can be pumped into the evaporator, thus ensuring that the primary wick of the evaporator is sufficiently moistened or “primed” during startup. In addition, the LHP design also reduces the depletion of liquid from the primary wick of the evaporator during operation in constant or transient state of the evaporator within a heat transport system. In addition, steam and / or non-condensable gas bubbles (NCG bubbles) seep from an evaporator core through the heating tube-like conduit into the reservoir.

Conventional LHPs require that liquid be present in the reservoir before departure, that is, the application of energy to the LHP evaporator. However, if the LHP's working fluid is in a state. 5 supercritical before the start of the LHP, the liquid will not be present in the reservoir before the start. A supercritical state is a state in which an LHP temperature is above the critical temperature of the working fluid. The critical temperature of a fluid is the highest temperature at which the fluid can exhibit a liquid-vapor balance. For example, LHP may be in a supercritical state if the working fluid is a cryogenic fluid, that is,

---- a fluid having a boiling point below -150 ° C or if the working fluid is in a sub-environmental fluid, that is, a fluid having a boiling point below the temperature of the environment in which the LHP is operating .

Conventional LHPs also require the liquid 15 returning to the evaporator to be sub-refrigerated, that is, cooled to a temperature that is lower than that of the boiling point of the working fluid. Such a restriction makes it impractical to operate LHPs at a sub-environmental temperature. For example, if the working fluid is in a cryogenic fluid, the LHP is probably operating in an environment having a temperature greater than the fluid's boiling point.

With reference to Fig. 1, a heat transport system 100 is designed to overcome limitations of conventional LHPs. The heat transport system 100 includes a heat transfer system 105 and a priming system 110. The priming system 110 is configured to convert fluid within the heat transfer system 105 into a liquid, thus priming the heat transfer system. heat transfer 105. As used in this description, the term "fluid" is a generic term, which refers to a substance that is both a liquid and a vapor in saturated equilibrium.

The heat transfer system 105 includes a main evaporator 115 and a condenser 120 coupled to the main evaporator 115 by a liquid line 125 and a steam line 130. The condenser 120 is in thermal communication with a heat sink 165, and the evaporator . Main 5 115 is in thermal communication with a Qin 116 heat source.

The system 105 may also include a high pressure reservoir 147, coupled to the steam line 130, for additional pressure containment, as required. In particular, the high pressure reservoir 147 increases the volume of the system 100. If the working fluid is at a temperature above its critical temperature, that is, the highest temperature at which the working fluid can exhibit liquid-vapor balance , its pressure is proportional to the mass of the system 100 (the load) and inversely proportional to the volume of the system. Increasing the volume with the high pressure reservoir 147 decreases the loading pressure.

The main evaporator 115 includes a container 117 that houses a primary wick 140, within which a core 135 is defined. Main evaporator 115 includes a bayonet tube 142 and a secondary wick 145 within core 135. Bayonet tube 142, primary wick 140 and secondary wick 145 define a liquid passage 143, a first vapor passage 144 and a second passage of vapor 146. Secondary wick 145 provides phase control, that is, liquid / vapor separation within core 135, as examined in Order US 09 / 896,561, deposited on 6/29/01, which is incorporated herein by reference in its wholeness. As shown, main evaporator 115 has three orifices, a liquid inlet 137 into the liquid passage 143, a vapor outlet 132 into the steam line 130 of the second vapor passage 146 and a fluid outlet 139 of the passage of liquid 143 (and possibly the first vapor pass 144, as examined). More details on the structure of a three-hole evaporator are examined below, with reference to Figs. 5A and 5B.

Priming system 110 includes a secondary evaporator or primer 150 coupled to steam line 130 and a reservoir 155 co-located with secondary evaporator 150. Reservoir 155 is coupled to core 135 of main evaporator 115 by a secondary fluid line 160 and a secondary condenser 122. Secondary fluid line 160 is coupled to fluid outlet 139 of main evaporator 115. Priming system 110 also includes a controlled heat source Qsp 151 in thermal communication with secondary evaporator 150.

The secondary evaporator 150 includes a container 152, which houses a primary wick 190, within which a core 185 is defined. Secondary evaporator 150 includes a bayonet tube 153 and a secondary wick 180, which extends from core 185 through conduit 175 and into reservoir 155. Secondary wick 180 provides a capillary connection between reservoir 155 and secondary evaporator 150 Bayonet tube 153, primary wick 190 and secondary wick 180 define a liquid passage 182 coupled to the fluid line 160, a first vapor passage 181 coupled to the reservoir 155 and a second vapor passage 183 coupled to the vapor line 130. Reservoir 155 is thermally and hydraulically coupled to the core 185 of the secondary evaporator 150 through the liquid passage 182, the secondary wick 180 and the first vapor passage 181.0 steam and / or the NCG bubbles of the core 185 of the secondary evaporator 150 are swept, through the first steam passage 181, to the reservoir 155 and the condensable liquid is returned to the secondary evaporator 150, through s of the secondary wick 180 of the reservoir 155. The primary wick 190 hydraulically links the liquid inside the core 185 with the heat source Qsp 151, allowing liquid from an external surface of the primary wick 190 to evaporate and form steam within the second passage of steam 183, when heat is applied to the secondary evaporator

150.

The reservoir 155 is cold-ordered and thus is cooled by a cooling source that allows it to operate, if not heated, at a temperature that is less than the temperature at which the heat transfer system 105 operates. In one implementation, reservoir 155 and secondary capacitor 122 are in thermal communication with heat sink 165, which is thermally coupled with capacitor 120. For example, reservoir 155 can be mounted on heat sink 165 using a branch 170 , which can be made of aluminum or any heat conductive material. In this way, the temperature of the reservoir 155 tracks the temperature of the condenser 120.

Fig. 2 shows an example of an implementation of the heat transport system 100. In this implementation, condensers 120 and 122 are mounted on a cryocooler 200, which acts as a refrigerator, transferring heat from condensers 120, 122 to the heat sink 165. Additionally, in the implementation of Fig. 2, lines 125, 130, 160 are rolled up to reduce the space requirements for heat transport system 100.

Although not shown in Figs. 1 and 2, elements such as, for example, reservoir 155 and main evaporator 115 can be equipped with temperature sensors, which can be used for diagnostic or testing purposes.

Referring also to Fig. 3, the system 100 performs a procedure 300 to transport heat from the heat source Qin 116 and to ensure that the main evaporator 115 is moistened with liquid before starting. Procedure 300 is particularly useful when the heat transfer system 105 is in a supercritical state. Prior to the start of procedure 300, system 100 is charged with a working fluid at a particular pressure, referred to as "charge pressure".

Initially, reservoir 155 is cold ordered, for example, by mounting reservoir 155 on thermal sink 165 (step 305). Reservoir 155 can be ordered cold at a temperature below the critical temperature of the working fluid which, as examined, is a. 5 highest temperature at which the working fluid can exhibit liquid-vapor balance. For example, if the fluid is ethane, which has a critical temperature of 33 ° C, reservoir 155 is cooled to below 33 ° C. When the temperature of the reservoir 155 falls below the critical temperature of the working fluid, the reservoir 155 partially fills with a liquid condensate formed by the working fluid. The formation of the liquid inside the reservoir 155 moistens the secondary wick 180 and the primary wick 190 of the secondary evaporator 150 (step 310).

In the meantime, energy is applied to the priming system 110, applying heat from the heat source Qsp 151 to the secondary evaporator 150 15 (step 315), to increase or start the circulation of fluid within the heat transfer system 105. A steam output through the secondary evaporator 150 is pumped through the steam line 130 and through the condenser 120 (step 320), due to the capillary pressure at the interface between the primary wick 190 and the second steam passage 183. When the steam reaches the condenser 20 120, it is converted to liquid (step 325). The liquid formed in the condenser 120 is pumped to the main evaporator 115 of the heat transport system 105 (step 330). When the main evaporator 115 is at a higher temperature than the critical temperature of the fluid, the liquid entering the main evaporator 115 evaporates and cools the main evaporator 115. This process (steps 315-330) continues, causing the main evaporator 115 reaches a set point temperature (step 335), at which point the main evaporator is capable of holding liquid and being moistened and operating like a capillary pump. In one implementation, the setpoint temperature is the temperature at which reservoir 155 has been cooled. In another implementation, the setpoint temperature is a temperature below the critical working fluid temperature. In another implementation, the setpoint temperature is a temperature above the temperature at which reservoir 155 has been cooled.

If the setpoint temperature has been reached (step 335), system 100 operates in a main mode (step 340), in which heat from the heat source Qin 116, which is applied to main evaporator 115, is transferred through the system heat transfer 105. Specifically, in the main mode, the main evaporator 115 develops capillary pumping to promote circulation of the working fluid through the heat transfer system 105. In addition, in the main mode, the setpoint temperature of the reservoir 155 is reduced. The rate at which the heat transport system 105 cools during the main mode depends on the cold demand of the reservoir 155, because the temperature of the main evaporator 115 strictly follows the temperature of the reservoir 155. Additionally, although not necessary, a heater can be used to control or further regulate the temperature of the reservoir 155 during the main mode. Furthermore, in the main mode, the energy applied to the secondary evaporator 150 by the heat source Qsp 151 is reduced, thus bringing the heat transfer system 105 to a normal operating temperature for the fluid. For example, in the main mode, the thermal load of the heat source Qsp 151 on the secondary evaporator 150 is maintained at a value equal to or in excess of the heat conditions, as defined below. In one implementation, the thermal load of the heat source Qsp is maintained at about 5 to 10% of the heat load applied to the main evaporator 115 of the heat source Qin 116.

In this particular implementation, the main mode is triggered by the determination that the setpoint temperature has been reached (step 335). In other implementations, the main mode may start at other times or due to other triggers. For example, the main mode can start after the priming system is wet (step 310) or after the reservoir has been cold-requested (step 305).

At any time during operation, the heat transfer system 105 may experience heat conditions, such as those resulting from the conduction of heat through the primary wick 140 and parasitic heat applied to the liquid line 125. Both conditions cause the formation of vapor on the liquid side of the evaporator. Specifically, the conduction of heat through primary wick 140 can cause the liquid within core 135 to form vapor bubbles which, if left within core 135, would grow and interrupt the supply of liquid to primary wick 140, thus causing main evaporator 115 fails. The entry of parasitic heat into the liquid line 125 (referred to as “parasitic heat gains”) can cause the liquid within the liquid line 125 to form steam.

To reduce the adverse impact of the heat conditions discussed above, the priming system 110 operates at a Qsp 151 energy level greater than or equal to the sum of the heat conduction and parasitic heat gains. As mentioned above, for example, the priming system can operate at 5 - 100% of the power for the 105 heat transfer system. In particular, the fluid that includes a combination of bubbles of vapor, and liquid, is swept out from the core 135, for discharge into the secondary fluid line 160, resulting in the secondary condenser 122. In particular, the vapor that forms inside the core 135 travels around the bayonet tube 143 directly into the fluid outlet port 139. The steam that forms inside the first steam passage 144 makes its way into the fluid outlet port 139, traveling through the secondary wick 145 (if the pore size of the secondary wick 145 is large enough to accommodate bubbles) or through an opening at one end of the secondary wick 145, near outlet port 139, which provides an unobstructed passage from the first steam passages 144 to port d and outlet 139. Secondary condenser 122 condenses the fluid bubbles and pushes the fluid into reservoir 155 for reintroduction into the heat transfer system 105.

Similarly, to reduce the entry of parasitic heat into the secondary fluid line 125, the secondary fluid line 160 and the liquid line 125 can form a coaxial configuration and the secondary fluid line 160 surround and isolate the liquid line 125 from the surrounding heat. This implementation is examined further below with reference to Figs. 8A and 8B. As a consequence of this configuration, it is possible that the surrounding heat causes bubbles of vapor to form in the secondary fluid line 160, instead of in the liquid line 125. As examined, due to the capillary action produced in the secondary wick 145, the fluid flows from the main evaporator 115 to the secondary condenser 122. This fluid flow and the relatively low temperature of the secondary condenser 122 cause the vapor bubbles to sweep into the secondary fluid line 160 through the condenser 122, where they are condensed into liquid and pumped into the reservoir 155.

As shown in Fig. 4, data from a test performed is shown. In this implementation, before the start of the main evaporator 115, at temperature 410, a temperature 400 of the main evaporator 115 is significantly higher than a temperature 405 of the reservoir 155, which was cold ordered to the setpoint temperature (step 305 ). When the priming system 110 is moistened (step 310), the power Qsp 450 is applied to the secondary evaporator 150 (step 315) at a time 452, causing the liquid to be pumped into the main evaporator

115 (step 330), the temperature 400 of the main evaporator 115 drops until reaching the temperature 405 of the reservoir in time 410. The power Qin 460 is applied to the main evaporator 115 in time 462, when the system 100 is operating in the LHP mode ( step 340). As shown, the Qin 460 power input to main evaporator 115 is kept relatively low, while main evaporator 115 is cooling. Also shown are temperatures 470 and 475, respectively, of secondary fluid line 160 and liquid line 125. After time 410, temperatures 470 and 475 track temperature 400 of main evaporator 115. In addition, a temperature 415 of the secondary evaporator 150 closely follows the temperature 405 of reservoir 115, because of the thermal communication between secondary evaporator 150 and reservoir 155.

As mentioned, in one implementation, ethane can be used as the fluid of the heat transfer system 105. Although the critical temperature of ethane is 33 ° C, for the reasons generally described above, system 100 can start from a supercritical state, where system 100 is at a temperature of 70 ° C. When the power Qsp is applied to the secondary evaporator 150, the temperatures of the condenser 120 and the reservoir 155 fall rapidly (between times 452 and 410). A compensation heater can be used to control the temperature of the reservoir 155 and thus of the condenser 120 to -10 ° C. To start the main evaporator 115 from the supercritical temperature of 70 ° C, a heat load or 10 W power input Qsp is applied to the secondary evaporator 150. Once the main evaporator 115 is primed, the power input of the heat Qsp 151 for secondary evaporator 150 and the power applied to and through the compensation heater can both be reduced to bring the system temperature 100 to a nominal operating temperature of about -50 ° C. For example, during the main mode, if a 40W Qin power input is applied to the main evaporator 115, the Qsp power input on the secondary evaporator 150 can be reduced by approximately 3W, while operating at -45 ° C, to mitigate the loss of 3W through heat conditions (as discussed above). As another example, the main evaporator 115. 5 can operate with a Qin power input of about 10 W to about 40 W, with 5 W applied to secondary evaporator 150 and with temperature 405 of reservoir 155 at approximately -45 ° C.

With reference to Figs. 5A and 5B, in one implementation, the main evaporator 115 is designed as a three-hole evaporator 10 500 (which is the design shown in Fig. 1). Generally, in the three-hole evaporator 500 the liquid flows into a liquid inlet 505, into a core 510 defined by a primary wick 540 and fluid from the core 510 flows from a fluid outlet 512 to a cold requested reservoir. (such as reservoir 155). The fluid and core 510 are housed within a container 515 made of, for example, aluminum. In particular, fluid flowing from the liquid inlet 505 into the core 510 flows through the bayonet tube 520, into a liquid passage 521, and flows through and around the bayonet tube 520. The fluid can flow through a wick secondary 525 (such as secondary wick 145 20 from evaporator 115), made of a wick material 530 and an annular artery 535. The wick material 530 separates annular artery 535 from a first vapor passage 560. When the power of the source heat Qin 116 is applied to the evaporator 500, liquid from the core 510 penetrates a primary wick 540 and evaporates, forming steam that is free to flow over a second steam passage 565, which includes one or more steam grooves 545 , and out of a steam outlet 550, into the steam line 130. The steam bubbles that form within the first steam passage 560 of the core 510 are swept out of the core 510, through the first passage of steam. steam 560 and into the fluid outlet 512. As * · I · · examined above, the steam bubbles within the first steam passage 560 can pass through the secondary wick 525 if the pore size of the secondary wick 525 is quite large to accommodate the steam bubbles. Alternatively or in addition, the steam bubbles within the first steam passage 560 can pass through an opening of the secondary wick 525, formed at any suitable location along the secondary wick 525, to penetrate the liquid passage 521 or the fluid outlet 512.

Referring to Fig. 6, in another implementation, main evaporator 115 is designed as a four-hole evaporator 600, which is a design described in U.S. Order 09 / 896,561, deposited on 06/29/01. Briefly and with emphasis on aspects that differ from the three-hole evaporator configuration, the liquid flows into the evaporator 600 through a fluid inlet 605, through a bayonet 610 and into a core 615.0 liquid inside the core 615 penetrates on a primary wick 620 and evaporate, forming steam that is free to flow along the steam grooves 625 and out of a steam outlet 630, into the steam line 130. A secondary wick 633 within the core 615 separates liquid inside the steam core or core bubbles (which are produced when liquid from the 615 core heats up). The bubbles carrying liquid, formed within a first fluid passage 635, within the secondary wick 633, seep out of a fluid outlet 640 and the vapor or bubbles formed within a vapor passage 642, positioned between the secondary wick 633 and primary wick 620, drains out of a steam outlet 645.

Referring also to Fig. 7, a heat transport system 700 is shown in which the main evaporator is a four-hole evaporator 600. System 700 includes one or more heat transfer systems 705 and a priming system 710, configured to convert fluid within the heat transfer systems 705 into a liquid to prime the heat transfer systems 705. Four-hole evaporators 600 are coupled to one or more condensers 715 by a steam line 720 and a fluid line 725. The - 5 priming system 710 includes a cold-ordered reservoir 730, hydraulically and thermally connected to a priming evaporator 735.

Design considerations of the heat transport system 100 include starting the main evaporator 115 from a supercritical state, controlling parasitic heat leaks, conducting heat through the primary wick 140, cold request from the cold reservoir 155 and containment of pressure at ambient temperatures that are higher than the critical temperature of the working fluid within the heat transfer system 105. To accommodate these design considerations, the body or vessel (such as vessel 515) of the evaporator 115 or 150 may be 15 made of extruded aluminum 6063 and primary wicks 140 and / or 190 can be made of a fine pore wick. In one implementation, the outer diameter of the evaporator 115 or 150 is approximately 1.59 cm and the length of the container is approximately 15.2 cm. Reservoir 155 can be cold ordered to a radiator end panel 165, 20 using aluminum shunt 170. In addition, a heater (such as a kapton heater) can be attached to one side of reservoir 155.

In one implementation, steam line 130 is made with smooth stainless steel wall tubing, having an outside diameter (OD) of 0.476 cm and liquid line 125 and secondary fluid line 160 is 25 made of wall tubing smooth stainless steel having an OD of 0.318 cm. Lines 125, 130, 160 can be folded in a serpentine route and galvanized with gold, to minimize parasitic heat gains. In addition, lines 125, 130, 160 can be included in a stainless steel case with heaters, to simulate a particular environment during <. · · »The test. The stainless steel housing can be insulated with multilayer insulation (MLI) to minimize heat leakage through the 165 heat sink panels.

In one implementation, condenser 122 and secondary fluid line 160 are made of tubing having an OD of 0.64 cm. The piping is connected to the heat sink panels 165, using, for example, epoxy. Each 165 heat sink panel is a 20 x 48 cm direct condensing aluminum radiator, which uses a 0.16 cm thick face sheet. Kapton heaters can be attached to the heatsink panels 165, close to condenser 120, to prevent inadvertent freezing of the working fluid. During operation, temperature sensors, such as thermocouples, can be used to monitor temperatures throughout the system 100.

The heat transport system 100 can be implemented in any circumstances where the critical temperature of the working fluid of the heat transfer system 105 is below the ambient temperature in which the system 100 is operating. The heat transport system 100 can be used to resin components that require cryogenic cooling.

With reference to Figs. 8A-8D, the heat transport system 100 can be implemented in a miniaturized cryogenic system 800, lines 125, 130, 160 are made of flexible material to allow for space-saving 805 coil configurations. The miniaturized system 800 can operate at -238 ° C using neon fluid. The Qin 116 power input is approximately 0.3 to 2.5 W. The 800 miniaturized system thermally couples a cryogenic component (or heat source that requires cryogenic cooling) 816 to a cryogenic cooling source, such as a cryogenic -cooled 810 coupled to condenser coolers 120, 122.

The miniaturized 800 system reduces mass, reduces flexibility and provides thermal switching capability when compared to traditional, thermally switchable, vibration-insulated systems. Traditional, thermally switchable, vibration-insulated systems require two flexible conductive connections (FCLs), a cryogenic thermal switch (CTSW) and a conduction bar (CB), which forms a circuit to transfer heat from the cryogenic component to the cooling source cryogenic. In the 800 miniaturized system, thermal performance is increased because the number of mechanical interfaces is reduced. The heat conditions at the mechanical interfaces are responsible for a large percentage of heat gains within the thermally switchable, traditional, switchable systems. CB and two FCLs are replaced by thin, flexible, low-mass tubing used for the 805 coil configurations of the 800 miniaturized system.

In addition, the miniaturized system 800 can operate over a wide range of heat transport distances, which allows for a configuration in which the cooling source (such as the cryocooler 810) is located remotely from the cryogenic component 816. The configurations of coil 805 have a low mass and low surface area, thus reducing the parasitic heat gains through lines 125 and 160. The configuration of the cooling source 810, within the miniaturized system 800, facilitates the integration and conditioning of the system 800 and reduces vibrations at the 810 cooling source, which is particularly important in infrared sensor applications. In one implementation, the miniaturized 800 system was tested using neon, operating at 25-40K.

With reference to Figs. 9A-9C, the heat transport system 100 can be implemented in an adjustable or articulated mounted system 1005, in which the main evaporator 115 and part of the lines 125, 160 and

130 are mounted to rotate around a lifting axis 1020, within a range of ± 45 ° and part of the lines 125, 160 and 130 are mounted to rotate around a azimuth geometric axis 1025, within a range ± 220 °. Lines 125, 160, 130 are formed of thin-walled tubing and are wound around each axis of rotation. System 1005 thermally couples a cryogenic component (or heat source that requires cryogenic cooling) 1016, such as a cryogenic telescope sensor, to a cryogenic cooling source, such as a 1010 cryocool, coupled to cool condensers 120 , 122. Cooling source 1010 is located on a stationary aircraft 1060, thus reducing the mass of the cryogenic telescope. The engine torque to control the rotation of lines 125, 160, 130, the power requirements of the 1005 system, the control requirements for the 1060 aircraft and the accuracy of aim for the 1016 sensor are improved. The cryocooler 1010 and the radiator or heat sink 165 can be moved from sensor 1016, reducing vibration within sensor 1016. In one implementation, the 1005 system was tested to operate within the 70 - 115K range, when work is nitrogen.

The 105 heat transfer system can be used in medical applications or in applications where the equipment must be cooled to below ambient temperatures. As another example, the heat transfer system 105 can be used to cool an infrared (IR) sensor, which operates at cryogenic temperatures, to reduce ambient noise. The heat transfer system 105 can be used to cool a vending machine, which often houses items that are preferably cooled to sub-ambient temperatures. The heat transport system 105 can be used to cool one or more components of a transport device, such as an automobile or an airplane.

Other implementations are within the scope of the following claims. For example, condenser 120 and heat sink 165 can be designed as an integral system, such as, for example, a radiator. Similarly, secondary condenser 122 and heat sink 165 can be formed by a radiator. Heat sink 165 can be a passive heat sink (such as a radiator) or a cryocooler, which actively cools capacitors 120, 122.

In another implementation, the temperature of the reservoir 155 is controlled using a heater. In another implementation, reservoir 155 is heated using parasitic heat.

In another implementation, a coaxial isolation ring is formed and placed between the liquid line 125 and the secondary fluid line 160, which surrounds the isolation ring.

Evaporator Design

Evaporators are integral components of two-phase heat transfer systems. For example, as shown above in Figs. 5A and 5B, the evaporator 500 includes an evaporator body or container 515, which is in contact with the primary wick 540, which surrounds the core 510. The core 510 defines a flow passage for the working fluid. Primary wick 540 is surrounded at its periphery by a plurality of flow channels or peripheral steam grooves 545. Channels 545 collect steam at the interface between wick 540 and evaporator body 515. Channels 545 are in contact with the outlet of steam 550, which feeds into the steam line, which feeds into the condenser, to enable the evacuation of the steam formed within the evaporator 115.

The evaporator 500 and the other evaporators examined above often have a cylindrical geometry, that is, the evaporator core forms a cylindrical passage through which the working fluid passes. The cylindrical geometry of the evaporator is useful for cooling applications, where the heat acquisition surface is cylindrically concave. Many cooling applications require heat to be transferred away from a heat source having a flat surface. In these kinds of applications, the evaporator can be modified to include a flat conductive support, to match the coverage area of the heat source having the flat surface. Such a design is shown, for example, in U.S. Patent 6,382,309.

The cylindrical geometry of the evaporator facilitates compliance with the thermodynamic restrictions of the LHP operation (that is, the minimization of heat leaks into the reservoir). The restrictions of the LHP operation stem from the degree of subcooling that an LHP needs to produce normal equilibrium operation. Additionally, the cylindrical geometry of the evaporator is relatively easy to manufacture, handle, machine and process.

However, as will be described below, an evaporator can be designed with a flat shape, to more naturally attach itself to a flat heat source.

Planar Project

Referring to Fig. 10, an evaporator 1000, for a heat transfer system, includes a vapor barrier wall 1005, a liquid barrier wall 1010, a primary wick 1015, between the vapor barrier wall and the inner side of the liquid barrier wall 1010, the vapor removal channels 1020 and the liquid flow channels 1025.

The vapor barrier wall 1005 is in close contact with the primary wick 1015. The liquid barrier wall 1010 contains working fluid on the inner side of the liquid barrier wall 1010, so that the working fluid drains only when along the inner side of the liquid barrier wall 1010. The liquid barrier wall 1010 closes the evaporator casing and helps organize and distribute the working fluid through the liquid flow channels 1025. The vapor removal channels 1020 they are located at an interface between a vaporization surface 1017 of the primary wick 1015 and the vapor barrier wall 1005. The liquid flow channels 1025 are located between the liquid barrier wall 1010 and the primary wick 1015.

The vapor barrier wall 1005 acts as a heat acquisition surface for a heat source. The vapor barrier wall 1005 is made of a heat conductive material, such as, for example, laminated metal. The material chosen for the vapor barrier wall 1005 is typically capable of withstanding the internal pressure of the working fluid.

Vapor removal channels 1025 are designed to balance the hydraulic resistance of channels 1020 with the conduction of heat, through the vapor barrier wall 1005, into a primary wick 1015. Channels 1020 can be electrochemically attacked, machined or molded on a surface with any other convenient method.

The vapor removal channels 1020 are shown as grooves on the inner side of the vapor barrier wall 1005. However, the vapor removal channels can be designed and located in several different ways, depending on the design approach chosen. For example, according to other implementations, the vapor removal channels 1020 are grooved within the outer surface of the primary wick 1015 or embedded within the primary wick 1015, so that they are under the surface of the primary wick. The design of the 1020 vapor removal channels is selected to increase the ease and convenience of manufacturing and to strictly approach one or more of the following guidelines.

First, the internal diameter of the vapor removal channels 1020 must be sufficient to handle the flow of steam generated on the vaporization surface 1017 of the primary wick 1015, without a significant pressure drop. Second, the contact surface, between the vapor barrier wall 1005 and the primary wick 1015, should be maximized to provide efficient heat transfer from the heat source to the vaporization surface of the primary wick 1015. Third, the thickness 1030 of the vapor barrier wall 1005, which is in contact with primary wick 1015, should be minimized. When the thickness 1030 increases, the vaporization on the surface of the primary wick 1015 is reduced and the transport of steam through the vapor removal channels 1020 is reduced.

Evaporator 1000 can be mounted in separate parts. Alternatively, the evaporator 1000 can be made as a single part by sintering in situ the primary wick 1015, between two walls having special mandrels, to form channels on both sides of the wick.

Primary wick 1015 provides the vaporization surface 1017 and pumps or feeds the working fluid from the liquid flow channels 1025 to the vaporization surface of the primary wick 1015.

The size and design of the primary strand 1015 involves several considerations. The thermal conductivity of the primary wick 1015 must be very low to reduce the heat leakage from the vaporization surface 1017, through the primary wick 1015, and to the fluid flow channels 1025. The heat leak can also be affected by linear dimensions of the primary wick 1015. For this reason, the linear dimensions of the primary wick 1015 must be appropriately optimized to reduce heat leakage. For example, increasing the thickness 1019 of primary wick 1015 can reduce heat leakage. However, the increased thickness 1019 can increase the hydraulic resistance of the primary wick 1015 for the flow of the working fluid. When working on LHP projects, the hydraulic resistance of the working fluid, due to the primary wick 1015, can be significant and an appropriate balance of these factors is important.

The force that drives or pumps the working fluid of a heat transfer system is a difference in temperature or pressure between the liquid and vapor sides of the primary wick. The pressure difference is supported by the primary wick and is maintained by appropriate control of the thermal balance of the incoming working fluid.

The liquid returning to the evaporator from the condenser passes through a liquid return line and is slightly subcooled. The degree of subcooling compensates for the leakage of heat through the primary wick and the leakage of heat from the environment into the reservoir, within the liquid return line. The sub-cooling of the liquid maintains a thermal balance of the reservoir. However, there are other useful methods for maintaining the thermal balance of the reservoir.

One method is an organized heat exchange between the reservoir and the environment. For evaporators having a flat design, such as those frequently used for terrestrial applications, the heat transfer system includes heat exchange fins on the reservoir and / or on the liquid barrier wall 1010 of the evaporator 1000. The natural convection forces these fins provide subcooling and reduce the tension in the condenser and the heat transfer system reservoir.

The temperature of the reservoir or the temperature difference between the reservoir and the vaporization surface 1017 of the primary wick 1015 supports the circulation of the working fluid through the heat transfer system. Some heat transfer systems may require an additional degree of subcooling. The required degree can be greater than that the capacitor can produce, even if the capacitor is completely blocked.

When designing the evaporator 1000, three variables need to be controlled. First, the organization and design of the 1025 liquid flow channels needs to be determined. Second, venting the vapor from the 1025 liquid flow channels needs to be the primary factor. Third, the evaporator

1000 must be designed to ensure that liquid fills the 1025 liquid flow channels. These three variables are interrelated and thus must be considered and optimized together to form an effective heat transfer system.

- 5 As mentioned, it is important to obtain an appropriate balance between the leakage of heat into the liquid side of the evaporator and the pumping capabilities of the primary wick. This balancing process cannot be performed independently of the optimization of the condenser, which provides subcooling, because the greater the heat leakage 10 allowed in the evaporator design, the more subcooling needs to be produced in the condenser. The longer the condenser, the greater the hydraulic losses in fluid lines, which may require different wick material with better pumping capabilities.

In operation, when power from a heat source is applied to the evaporator 1000, liquid from the liquid flow channels 1025 penetrates the primary wick 1015 and evaporates, forming steam that is free to flow along the vapor removal channels. 1020. The liquid flow into the evaporator 1000 is provided by the liquid flow channels 1025. The liquid flow channels 1025 supply the primary wick 1015 with sufficient liquid _ 20 to replace the liquid that is vaporized on the vapor side. of the primary wick 1015 and to replace the liquid that is vaporized on the liquid side of the primary wick 1015.

The evaporator 1000 may include a secondary wick 1040, which provides phase control on the liquid side of the evaporator 1000 and supports 25 supply of the primary wick 1015 in critical modes of operation (as discussed above). The secondary wick 1040 is formed between the liquid flow channels 1025 and the primary wick 1015. The secondary wick can be a wire mesh (as shown in Fig. 10) or an advanced and complicated artery or a wick plate structure. In addition, the evaporator 1000 may include a steam vent 1045 at an interface between primary wick 1015 and secondary wick 1040.

The conduction of heat, through the primary wick 1015, can initiate the vaporization of the working fluid in the wrong place - on a liquid side of the evaporator 1000, near or within the 1025 liquid flow channels. The vapor vent channel 1045 supplies the unwanted steam away from the wick, into the two-stage reservoir.

The fine pore structure of the primary strand 1015 can create significant flow resistance for the liquid. Therefore, it is important to optimize the number, geometry and design of the 1025 liquid flow channels. The purpose of this optimization is to support a uniform or close to uniform feed flow to the 1017 vaporization surface. In addition, when the 1019 thickness of the primary wick 1015 is reduced, the liquid flow channels 1025 can be further apart.

'The evaporator 1000 may require significant vapor pressure to operate with a particular working fluid within the evaporator 1000. The use of a working fluid, with a high vapor pressure, can cause several problems with the pressure containment of the evaporator. Traditional solutions to the pressure containment problem, such as thickening of the evaporator walls, are not always effective. For example, in planar evaporators, having a significant flat area, the walls become so thick that the temperature difference is increased and the heat conductance of the evaporator is degraded. Additionally, even microscopic deflection of the walls, due to pressure containment, results in a loss of contact between the walls and the primary wick. Such loss of contact impacts the heat transfer through the evaporator. And the microscopic deflection of the walls creates difficulties with the interfaces between the evaporator and the heat source and any external cooling equipment. ’

Cancel Project

With reference to Figs. 10-13, an annular evaporator 1100 is formed by effectively winding the planar evaporator 1000, so that the primary wick 1015 forms a closed loop behind itself and forms an annular shape. The 1100 evaporator can be used in applications where the heat sources have a cylindrical outer profile or in applications where the heat source can be shaped like a cylinder. The annular shape combines the resistance of a cylinder for pressure containment and the curved interface surface for the best possible contact with cylindrically shaped heat sources.

The evaporator 1100 includes a vapor barrier wall 1105, a liquid barrier wall 1110, a primary wick 1115, positioned between the vapor barrier wall 1105 and the inner side of the liquid barrier wall 1110, the removal channels of vapor 1120 and liquid flow channels 1125. The liquid barrier wall 1110 is coaxial with the primary wick 1115 and the vapor barrier wall 1105.

The vapor barrier wall 1105 intimately contacts the primary wick 1115. The liquid barrier wall 1110 contains working fluid on an internal side of the liquid barrier wall 1110, so that the working fluid flows only along the side internal of the liquid barrier wall 1110. The liquid barrier wall 1110 closes the evaporator casing and helps to organize and distribute the working fluid through the liquid flow channels 1125.

The vapor removal channels 1120 are located at an interface between a vaporization surface 1117 of the primary wick 1115 and the vapor barrier wall 1105. The liquid flow channels 1125 are located between the liquid barrier wall 1110 and the primary wick 1115. The vapor barrier wall 1105 acts as a heat acquisition surface and the steam generated on this surface is removed by the vapor removal channels 1120.

Primary wick 1115 fills the volume between the vapor barrier wall 1105 and the liquid barrier wall 1110 of the evaporator 1100, to provide reliable reverse meniscus vaporization.

The evaporator 1100 can also be equipped with heat exchange fins 1150, which contact the liquid barrier wall 1110 to cold request the liquid barrier wall 1110. The liquid flow channels 1125 receive liquid from a liquid inlet 1155 and the vapor removal channels 1120 extend to supply steam to a steam outlet 10 1160.

The evaporator 1100 can be used in a heat transport system that includes an annular reservoir 1165 adjacent to the primary wick 1115. The reservoir 1165 can be ordered cold with the heat exchange fins 1150, which extend through the reservoir 1165. The cold request of the 1165 reservoir allows the use of the entire area of the condenser, without the need to generate sub-cooling in the condenser. The excessive cooling provided by the cold request of reservoir 1165 and evaporator 1100 compensates for parasitic heat leaks through the primary wick 1115 into the liquid side of the evaporator 1100.

In another implementation, the evaporator design can be reversed and the vaporization characteristics can be placed on an external perimeter and the liquid return characteristics can be placed on the internal perimeter.

The annular shape of the 1100 evaporator can provide one or 25 more of the following or additional advantages. First, problems with pressure containment can be reduced or eliminated in the annular evaporator 1100. Second, the primary wick 1115 may not need to be sintered from the inside, thus providing more space for a more sophisticated design of the vapor and liquid sides of the wick primary 1115.

With reference also to Figs. 14A-H, an annular evaporator 1400 is shown having a liquid inlet 1455 and a steam outlet 1460. The annular evaporator 1400 includes a vapor barrier wall 1700 (Figs. 14G, 14H and 17A-D), a wall of liquid barrier 1500 (Figs. 14G, 14H and 17A-17D), a primary wick 1600 (Figs. 14G, 14H and 16A-D) positioned between the vapor barrier wall 1700 and the inner side of the liquid barrier wall 1500, vapor removal channels 1465 (Figs. 14H, 15A, 15B) and liquid flow channels 1505 (Fig. 14H). The annular evaporator 1400 also includes a 1800 ring (Figs. 14G and 18A-D), which ensures spacing between the vapor barrier wall 1700 and the liquid barrier wall 1500 and a 1900 ring (Figs. 14G, 14H and 19A -D) on an evaporator base 1400, which provides support for the liquid barrier wall 1500 and the primary wick 1600. The vapor barrier wall 1700, the liquid barrier wall 1500, the ring 1800, the ring 1900 and the wick 1600 are preferably formed of stainless steel.

The upper part of the evaporator 1400 (that is, above the wick 1600) includes an expansion volume 1470 (Fig. 14H). The liquid flow channels 1505, which are formed in the liquid barrier wall 1500, are fed by the liquid inlet 1455. The wick 1600 separates the liquid flow channels 1505 from the vapor removal channels 1465, which lead to the outlet of steam 1460, through an annular steam crown 1475 (Fig. 14H) formed in ring 1900. Steam channels 1465 can be attacked photochemically within the surface of the vapor barrier wall 1700, as examined in more detail below.

The evaporators described here can operate in any combination of materials, dimensions and arrangements, as long as they embody the characteristics described above. There are no restrictions other than the criteria mentioned here; the evaporator can be made of any shape, size and material. The only restrictions of the project are that the materials _ν · - ·>»; η. > Ο w I- · -.> C -> * · - ': / ϊ ί »» - »».

_w and · Ο - * · W * * V * applicable are compatible with each other and that the working fluid is selected in consideration of structural restrictions, corrosion, generation of non-condensable gases and life span problems.

Many terrestrial applications can incorporate an LHP with an 1100 annular evaporator. The orientation of the annular evaporator in a gravity field is predetermined by the nature of the application and the shape of the hot surface.

Cyclic Heat Exchange System

Cyclic heat exchange systems can be configured with one or more heat transfer systems, to control a temperature in a region of the heat exchange system. The cyclic heat exchange system can be any system that operates using a thermodynamic cycle, such as, for example, a cyclic heat exchange system, a Stirling heat exchange system (also known as a Stirling engine) or a system of air conditioning.

Referring to Fig. 20, a Stirling 2000 heat exchange system uses a known type of environmentally friendly and efficient refrigeration cycle. The Stirling 2000 system works by directing a working fluid (eg helium) through four repetitive operations; that is, a constant temperature heat addition operation, a constant volume heat rejection operation, a constant temperature heat rejection operation and a constant volume heat addition operation.

The Stirling 2000 system is designed as a Free Piston Stirling Cooler (FPSC), just like the Global Cooling model M100B (available from Global Cooling Manufacturing, 94 N, Columbus RD., Athens, Ohio). The FPSC 2000 includes a linear motor part 2005 housing a linear motor (not shown) that receives an AC 2010 power input. The FPSC 2000 includes a heat acceptor 2015, a regenerator 2020 and a <= * heat rejector 2025. The FPSC 2000 includes a 2030 equilibrium volume, coupled to the linear motor body within the linear motor part 2005, to absorb vibrations during FPSC operation. The FPSC 2000 also includes a 2035 loading port. The PFSC 2000 includes internal components, such as those shown in FPSC 2100 in Fig. 21.

The FPSC 2100 includes a linear motor 2105, housed within the linear motor part 2110. The linear motor part 21100 houses a piston 2115, which is coupled to flat springs 2120 at one end and a displacer 2125 at the other end. The displacer 2125 is coupled to an expansion space 2130 and a compression space 2135, which form, respectively, cold and hot sides. The heat acceptor 2015 is mounted on the cold side 2130 and the heat rejector is mounted on the hot side 2135. The FPSC 2100 also includes an equilibrium volume 2140, coupled to the linear motor part 2110, to absorb vibrations during operation of the FPSC 2100 .

With reference also to Fig. 22, in an implementation, a

FPSC 2200 includes a 2205 heat rejector made from a copper sleeve and a 2210 heat acceptor made from a copper sleeve. The 2205 heat rejector has an external diameter (OD) OF approximately 100 mm and a width of approximately 53 mm, to provide a heat rejection surface 20 of 166 cm, capable of providing a flow of 6W / cm, when operating in a temperature range of 20 - 70 ° C. The 2210 heat acceptor has an OD of approximately 100 mm and a width of approximately 37 mm, to provide a 115 cm heat acceptor surface, capable of providing a flow of 5.2 W / cm, over a temperature range of 25 -30-5 ° C.

Briefly, in operation, an FPSC is charged with a refrigerant (such as, for example, helium gas) that is moved back and forth by combined movements of the plunger and displacer. In an ideal system, thermal energy is discharged into the environment through the:,:. : .-:.:. -.- -.- -.- heat, while the refrigerant is compressed by the plunger and thermal energy is extracted from the environment through the heat acceptor, while the refrigerant expands.

Referring to Fig. 23, a 2300 - 5 thermodynamic system includes a cyclic heat exchange system, such as a 2305 cyclic heat exchange system (for example, 2000, 2100, 2200 systems) and a „de heat transfer 2310, thermally coupled to a part 2315 of the cyclic heat exchange system 2305. The cyclic heat exchange system 2305 is cylindrical and the heat transfer system 2310 is shaped 10 to surround part 2315 of the exchange system cyclic heat 2305, to reject heat from part 2315. In this implementation, part 2315 is the hot side (ie, the heat rejector) of the cyclic heat exchange system 2305. The 2300 thermodynamic system also includes a 2320 fan, positioned on the hot side of the cyclic heat exchange system 2305, to force air through a condenser in the 2310 heat transfer system and thus provide additional convection cooling.

A cold side 2335 (ie, the heat acceptor) of the cyclic heat exchange system 2305 is thermally coupled to a 2340 CO2 reflux from a 2345 thermosiphon. The 2345 thermosiphon includes a _20 side heat exchanger cold 2350, which is configured to cool air inside the 2300 thermodynamic system, which is forced through the 2350 heat exchanger by a 2355 fan. A thermo-siphon is a closed system of tubes, which are connected to a cooling motor (in this case) case, 0 heat exchanger 2350), which allows natural circulation and cooling of the liquid inside the reflux.

Referring to Fig. 24, in another implementation, a thermodynamic system 2400 includes a cyclic heat exchange system, such as a cyclic heat exchange system 2405 (for example, 2000, 2100, 2200 systems) and a heating system. heat transfer 2410, thermally coupled to a hot side 2415 of the cyclic heat exchange system 2405. The thermodynamic system 2400 includes a heat transfer system 2420, thermally coupled to a cold side 2425 of the cyclic heat exchange system 2405. The 2400 thermodynamic system also includes fans 2430, 2435. Fan 2430 is positioned on the hot side 2415, to force air through a condenser of the heat transfer system 2410. Fan 2435 is positioned on the cold side 2425, to force air through a condenser of the 2420 heat transfer system.

Referring to Fig. 25, in an implementation, a thermodynamic system 2500 includes a heat transfer system 2505 coupled to a cyclic heat exchange system, such as a cyclic heat exchange system 2510. The heat transfer system 2505 is used to cool a hot side 2515 of the cyclic heat exchange system 2510. The heat transfer system 2505 includes an annular evaporator 2520, which includes an expansion volume (or reservoir) 2525, a liquid return line 2530 providing fluid communication between the liquid outlets 2535 of a condenser 2540 and the liquid inlet of the evaporator 2520. The heat transfer system 2505 also includes a steam line 2545, providing fluid communication between the vapor outlet of the 2520 evaporator and steam inlets 2550 of condenser 2540.

The 2540 condenser is constructed of smooth-walled tubing and is equipped with 2555 heat exchange fins or provision of fins to intensify the heat exchange on the outside of the pipe.

The evaporator 2520 includes a primary wick 2560, interspersed between a vapor barrier wall 2565 and a liquid barrier wall 2570 and separating the liquid and the vapor. The 2570 liquid barrier wall is cold applied by the 2575 heat exchange fins, formed along the outer surface of the 2565 wall. The 2575 heat exchange fins provide subcooling for the 2525 reservoir and the entire liquid side evaporator 2520. The heat exchanger fins 2575 of the evaporator 2520 can be designed separately from the heat exchange fins 2555 of the condenser 2540.

The liquid return line 2530 extends into the reservoir 2525, located above the primary wick 2560 and vapor bubbles, if any, from the liquid return line 2530 and the vapor removal channels, at the interface of the primary wick 2560 and vapor barrier wall 2565, are vented into the 2525 reservoir. Typical working fluids for the 2505 heat transfer system include (but are not limited to) methanol, butane, CO ₂ , propylene and ammonia.

The evaporator 2520 is attached to the hot side 2515 of the cyclic heat exchange system 2510. In one implementation, this fixation is one-piece due to the fact that the evaporator 2520 is an integral part of the cyclic heat exchange system 2510. In another implementation, the fixing may not be solid, as the evaporator 2520 can be clamped to a surface on an external surface of the hot side 2510. The heat transfer system 2505 is cooled by a forced convection heatsink, which can be provided by a simple 2580 fan. Alternatively, the heat transfer system 2505 is cooled by natural convection or airflow.

Initially, the liquid phase of the working fluid is collected in a lower part of the evaporator 2520, the liquid return line 2530 and the condenser 2540. The primary wick 2560 is wet because of capillary forces. As soon as heat is applied (for example, the cyclic heat exchange system 2510 is switched on), primary wick 2560 begins to generate steam, which travels through the vapor removal channels (similar to the steam removal channels 1120 of the evaporator 1100) from evaporator 2520, through the steam outlet of evaporator 2520 and into the steam line 2545.

The steam then enters the condenser 2540 in an upper part of the condenser 2540. The condenser 2540 condenses the vapor into liquid and the liquid is collected in a lower part of the condenser 2540. The liquid is pushed into the reservoir 2525, because of the difference pressure between reservoir 2525 and bottom of condenser 2540. Liquid from reservoir 2525 penetrates the liquid flow channels of evaporator 2520. The liquid flow channels of evaporator 2520 are configured as channels 1125 of evaporator 1100 and are suitably sized and located to provide adequate liquid replacement for the vaporizing liquid. The capillary pressure created by the primary wick 2560 is sufficient to withstand the total pressure drop of the LHP and to prevent vapor bubbles from traveling through the primary wick 2560 to the liquid flow channels.

The liquid flow channels of the 2520 evaporator can be replaced by a simple annular crown, if the cold demand, examined above, is sufficient to compensate for the increased heat leakage through the primary wick 2560, which is caused by the increase in the area of surface of the annular crown heat transport system versus the surface area of the liquid flow channels.

With reference to Figs. 26 - 28, a heat transfer system 2600 includes an evaporator 2605 coupled to a cyclic heat exchange system 2610 and an expansion volume 2615 coupled to evaporator 2605. The vapor channels of the evaporator 2605 feed a steam line 2620, which supplies a series of channels 2625 to a condenser 2630. The condensed liquid, coming from the condenser 2630, is collected in a liquid return channel 2635. The heat transport system 2600 also includes provision of fins 2640, thermally coupled to the condenser 2630.

The evaporator 2605 includes a vapor barrier 2700 wall, a liquid barrier wall 2705, a primary wick 2710, positioned between the vapor barrier wall 2700 and the inner side of the liquid barrier wall 2705, removal channels steam 2715 and liquid flow channels 2720. The liquid barrier wall 2705 is coaxial with the primary wick 2710 and the vapor barrier wall 2700. The liquid flow channels 2720 are fed by a liquid return channel 2725 and the steam removal channels 2715 fed into a steam outlet 2730.

The vapor barrier wall 2700 intimately contacts the primary wick 2710. The liquid barrier wall 2705 contains working fluid on an internal side of the liquid barrier wall 2705, so that the working fluid flows only along the side inside the liquid barrier wall 2705. The liquid barrier wall 2705 closes the evaporator casing and helps organize and distribute the working fluid through the 2720 liquid flow channels.

In one implementation, the evaporator 2605 is approximately 5 cm high and the expansion volume 2615 is approximately 2.5 cm high. Evaporator 2605 and expansion volume 2615 are wound around a part of the cyclic heat exchange system 2610, having an outside diameter of 10 cm. The steam line 2620 has a radius of 0.318 cm. The cyclic heat exchange system 2610 includes approximately 58 capacitor channels 2625, with each capacitor channel 2625 having a length of 5 cm and a radius of 0.031 cm, channels 2625 being spread out, so that the width of the condenser 2630 is approximately 102 cm. The liquid return channel 2725 has a radius of 0.16 cm. The heat exchanger 2800 (which includes condenser 2630 and the provision of fins 2640 is approximately 102 cm long and is wound in an internal and external closed circuit (see Figs. 30, 33 and 34), to produce a heat exchanger cylindrical heat, having an outer diameter of approximately 8 ”. The 2605 evaporator has a cross section width 2750 of approximately 0.318 cm, as defined by the vapor barrier wall 2700 and the liquid barrier wall 2705. The channels for removing steam 2715 have widths of approximately 0.051 cm and depths of approximately 0.051 cm and are separated from each other by approximately 0.051 cm, to produce approximately 10 channels per cm.

As mentioned above, the heat transfer system (such as the 2310 system) is thermally coupled to the part (such as part 2315) of the cyclic heat exchange system. The thermal coupling between the heat transfer system and the part can be by any suitable method. In one implementation, if the evaporator of the heat transfer system is thermally coupled to the hot side of the cyclic heat exchange system, the evaporator can surround and contact the hot side and thermal coupling can be made possible by a thermal grease compound , applied between the hot side and the evaporator. In another implementation, if the evaporator of the heat transfer system is thermally coupled to the hot side of the cyclic heat exchange system, the evaporator can be built entirely with the hot side of the cyclic heat exchange system, by forming channels of steam directly into the hot side of the cyclic heat exchange system.

With reference to Figs. 30-32, a 20 heat transfer system 3000 is packaged around a 3005 cyclic heat exchange system. The heat transfer system 3000 includes a condenser 3010 surrounding an evaporator 3015. The working fluid that has been vaporized leaves the evaporator 3015 through a steam outlet 3020, connected to the condenser 3010. The condenser 3010 forms a closed circuit around 25 of itself and folds back inside itself at the junction 3025.

The cyclic heat exchange system 3005 is encircled around its heat rejection surface 3100 by the evaporator 3015. The evaporator 3015 is in close contact with the heat rejection surface 3100. The cooling set (which is the combination of the cyclic heat exchange system 3005 and heat transfer system 3000) is mounted on a tube 3205, with a fan 3210 attached to the end of the tube 3205, to force air through the 3030 fins of the condenser 3010 to the exhaust channels 3035 .

The evaporator 3015 has a wick 3215 in which the working fluid absorbs heat from the heat rejection surface 3100 and changes the phase from liquid to steam. The heat transfer system 3000 includes a 3220 reservoir on top of the 3015 evaporator, which provides an expansion volume. For simplicity of illustration, the evaporator 3015 was illustrated 10 in this view as a simple hatch block, which shows no internal detail. Such internal details are examined elsewhere in this description.

The vaporized working fluid leaves the evaporator 3015 through the steam outlet 3020 and enters a steam line 3040 from the condenser 3010. The working fluid flows downward from the steam line 3040 through the 3045 channels of the condenser 3010 , for the liquid return line 3050. When the working fluid flows through channels 3045 of the condenser 3010, it loses heat through the fins 3030 to the air passage between the fins, to change the vapor phase to liquid. The air that has passed through the fins 3030 of the condenser 3010 drains away 20 through the exhaust channel 3035. The liquefied working fluid (and possibly some non-condensing vapor) drains from the liquid return line 3050 back into the 3015 evaporator. through the 3055 liquid return port.

With reference to Figs. 33 and 34, a heat transfer system 3300 surrounds part of a cyclic heat exchange system 3302, which is in turn surrounded by exhaust channels 3305. The heat transport system 3300 includes an evaporator 3310 , having an upper part surrounding the cyclic heat exchange system 3302. A steam orifice 3315 connects the evaporator 3310 to a steam line 3312 of a condenser 3320. The steam line 3312 includes an outer region that circulates around the evaporator 3310 and then folds back on itself at junction 3325, to form an internal region, which circles back around evaporator 3310 in the opposite direction. The 3300 5-heat transport system also includes 3330 cooling fins on the 3320 condenser.

The heat transfer system 3300 also includes a liquid return port 3400, which supplies a path for condensed working fluid from liquid line 3405 of condenser 3320 to return to evaporator 3310.

As mentioned above, the interface between the evaporator 3310 and the heat rejection surface of the cyclic heat exchange system 3302 can be implemented according to one of several alternative implementations.

Referring to Fig. 35, in one implementation, an evaporator 3500 slides over a heat rejection surface 3502 of a cyclic heat exchange system 3505. The evaporator 3500 includes a vapor barrier wall 3510, a barrier wall of liquid 3515 and a wick 3250 interspersed between walls 3510 and 3515. The wick 3520 is equipped with vapor channels 3525 and liquid flow channels 3530 are formed on the liquid barrier wall 3515 in simplified form for clarity.

The 3500 evaporator is slid over the 3050 cyclic heat exchange system and can be held in position with the use of a 3600 clamp (shown in Fig. 36). To assist in heat transfer, 25 thermally conductive grease 3535 is disposed between the cyclic heat exchange system 3050 and the vapor barrier 3510 wall of the 3500 evaporator. In an alternative implementation, the vapor channels 3525 are formed on the wall vapor barrier 3510 instead of the 3520 wick.

Referring to Fig. 37, in another implementation, an evaporator 3700 is fitted on a heat rejection surface 3702 of a cyclic heat exchange system 3705 with interference fit. Evaporator 3700 includes a vapor barrier wall 3710, a liquid barrier wall 3715 and a wick 3720 sandwiched between walls 3710 5 and 3715. Evaporator 3700 is sized to have an interference fit with the heat rejection surface 3702 of the 3705 cyclic heat exchange system.

The 3700 evaporator is heated so that its internal diameter expands to allow it to slide over the 3702 unheated heat rejection surface. When the 3700 evaporator cools, it contracts to attach itself to the heat exchange system. cyclic heat 3705 in an interference fit relationship. Due to the tightness of the fitting, thermally conductive grease is not necessary to increase heat transfer. The 3720 fuse is equipped with 3725 vapor channels. In an alternative implementation, the vapor channels are formed on the vapor barrier wall 3710 instead of on the 3720 fuse. The liquid flow channels 3730 are formed on the barrier wall. of liquid 3715 in a simplified form for clarity.

Referring to Fig. 38, in another implementation, an evaporator 3800 is fitted onto a heat rejection surface 3802 of a cyclic heat exchange system 3805 and features previously designed within the evaporator 3800 are now integrally formed within the surface of heat rejection 3802. In particular, the evaporator 3800 and the heat rejection surface 3802 are constructed together as an integrated assembly. The heat rejection surface 3802 is modified to have 3825 steam channels; in this way, the heat rejection surface 3802 acts as a vapor barrier wall for the evaporator 3800.

The evaporator 3800 includes a wick 3820 and a liquid barrier wall 3815 formed around the modified heat rejection surface 3802, the wick 3820 and the liquid barrier wall 3815 being integrally connected with the heat rejection surface 3802, to form a sealed evaporator 3800. The liquid flow channels 3830 are represented in a simplified form for clarity. In this way, a hybrid cyclic heat exchange system is formed, with an integrated evaporator. This one-piece construction provides increased thermal performance compared to the clamped construction and interference fit construction, because the thermal resistance is reduced between the cyclic heat exchange system and the evaporator fuse.

With reference to Fig. 29, graphs 2900 and 2905 show the relationship between a maximum surface temperature of the part of the cyclic heat exchange system that is to be cooled by the heat transfer system and a surface area of the interface between the heat transport system and the part of the cyclic heat exchange system to be cooled. The maximum temperature indicates the maximum degree of rejection. In graph 2900, the interface between the part and the heat transport system is made with a thermal grease compound. In graph 2905, the heat transfer system is made in one piece.

As shown, in an air flow of 300 CFM, if the 20 interface is a thermal grease interface, then the maximum degree of heat rejection will be within a maximum heat rejection surface temperature 2907 (for the example, 70 ° C) with 2910 heat exchange surface area (for example, 9.29 m). When the evaporator is constructed integrally with the part by the formation of the vapor channels directly on the heat rejection surface, that heat rejection surface operates below the maximum temperature of the heat rejection surface of the thermal grease interface, with areas of significantly smaller heat exchange surface.

With reference to Fig. 39, a condenser 3900 is formed with fins 3905, which provides thermal communication between the air or the environment and a steam line 3910 from condenser 3900. Steam line 3910 is coupled to an outlet of steam 3915, which connects the evaporator 3920, positioned inside the condenser 3900.

- 5 With reference to Figs. 40-43, in one implementation, the "condenser 3900 is laminated and is formed with flow channels ₈ that extend through a flat plate 4000 of the capacitor 3900, between a vapor and a liquid collector 3925 3930 The collector copper is a material suitable for use in the production of a laminated condenser. The capacitor 10 of laminated structure 3900 includes a base 4200, having fluid flow channels 4205 (shown schematically) formed therein and a top layer 4210 is attached to the base 4200 to cover and seal the fluid flow channels 4205. The fluid flow channels 4205 are designed as trenches formed at base 4200 and sealed under top layer 4210. Trenches 15 for fluid flow channels 4205 can be formed by chemical cauterization, electrochemical cauterization, mechanical machining or machining processes by electric discharge.

With reference to Figs. 44 and 45, in another implementation, capacitor 3900 is extruded and small flow channels 4400 extend _ 20 through a flat plate 4405 of capacitor 3900. Aluminum is a material suitable for use in such an extruded condenser. The 4405 extruded microchannel flat plate extends between a 4410 steam collector and a 4415 liquid collector. In addition, the 4420 corrugated fin provision is bonded (for example, with braze or epoxy) on both sides of the plate Flat 4405.

Fig. 46 is a cross-sectional view on one side of a 4600 heat transfer system, which is coupled to a 4605 cyclic heat exchange system. This view shows relative dimensions that provide for particularly compact packaging of the heat transfer system. heat. In this view, the 4610 fins are represented as being 90 degrees out of phase, for ease of illustration. In order to cool the heat rejection surface 4615 of the cyclic heat exchange system 4605, having a diameter of 10 cm, the 4620 evaporator has a thickness of 0.64 cm and the radial thickness of the condenser is 4.5 cm. This supplies the total size for the packaging (the combination of the 4600 heat transfer system and the 4605 cyclic heat exchange system) of 20 cm.

As discussed, the evaporator used in the heat transport system is equipped with a wick. Because the wick is used 10 within the evaporator of the heat transport system, the condenser can be positioned anywhere in relation to the evaporator and in relation to gravity. For example, the condenser can be positioned above the evaporator (in relation to a gravitational attraction), below the evaporator (in relation to a gravitational attraction) or adjacent to the evaporator, thus experiencing the same gravitational pull as the evaporator.

Other implementations are within the scope of the following claims.

Notably, the terms Stirling engine, Stirling heat transport system and Stirling Free Piston Cooler were referenced 20 in several implementations above. However, the characteristics and fundamental points described with respect to those implementations can also be applied to other motors capable of conversions between mechanical energy and thermal energy.

In addition, the characteristics and fundamental points described above can be applied to any heat engine, which is a thermodynamic system that can undergo a cycle, that is, a sequence of transformations that finally return it to its original state. If every transformation in the cycle is reversible, the cycle is reversible and heat transfers occur in the opposite direction and the degree of work performed changes from «« ri w t. ¹ hey t *

Ic> w e? <s »'J V * · ~>

signal. The simplest reversible cycle is a Camot cycle, which exchanges heat with two heat tanks.

Manufacturing

Referring to Fig. 47, a thermodynamic system 4700 includes a heat source, such as, for example, a cyclic heat exchange system 4705 and a heat transfer system 4710, thermally coupled to a part 4715 of the exchange system cyclic heat exchanger 4705. The heat transfer system 4710 is designed with a 4713 annular evaporator, such as, for example, the annular evaporator 1100 of Fig. 11. The 4713 evaporator is shaped to surround part 4715 of the heat exchange system. cyclic heat 4705, to reject heat from part 4715. The 4700 thermodynamic system also includes a 4720 fan, positioned to force air over the 4712 condenser of the 4710 heat transfer system, along a 5100 path (Fig. 51) and, thus, provide additional convection cooling.

With reference also to Figs. 48 - 51, the heat transfer system 4710 includes a liquid line 4800, which pumps liquid from condenser 4712 into evaporator 4713 and a steam line 4805 that feeds steam into condenser 4712. An examination _ 20 of the operation of a heat transport system is provided above and is not repeated here. The 4710 heat transfer system may also include a 4810 reservoir, coupled to steam line 4805 through a 4812 orifice, for additional pressure containment as needed. In particular, reservoir 4810 increases the volume of heat transfer system 25 4710, as also examined above.

As shown, the 4705 cyclic heat exchange system is cylindrical. The cyclic heat exchange system 4705 includes a cold side 4735, which is the heat acceptor, and a hot side which is the heat rejector or part 4715, which is surrounded by the 4713 evaporator.

With reference also to Fig. 52, the cold side 4735 of the cyclic heat exchange system 4705 can be thermally coupled to a reflector 4740 of a 4745 thermosiphon. The thermo siphon 4745 includes a 4750 cold side heat exchanger, which is configured to cool air inside the 4700 thermodynamic system, which is forced through the 4750 heat exchanger by a thermo-siphon fan (not shown in Figs. 50 and 52, but mounted adjacent to the 4750 heat exchanger). The thermosyphon fan blows air into the thermo-siphon along path 5000 and blows air out of the thermo-siphon along path 5005 (Fig. 50). The thermo-siphon includes a steam line 5200 from the reflector 4740 to the heat exchanger 4750 and a liquid line 5205 from the heat exchanger 4750 to the reflector 4740. The steam that is heated on the cold side 4735 flows through the heat exchanger from line 5200, where it is condensed and cooled by the thermo-siphon fan and the condensed liquid is taken up through line 5205 to the 4740 reflux.

With reference to Fig. 48 and also to Figs. 53A-E, the 4713 evaporator includes a wick subset 5300, surrounded by an external subset. The outer subassembly includes an outer ring or liquid barrier wall 5305 and a subcooler 5310. The subcooler 5310 is a fin formation that helps to dissipate heat from the liquid barrier wall 5305. The wick subset 5300 includes an inner ring or a vapor barrier wall 5315, such as, for example, the vapor barrier wall 1700 of Figs. 14A-H, 15A, 15B and 17A-D. The wick subset 5300 also includes a wick 5320, such as, for example, wick 1600 of Figures 14G, 14H and 16A-D. The vapor barrier wall 5315 includes vapor removal channels 5325, such as, for example, channels 1465 of Figures 14A-H, 15A, 15B and 17A-D. The vapor barrier wall 5315 is surrounded by the wick 5320.

As discussed above with respect to evaporator 1400, in one implementation, the wick 5320 and the vapor barrier wall 5315 are made of stainless steel. The 5320 wick has, before manufacture, a pore radius of about 9.8 micros, an external diameter of about 10.52 cm, an internal diameter of about 10.122 cm and a length of about 4.445 cm. The vapor barrier wall 5315 has, for example, 186 vapor removal channels 5325, with each channel 5325 formed as a semicircle having a radius of about 0.064 cm (Fig. 53B). The vapor barrier wall 5315 is about 0.089 cm thick.

The liquid barrier wall 5305 includes one or more liquid flow channels 5330, such as, for example, the liquid flow channel 1505 of wall 1500 of Figs. 14A-H. The fluid flow channels 5330 are formed along an internal surface of the wall 5305. The liquid barrier wall 5305 can also include cooling grooves 5335, formed along an external surface of the wall 5305, to provide convection cooling. additional for the liquid. The liquid barrier wall 5305 also includes a liquid orifice 5340, for receiving liquid from the liquid line 4800.

The liquid barrier wall 5305 can be made of stainless steel and can have seven channels of liquid flow 5330, with each channel 5330 having a radius of about 0.076 cm. The liquid barrier wall 5305 may have, before manufacture, an outer diameter of about 10.77 cm, an inner diameter of about 10.49 cm and a length of about 4.293 cm.

The sub-cooler 5310 includes a fin formation 5345, which surrounds an inner body 5350. The fins 5345 and inner body 5350 include openings 5355 for steam line 4805 and an opening 5360 for reservoir orifice 4812. The sub - 5310 cooler can be made of copper or any other suitable heat transfer metal. The 5310 subcooler can be designed, for example, with 119 fins. The inner body 5350 can have an outer diameter of, for example, 10,795 cm and be 3,988 cm long.

The 4713 evaporator also includes a reservoir plate 5365 (Fig. 53E), which is sealed on one edge of the liquid barrier wall 5305, as shown in more detail below. Reservoir plate 5365 is in fluid communication with reservoir 4810 and steam line 4805.

With reference to Fig. 54, a procedure 5400 is performed to manufacture the thermodynamic system 4700 of Fig. 47. Initially, the wick subset 5300 (which is the vapor barrier wall 5315 and the wick 5320) is prepared (step 5405 ). Then the liquid barrier wall 5305 is prepared (step 5410). The external subset (i.e., the liquid barrier wall 5305 and the subcooler 5310) is then prepared (step 5415) and the prepared external subset is joined with the wick subset to form the evaporator body (step 5420 ). Then, the evaporator body is finished to form the evaporator 4713 (step 5425) and the evaporator 4713 is coupled to the heat source (for example, the cyclic heat exchange system) (step 5430).

With reference to Fig. 55, a procedure 5405 is performed to prepare the wick subset 5300. Initially, the wick subset 5300 is assembled (step 5500). The assembly of the wick subset 5300 includes forming the vapor removal channels 5325, the material that will form the vapor barrier wall 5315 (Figs. 15A and 15B show the material used to form the vapor barrier wall 5315). For example, the vapor removal channels 5325 can be attacked photochemically within the material. The photochemically attacked material is rolled into a cylindrical shape and then welded at its edges to form the vapor barrier wall 5315. The 5320 wick is formed of a wick material, which is cut to a suitable length, rolled and formed into a bulk of the vapor barrier wall 5315. The wick 5320 is mechanically squeezed onto the vapor barrier wall 5315, to improve the fit between the wick 5320 and the vapor barrier wall 5315 and to reduce the space between the wick 5320 and the wall 5315, thereby improving the thermal transfer between the 5320 fuse and the 5315 vapor barrier wall. Then, - the fuse is welded at its seams to form a complete cylindrical shape.

In another implementation, the wick 5325 can also be sintered on the vapor barrier wall 5315, by heating the wick 5320 and wall 5315, at a temperature that is below the melting point of the materials used on the wick 5320 and on the wall 5315. During this heating, pressure can be applied to the fuse 5320 and the wall 5315, to help form the sintered bond. Sintering can be used to further improve the heat transfer between the 5320 wick and the 5315 vapor barrier wall.

After the wick subset 5300 is assembled (step 5500), the wick subset is thermally contracted to ensure that it is as round as necessary to properly join with the external subset in step 5420. Initially, during the thermal contraction process , the wick subset 5300 is placed in an oven _ 20 5600 (shown in Figs. 56A and B), which heats the subset to 460 ° C ±

15 ° C. Then, as also shown in Fig. 56A, a temperature control block 5605 is cooled to a temperature where its outside diameter is less than the inside diameter of the heated sub-assembly 5300 (step 5510). The temperature control block 5605 can be cooled using liquid nitrogen. With reference also to Figs. 56C and D, the cooled temperature control block 5605 is inserted into the heated wick subset 5300 (step 5515). Then, as shown in Fig. 56E, at the insertion of the control block 5605 (step 5515), the heat is removed from the wick subset 5300 and the cooling is removed from the temperature control block 5605, thus allowing the temperature of the subset of wick 5300 stabilizes (step 5520). After the temperature of the wick subset 5300 has stabilized (step 5520), the wick subset 5300 is inspected to ensure that the outer diameter of the wick subset 5300 is as round as necessary (step 5525).

With reference to Fig. 57, a procedure 5410 is performed to prepare the liquid barrier wall 5305. Initially, the liquid barrier wall 5305 is formed (step 5700) by rolling the material and then welding the material at the seam to form an almost cylindrical shape (Fig. 53C). Then, the welded material is photo-cauterized on its internal surface, to form the 5330 liquid flow channels and is photochemically attacked on its outer surface, to form the 5335 cooling grooves (Fig. 53C).

The formed liquid barrier wall 5305 is thermally contracted, to ensure that it becomes as round as necessary to properly prepare the external subassembly in step 5415. Initially, during the thermal contraction process, the liquid barrier wall 5305 is heated (step 5705). In one implementation, the liquid barrier wall 5305 is placed in a 5800 oven (shown in Figs. 58A and B), which heats the wall 5305 to 460 ° C ± 15 ° C. Then, as also shown in Fig. 58A, a temperature control block 5805 is cooled to a temperature where its outside diameter is less than the inside diameter of the vapor barrier wall 5305 (step 5710). The 5805 temperature control block can be cooled using liquid nitrogen. With reference also to Figs. 58C and D, the cooled temperature control block 5605 is inserted into the heated liquid barrier wall 5305 (step 5715). Then, as shown in Fig. 58E, when inserting control block 5805, heat is removed from the liquid barrier wall

5305 and the cooling is removed from the temperature control block 5805, thus allowing the temperature of the liquid barrier wall 5305 to stabilize (step 5720). After the temperature of the liquid barrier wall 5305 has stabilized, the liquid barrier wall 5305 is inspected to ensure that the outer diameter of the wall 5305 is as round as necessary (step 5725).

With reference to Fig. 59, a procedure 5414 is performed to prepare the external subassembly, that is, the liquid barrier wall 5305 and the sub-chiller 5310. Initially, the sub-chiller 5310 is heated (step 5900). In one implementation, sub-chiller 5310 is placed in an oven 6000 (shown in Figs. 60A and B), which heats sub-chiller 5310 to 235 ° C ± 15 ° C. Then, as also shown in Figs. 60A and B, the temperature control block 5805 and the liquid barrier wall 5305, which is thermally coupled to the block 5805, are cooled to a temperature where the outer diameter of the wall 5305 is less than the inner diameter of the sub -5310 cooler (step 5905). For example, the liquid barrier wall 5305 can be cooled to below about -120 ° C. The 5805 temperature control block can be cooled using liquid nitrogen. With reference also to Fig. 60C, the cooled temperature control block 5805 and the liquid barrier wall 5305 are inserted into the heated sub-chiller 5310, to form the external subset 6001 (step 5910). Then, as shown in Fig. 60D, at the insertion of the control block 5805 (step 5910), the heat is removed from the subcooler 5310 and the cooling is removed from the temperature control block 5805, thus allowing the temperature of the external subset 6001 to stabilize (step 5915). After the temperature of the external subset 6001 has stabilized (step 5915), the temperature control block 5805 is removed from the liquid barrier wall 5305 (step 5920), as shown in Fig. 60E.

Then, with reference also to Figs. 60F and G, several parts are mounted on the external subassembly 6001 (step 5925). First, as shown in Fig. 60F, a reservoir plate 6005 is attached to the liquid barrier wall 5305 and is adjacent to sub-chiller 5310. Plate 6005 can be attached by welding it to wall 5305, to form a seam of weld 6010. Second, as shown in Fig. 60G, the liquid line 4800 is sealed to the liquid barrier wall 5305 by, for example, welding. After assembly is complete, the outer subset and all welded joints are inspected to ensure that the seams are sealed and that the inner diameter of the wall 5305 is as round as necessary to inter-fit with the wick subset later in the process ( step 5930).

With reference to Fig. 61, a procedure 5420 is performed to join the outer subset 6001 with the wick subset, to form the evaporator body. In general, during this process, the outer subset 6001 is thermally contracted in the wick subset 5300, to ensure that the parts are properly joined. Initially, the external subset 6001 is heated (step 6100). In one implementation, the external subset 6001 is placed in an oven 6200 (shown in Fig. 62A), which heats the external subset 6001 to 350 ° C ± 10 ° C. Then, as also shown in Fig. 62B, the temperature control block 5605 is cooled to a temperature where the outer diameter of the wick subset 5300 is less than the inner diameter of the heated outer subset 6001 (step 6105). The temperature control block 5605 can be cooled using liquid nitrogen. With reference also to Figs. 62C and D, the cooled temperature control block 5605 and the wick subset 5300 are inserted into the heated external subset 6001, to form the evaporator body 6101 (step 6110). Then, as shown in Fig. 62D, when inserting control block 5605 and wick subset 5300, heat is removed from external subset 6001 and cooling is removed from temperature control block 5605, thus allowing the temperature evaporator body 6101 to stabilize (step 6115). Referring also to Fig. 62E, after the temperature of the evaporator body 6101 has stabilized, the evaporator body 6101 can be inspected to ensure that the thermal contraction process has been successful.

With reference to Fig. 63, a procedure 5425 is performed to terminate the evaporator body 6101, to form the evaporator 4713. With reference to Figs. 49 and 64, several parts are now mounted on the evaporator body 6101 (step 6300). For example, a volume plate 6400 is added to the liquid barrier wall 5305 and the fuse 5320 and tubes are welded to reservoir plate 6005 and volume plate 6400. Reservoir 4810 is welded to reservoir plate 6005 and a wall of vapor barrier 6405 is welded on reservoir plate 6005 and wick subset 5300. Lids 6410 and 6415 are placed on volume plate 6400 and vapor barrier wall 6405, respectively. Then, the evaporator body 6101 is inspected and tested (step 6305) and then additional parts are attached to the evaporator body 6101 (step 6310). For example, steam line 4805 is welded to cap 6410 and cap 6410 is machined as needed, due to possible distortions during welding. Cap 6410 is welded to volume plate 6400 and vapor barrier wall 5315 and cap 6415 is welded to reservoir plate 6005 and vapor barrier wall 5315. Then, the evaporator body 6101 is inspected for leaks ( step 6315).

With reference to Fig. 65, a 5430 procedure is performed to couple the 4713 evaporator to the heat source or 4705 cyclic heat exchange system. Initially, an outside diameter of the heat source is machined as needed (step 6500) to ensure that the 4713 evaporator fits

on the heat source. Then, with reference also to Figs. 66A and B, the evaporator 4713 is prepared (step 6505) by welding the vapor and liquid lines to the evaporator body and then aligning the evaporator 4713 with the 4705 system, using a suitable alignment system.

Then, the evaporator 4713 is thermally contracted over the 4705 system, to ensure that the parts are properly joined. The 4713 evaporator is initially heated (step 6510). In one implementation, the 4713 evaporator is placed in a 6600 oven (shown in Figs. 66A and B), which heats the 4713 evaporator to about 375 ° C. Then the system 4705 and, in particular, the hot end 4715 are cooled to a temperature where the outside diameter of the hot end 4715 is less than the inside diameter of the heated evaporator 4713 (step 6515). The 4705 system can be cooled using liquid nitrogen. The cooled system 4705 is inserted into the heated evaporator 4713 (step 6520). Upon insertion of the cooled 4705 system, heat is removed from the 4713 evaporator and the cooling is removed from the 4705 system, thus allowing the temperature of the 4713 evaporator and the 4705 system to stabilize (step 6525).

With reference also to Fig. 47, after the temperature has stabilized (step 6525), evaporator 4713 and system 4705 are removed from the alignment and installation of the oven and heat transfer system 4710 is carried out (step 6530) . For example, liquid line 4800 and steam line 4805 are connected to condenser 4712. Heat transfer system 4710 and cyclic heat exchange system 4705 are then installed in housing 5090, as shown in Figs. 50 and 52 (step 6535).

Other implementations are within the scope of the following claims. For example, the wick subset 5300 can be mounted in step 5500 by thermally contracting the wick 5320 on the vapor barrier wall 5315. In this implementation, the wick 5320 is formed of a wick material, which is cut to length suitable, rolled into a cylindrical shape and then welded at its joining edges to form a cylinder. The cylindrical wick 5320 is then heated and placed on the vapor barrier wall 5315. After the cylindrical wick 5320 cools, a thermal interface is formed between the 5320 wick and the vapor barrier wall 5315. At this point, sintering can then be performed. used to further improve the heat transfer between the 5320 wick and the 5315 vapor barrier wall.

The parts of the wick subassembly and the external subassembly can be made of other materials, as long as thermal contact can be achieved with these other materials. For example, the sub-chiller 5310 can be made of stainless steel or the liquid barrier wall 5305 and the vapor barrier wall 5315 can be made of copper.

Heat can be removed from wick subset 5300 and cooling can be removed from control block 5605 prior to insertion of control block 5605. Likewise, heat can be removed from liquid barrier wall 5305 and cooling can be removed control block 5805 before insertion of control block 5805 into the liquid barrier wall 5305. Similarly, heat can be removed from external subset 6011 and cooling can be removed from temperature control block 5605 before insertion control block 5605 and wick subset 5300 within external subset 6001. Finally, heat can be removed from evaporator 4713 and cooling can be removed from system 4705 prior to insertion of system 4705 into heated evaporator 4713.

Claims (16)

1. Method for producing an evaporator (1400), characterized by the fact that it comprises the steps of: orient a vapor barrier wall (1700) so that a heat absorbing surface of the vapor barrier wall (1700) defines at least part of an outer surface of the evaporator (1400), the outer surface being configured to receive heat; orienting a liquid barrier wall (1500) adjacent to the vapor barrier wall (1700), wherein the liquid barrier wall (1500) has a surface configured to confine liquid; positioning a wick (1600) between the vapor barrier wall (1700) and the liquid barrier wall (1500); wherein at least one of the orienting a vapor barrier wall (1700), orienting a liquid barrier wall (1500) and positioning the wick includes defining a vapor removal channel (1465) on the vapor barrier wall (1700) ) at an interface between the wick (1600) and the vapor barrier wall (1700); and wherein at least one of orienting a vapor barrier wall, orienting a liquid barrier wall (1500) and positioning the wick includes defining a liquid flow channel (1505), between the liquid barrier wall (1500 ) and the primary wick (1600). 2. Method according to claim 1, characterized in that it further comprises forming the vapor barrier wall (1700) and forming the liquid barrier wall (1500). 3. Method according to claim 2, characterized in that it forms the vapor barrier wall (1700) includes forming the vapor barrier wall (1700) in a planar shape and forming the liquid barrier wall (1500 ) includes forming the liquid barrier wall (1500) in a planar shape. 4. Method according to claim 2, characterized in that forming the vapor barrier wall (1700) includes forming the vapor barrier wall Petition 870190052371, of June 4, 2019, p. 5/13 (1700) in an annular shape and forming the liquid barrier wall (1500) includes forming the liquid barrier wall (1500) in an annular shape. 5. Method, according to claim 4, characterized by the fact that positioning the wick includes thermally contracting the wick (1600) on the vapor barrier wall (1700). 6. Method according to claim 4, characterized by the fact that positioning the wick (1600) includes thermally contracting the liquid barrier wall (1500) on the wick. 7. Method according to claim 1, characterized in that positioning includes positioning the wick (1600) between the vapor barrier wall (1700) and the liquid confinement surface of the liquid barrier wall (1500). 8. Method, according to claim 1, characterized in that it also comprises orienting a sub-cooler (5310) adjacent to the liquid barrier wall (1500). 9. Method according to claim 8, characterized by the fact that orienting the sub-cooler (5310) includes thermally contracting the sub-cooler (5310) on the liquid barrier wall (1500). 10. Method, according to claim 1, characterized by the fact that it also comprises: forming the vapor barrier wall (1700) and electrochemically attacking the vapor removal channel within the vapor barrier wall (1700). 11. Method according to claim 1, characterized in that it also comprises forming the vapor barrier wall (1700) and machining the vapor removal channel within the vapor barrier wall (1700). 12. Method according to claim 1, characterized in that it further comprises forming the vapor barrier wall (1700) and photochemically attacking the vapor removal channel within the vapor barrier wall (1700). Petition 870190052371, of June 4, 2019, p. 6/13 Method according to claim 1, characterized in that it further comprises forming the vapor barrier wall (1700) by rolling up a vapor barrier material in a cylindrical shape and sealing the joining edges of the vapor barrier material steam. 5 14. Method according to claim 1, characterized in that it further comprises forming the liquid barrier wall (1500) by winding a liquid barrier material in a cylindrical shape and sealing the joining edges of the barrier material of liquid. 15. Method, according to claim 1, characterized by the fact that 10 orienting the liquid barrier wall (1500) includes thermally contracting the liquid barrier wall on the wick (1600). 16. Method, according to claim 1, characterized by the fact that it also comprises: form the liquid barrier wall (1500) and attack photochemically 15 is the liquid flow channel (1505) within the liquid barrier wall (1500).